Abstract: A switchable showerhead has a body, a switching device, a water-spraying device and an operating device. The body has a mounting recess, a front through hole, a rear through hole, a mounting chamber, a connecting frame, an inserting hole and an inner tube. The switching device is mounted in the body and has a holding element, a front guide base, a rear guide base and a valve stem. The valve stem is movably mounted in the guide bases. The water-spraying device is mounted in the body, communicates with the switching device and has a shell and a cover. The shell is mounted in the mounting recess. The cover is mounted on the shell and has an inserting tube and multiple spouts. The operating device is mounted on the body, is connected to the switching device and has an operating panel connected to the valve stem.

Abstract: A switchable showerhead has a body, a switching device, a water-spraying device and an operating device. The body has a mounting recess, a front through hole, a rear through hole, a mounting chamber, a connecting frame, an inserting hole and an inner tube. The switching device is mounted in the body and has a holding element, a front guide base, a rear guide base and a valve stem. The valve stem is movably mounted in the guide bases. The water-spraying device is mounted in the body, communicates with the switching device and has a shell and a cover. The shell is mounted in the mounting recess. The cover is mounted on the shell and has an inserting tube and multiple spouts. The operating device is mounted on the body, is connected to the switching device and has an operating panel connected to the valve stem.

Abstract: A method for making an optical device includes the steps of: rubbing an orienting film so as to stretch the molecular structure thereof and so as to permit the molecular units of the molecular structure to be aligned along a first axis and to permit the orienting space between each adjacent pair of the molecular units of the molecular structure to be oriented in a direction parallel to a second axis; and forming an optical anisotropical layer on the orienting film by applying a liquid crystal film of rod-like molecules on the orienting film which orients the rod-like molecules by virtue of spatial effect of the molecular units and the orienting spaces.

Abstract: A method for making an optical device includes the steps of: rubbing an orienting film so as to stretch the molecular structure thereof and so as to permit the molecular units of the molecular structure to be aligned along a first axis and to permit the orienting space between each adjacent pair of the molecular units of the molecular structure to be oriented in a direction parallel to a second axis; and forming an optical anisotropical layer on the orienting film by applying a liquid crystal film of rod-like molecules on the orienting film which orients the rod-like molecules by virtue of spatial effect of the molecular units and the orienting spaces.

Abstract: An anti-glare device includes a transparent anti-glare film incorporating a plurality of water-soluble scattering particles distributed therein. A method for making the anti-glare device includes the steps of: a) mixing a transparent resin solution with an aqueous solution of water-soluble colloid to form an emulsion containing a plurality of water-soluble colloidal particles distributed in the emulsion; b) applying the emulsion on a transparent substrate to form a preliminary film on the substrate; and c) curing the preliminary film to form a transparent anti-glare film on the transparent substrate, the transparent anti-glare film including a plurality of the colloidal particles distributed within the transparent anti-glare film and on a surface of the transparent anti-glare film.

Abstract: An optical compensator includes a C-plate adapted to be coupled to a liquid crystal cell and made from a polymer. The C-plate has a layer thickness ranging from 5 to 60 ?m. The polymer is polyvinyl alcohol, has a polymerization degree greater than 2000 and less than 5000, and is cross-linked so that the C-plate has an optical axis substantially parallel to the direction of normally incident light, and so that the C-plate has a plate retardation, along the layer thickness of the C-plate, greater than 60 nm.

Abstract: Epitaxial thin films are formed on textured substrates. An electrode is formed on the exposed surface of the thin film; the textured substrate removed, and second electrode is formed on the thin film on the side opposite the first electrode. A capacitor is thereby formed.

Abstract: Epitatial thin films for use as buffer layers for high temperature superconductors, electrolytes in solid oxide fuel cells (SOFC), gas separation membranes or dielectric material in electronic devices, are disclosed. By using CCVD, CACVD or any other suitable deposition process, epitaxial films having pore-free, ideal grain boundaries, and dense structure can be formed. Several different types of materials are disclosed for use as buffer layers in high temperature superconductors. In addition, the use of epitaxial thin films for electrolytes and electrode formation in SOFCs results in densification for pore-free and ideal gain boundary/interface microstructure. Gas separation membranes for the production of oxygen and hydrogen are also disclosed. These semipermeable membranes are formed by high-quality, dense, gas-tight, pinhole free sub-micro scale layers of mixed-conducting oxides on porous ceramic substrates. Epitaxial thin films as dielectric material in capacitors are also taught herein.

Abstract: A method for making an optical device includes the steps of: rubbing an orienting film so as to stretch the molecular structure thereof and so as to permit the molecular units of the molecular structure to be aligned along a first axis and to permit the orienting space between each adjacent pair of the molecular units of the molecular structure to be oriented in a direction parallel to a second axis; and forming an optical anisotropical layer on the orienting film by applying a liquid crystal film of rod-like molecules on the orienting film which orients the rod-like molecules by virtue of spatial effect of the molecular units and the orienting spaces.

