Abstract: An active device array substrate and a fabricating method thereof are provided. A first patterned conductive layer including separated scan line patterns is formed on a substrate. Each scan line pattern includes a first and second scan lines adjacent to each other. Both the first and the second scan lines have first and second contacts. An open inspection on the scan line patterns is performed. Channel layers are formed on the substrate. A second patterned conductive layer including data lines interlaced with the first and second scan lines, sources and drains located above the channel layers, and connectors is formed on the substrate. The sources electrically connect the data lines correspondingly. At least one of the connectors electrically connects the first and second scan lines, so as to form a loop in each scan line pattern. Pixel electrodes electrically connected to the drains are formed.

Abstract: A ring structure for chip packaging comprises a frame portion adaptable to bond to a substrate and at least one corner portion. The frame portion surrounds a semiconductor chip and defines an inside opening, and the inside opening exposes a portion of a surface of the substrate. The at least one corner portion extends from a corner of the frame portion toward the chip, and the corner portion is free of a sharp corner.

Abstract: A board-level package includes a printed circuit board, a semiconductor die package mounted on the printed circuit board, a tuned mass structure, and a support structure mounted to the printed circuit board and supporting the tuned mass structure.

Abstract: Flip chip packages having warpage control and methods for fabricating such packages are described. In one embodiment, the flip chip package comprises a package substrate; a chip coupled to the package substrate; and a ring structure coupled to the package substrate and positioned laterally around the periphery of the chip so that a surface of the chip is exposed, wherein the ring structure comprises one or more compressive members, each of the one or more compressive members compressively opposed to a surface of the package substrate to counter or absorb stresses in the package substrate.

Abstract: In a package structure, a stiffener ring is over and bonded to a top surface of a first package component. A second package component is over and bonded to the top surface of the first package component, and is encircled by the stiffener ring. A metal lid is over and bonded to the stiffener ring. The metal lid has a through-opening.

Abstract: An integrated circuit chip package is described. The integrated circuit package comprises a substrate, a chip attached to the substrate, and a heat spreader mounted over the chip for sealing the chip therein. The heat spreader includes a thermally-conductive element having a side opposed to the top of the chip for transmitting heat away from the chip to the heat spreader, and a compliant element having a first portion attached to and positioned around the periphery of the thermally-conductive element and a second portion affixed to a surface of the substrate.

Abstract: A check valve has a valve body, a piston and a spring. The valve body has a tube, a nozzle and a valve seal. The tube has a sealing protrusion and an inner surface. The sealing protrusion is formed around the inner surface of the tube. The nozzle is combined with the tube and has an insert hole and multiple outlets. The valve seal abuts a shoulder of the sealing protrusion. The piston is mounted in the valve body and has a shaft, a sealing ring and a plug. The shaft is mounted through the insert hole. The sealing ring is mounted in the sealing groove. The plug is a conic frustum and is mounted on a plug end of the shaft. The spring is mounted around the shaft. In operation, the check valve regulates outflow volume under varying pressure to prevent a waste of water.

Abstract: An active device array substrate and a fabricating method thereof are provided. A first patterned conductive layer including separated scan line patterns is formed on a substrate. Each scan line pattern includes a first and second scan lines adjacent to each other. Both the first and the second scan lines have first and second contacts. An open inspection on the scan line patterns is performed. Channel layers are formed on the substrate. A second patterned conductive layer including data lines interlaced with the first and second scan lines, sources and drains located above the channel layers, and connectors is formed on the substrate. The sources electrically connect the data lines correspondingly. At least one of the connectors electrically connects the first and second scan lines, so as to form a loop in each scan line pattern. Pixel electrodes electrically connected to the drains are formed.

Abstract: Flip chip packages having warpage control and methods for fabricating such packages are described. In one embodiment, the flip chip package comprises a package substrate; a chip coupled to the package substrate; and a ring structure coupled to the package substrate and positioned laterally around the periphery of the chip so that a surface of the chip is exposed, wherein the ring structure comprises one or more compressive members, each of the one or more compressive members compressively opposed to a surface of the package substrate to counter or absorb stresses in the package substrate.

Abstract: A method for making an optical device includes the steps of: rubbing an orienting film so as to stretch the molecular structure thereof and so as to permit the molecular units of the molecular structure to be aligned along a first axis and to permit the orienting space between each adjacent pair of the molecular units of the molecular structure to be oriented in a direction parallel to a second axis; and forming an optical anisotropical layer on the orienting film by applying a liquid crystal film of rod-like molecules on the orienting film which orients the rod-like molecules by virtue of spatial effect of the molecular units and the orienting spaces.

Abstract: A flip chip microelectronic package having a heat spreader is provided. In one embodiment, the microelectronic package comprises a die having a first surface and a second surface, the first surface being coupled to a substrate; a thermal interface material disposed in thermal conductive contact with the second surface of the die; and a heat spreader adapted for dissipating heat from the die, the heat spreader disposed in thermal conductive contact with the thermal interface material. The heat spreader includes a lid having an inner chamber therein defined by a first wall and a second wall, the second wall securely joined to the first wall to seal the chamber, the lid being mounted to the substrate and a wick layer positioned in the chamber.