Abstract: An optical compensator includes a C-plate adapted to be coupled to a liquid crystal cell and made from a polymer. The C-plate has a layer thickness ranging from 5 to 60 ?m. The polymer is polyvinyl alcohol, has a polymerization degree greater than 2000 and less than 5000, and is cross-linked so that the C-plate has an optical axis substantially parallel to the direction of normally incident light, and so that the C-plate has a plate retardation, along the layer thickness of the C-plate, greater than 60 nm.

Abstract: Epitaxial thin films for use as buffer layers for high temperature superconductors, electrolytes in solid oxide fuel cells (SOFC), gas separation membranes or dielectric material in electronic devices, are disclosed. By using CCVD, CACVD or any other suitable deposition process, epitaxial films having pore-free, ideal grain boundaries, and dense structure can be formed. Several different types of materials are disclosed for use as buffer layers in high temperature superconductors. In addition, the use of epitaxial thin films for electrolytes and electrode formation in SOFCs results in densification for pore-free and ideal grain boundary/interface microstructure, Gas separation membranes for the production of oxygen and hydrogen are also disclosed. These semipermeable membranes are formed of high-quality, dense, gas-tight, pinhole free sub-micron scale layers of mixed-conducting oxides on porous ceramic substrates. Epitaxial thin films as dielectric material in capacitors are also taught herein.

Abstract: Resistive materials have resistivities that are axis dependent are provided. Such resistive materials having a resistivity in a first direction and a very different resistivity in an orthogonal direction. These resistive materials are particularly suitable for use as resistors embedded in printed wiring boards.

Abstract: Thin layer capacitors are formed from a first flexible metal layer, a dielectric layer between about 0.03 and about 2 microns deposited thereon, and a second flexible metal layer deposited on the dielectric layer. The first flexible metal layer may either be a metal foil, such as a copper, aluminum, or nickel foil, or a metal layer deposited on a polymeric support sheet. Depositions of the layers is by or is facilitate by combustion chemical vapor deposition or controlled atmosphere chemical vapor deposition.

Abstract: Nanolaminates are formed by alternating deposition, e.g., by combustion chemical vapor deposition (CCVD), layers of resistive material and layers of dielectric material. Outer resistive material layers are patterned to form discrete patches of resistive material. Electrical pathways between opposed patches of resistive material on opposite sides of the laminate act as capacitors. Electrical pathways horizontally through resistive material layers, which may be connected by via plated holes, act as resistors.

Abstract: Resistive materials having resistivities that are axis dependent are provided. Such resistive materials having a resistivity in a first direction and a very different resistivity in an orthogonal direction. These resistive materials are particularly suitable for use as resistors embedded in printed wiring boards.

Abstract: A method is provided for forming a patterned layer of resistive material in electrical contact with a layer of electrically conducting material. A three-layer structure is formed which comprises a metal conductive layer, an intermediate layer formed of material which is degradable by a chemical etchant, and a layer of resistive material of sufficient porosity such that the chemical etchant for said intermediate layer may seep through the resistive material and chemically degrade said intermediate layer so that the resistive material may be ablated from said conductive layer wherever the intermediate layer is chemically degraded. A patterned photoresist layer is formed on the resistive material layer. The resistive material layer is exposed to the chemical etchant for said intermediate layer so that the etchant seeps through the porous resistive material layer and degrades the intermediate layer. Then, portions of the resistive material layer are ablated away wherever the intermediate layer has been degraded.

Abstract: Thin layer capacitors are formed from a first flexible metal layer, a dielectric layer between about 0.03 and about 2 microns deposited thereon, and a second flexible metal layer deposited on the dielectric layer. The first flexible metal layer may either be a metal foil, such as a copper, aluminum, or nickel foil, or a metal layer deposited on a polymeric support sheet. Depositions of the layers is by or is facilitate by combustion chemical vapor deposition or controlled atmosphere chemical vapor deposition.

Abstract: Thin layer capacitors are formed from a first flexible metal layer, a dielectric layer between about 0.03 and about 2 microns deposited thereon, and a second flexible metal layer deposited on the dielectric layer. The first flexible metal layer may either be a metal foil, such as a copper, aluminum, or nickel foil, or a metal layer deposited on a polymeric support sheet. Depositions of the layers is by or is facilitate by combustion chemical vapor deposition or controlled atmosphere chemical vapor deposition.

Abstract: In thin layer resistors comprising a patch of a layer of resistive material on an insulating substrate and means at spaced apart locations on the patch, the resistive material is formed of 95 to 99.5 wt % of a zero valence metal and between 5 and 0.5 wt % of a dielectric material.

Abstract: A method is provided for forming a patterned layer of resistive material in electrical contact with a layer of electrically conducting material. A three-layer structure is formed which comprises a metal conductive layer, an intermediate layer formed of material which is degradable by a chemical etchant, and a layer of resistive material of sufficient porosity such that the chemical etchant for said intermediate layer may seep through the resistive material and chemically degrade said intermediate layer so that the resistive material may be ablated from said conductive layer wherever the intermediate layer is chemically degraded. A patterned photoresist layer is formed on the resistive material layer. The resistive material layer is exposed to the chemical etchant for said intermediate layer so that the etchant seeps through the porous resistive material layer and degrades the intermediate layer. Then, portions of the resistive material layer are ablated away wherever the intermediate layer has been degraded.