Abstract: A check valve has a valve body, a piston and a spring. The valve body has a tube, a nozzle and a valve seal. The tube has a sealing protrusion and an inner surface. The sealing protrusion is formed around the inner surface of the tube. The nozzle is combined with the tube and has an insert hole and multiple outlets. The valve seal abuts a shoulder of the sealing protrusion. The piston is mounted in the valve body and has a shaft, a sealing ring and a plug. The shaft is mounted through the insert hole. The sealing ring is mounted in the sealing groove. The plug is a conic frustum and is mounted on a plug end of the shaft. The spring is mounted around the shaft. In operation, the check valve regulates outflow volume under varying pressure to prevent a waste of water.

Abstract: A switchable showerhead has a body, a switching device, a water-spraying device and an operating device. The body has a mounting recess, a front through hole, a rear through hole, a mounting chamber, a connecting frame, an inserting hole and an inner tube. The switching device is mounted in the body and has a holding element, a front guide base, a rear guide base and a valve stem. The valve stem is movably mounted in the guide bases. The water-spraying device is mounted in the body, communicates with the switching device and has a shell and a cover. The shell is mounted in the mounting recess. The cover is mounted on the shell and has an inserting tube and multiple spouts. The operating device is mounted on the body, is connected to the switching device and has an operating panel connected to the valve stem.

Abstract: A switchable showerhead has a body, a switching device, a water-spraying device and an operating device. The body has a mounting recess, a front through hole, a rear through hole, a mounting chamber, a connecting frame, an inserting hole and an inner tube. The switching device is mounted in the body and has a holding element, a front guide base, a rear guide base and a valve stem. The valve stem is movably mounted in the guide bases. The water-spraying device is mounted in the body, communicates with the switching device and has a shell and a cover. The shell is mounted in the mounting recess. The cover is mounted on the shell and has an inserting tube and multiple spouts. The operating device is mounted on the body, is connected to the switching device and has an operating panel connected to the valve stem.

Abstract: A method for making an optical device includes the steps of: rubbing an orienting film so as to stretch the molecular structure thereof and so as to permit the molecular units of the molecular structure to be aligned along a first axis and to permit the orienting space between each adjacent pair of the molecular units of the molecular structure to be oriented in a direction parallel to a second axis; and forming an optical anisotropical layer on the orienting film by applying a liquid crystal film of rod-like molecules on the orienting film which orients the rod-like molecules by virtue of spatial effect of the molecular units and the orienting spaces.

Abstract: A method for making an optical device includes the steps of: rubbing an orienting film so as to stretch the molecular structure thereof and so as to permit the molecular units of the molecular structure to be aligned along a first axis and to permit the orienting space between each adjacent pair of the molecular units of the molecular structure to be oriented in a direction parallel to a second axis; and forming an optical anisotropical layer on the orienting film by applying a liquid crystal film of rod-like molecules on the orienting film which orients the rod-like molecules by virtue of spatial effect of the molecular units and the orienting spaces.

Abstract: An anti-glare device includes a transparent anti-glare film incorporating a plurality of water-soluble scattering particles distributed therein. A method for making the anti-glare device includes the steps of: a) mixing a transparent resin solution with an aqueous solution of water-soluble colloid to form an emulsion containing a plurality of water-soluble colloidal particles distributed in the emulsion; b) applying the emulsion on a transparent substrate to form a preliminary film on the substrate; and c) curing the preliminary film to form a transparent anti-glare film on the transparent substrate, the transparent anti-glare film including a plurality of the colloidal particles distributed within the transparent anti-glare film and on a surface of the transparent anti-glare film.

Abstract: An optical compensator includes a C-plate adapted to be coupled to a liquid crystal cell and made from a polymer. The C-plate has a layer thickness ranging from 5 to 60 ?m. The polymer is polyvinyl alcohol, has a polymerization degree greater than 2000 and less than 5000, and is cross-linked so that the C-plate has an optical axis substantially parallel to the direction of normally incident light, and so that the C-plate has a plate retardation, along the layer thickness of the C-plate, greater than 60 nm.

Abstract: Epitaxial thin films are formed on textured substrates. An electrode is formed on the exposed surface of the thin film; the textured substrate removed, and second electrode is formed on the thin film on the side opposite the first electrode. A capacitor is thereby formed.

Abstract: Epitatial thin films for use as buffer layers for high temperature superconductors, electrolytes in solid oxide fuel cells (SOFC), gas separation membranes or dielectric material in electronic devices, are disclosed. By using CCVD, CACVD or any other suitable deposition process, epitaxial films having pore-free, ideal grain boundaries, and dense structure can be formed. Several different types of materials are disclosed for use as buffer layers in high temperature superconductors. In addition, the use of epitaxial thin films for electrolytes and electrode formation in SOFCs results in densification for pore-free and ideal gain boundary/interface microstructure. Gas separation membranes for the production of oxygen and hydrogen are also disclosed. These semipermeable membranes are formed by high-quality, dense, gas-tight, pinhole free sub-micro scale layers of mixed-conducting oxides on porous ceramic substrates. Epitaxial thin films as dielectric material in capacitors are also taught herein.