Abstract: A method for fabricating a transistor device including the following processes. First, a semiconductor substrate having a first transistor region is provided. A low temperature deposition process is carried out to form a first tensile stress layer on a transistor within the first transistor region, wherein a temperature of the low temperature deposition process is lower than 300 degree Celsius (° C.). Then, a high temperature annealing process is performed, wherein a temperature of the high temperature annealing process is at least 150° C. higher than a temperature of the low temperature deposition process. Finally, a second tensile stress layer is formed on the first tensile stress layer, wherein the first tensile stress layer has a lower tensile stress than the second tensile stress layer.

Abstract: An antenna module includes a substrate, a main radiation structure, a strip-shaped radiation structure, a grounding structure, a shorting structure, a parasitic radiation structure and a metal radiation member. An acute angle is included between a first edge of the main radiation structure and a longitudinal edge of the substrate. The main radiation structure has a signal feeding portion and a connecting portion. The strip-shaped radiation structure is extended from a second edge of the main radiation structure. The shorting structure is U-shaped. A first end of the shorting structure is connected to the signal feeding portion and a second end of the shorting structure is connected to the grounding structure. The parasitic radiation structure is extended from the grounding structure and parallel to the first edge. A constant distance is between the parasitic radiation structure and the first edge. The metal radiation member is connected to the connecting portion.

Abstract: A method for measuring lens quality includes receiving and transmitting an image's information to a location module through an image collecting module. A location module partitions the image's information into a plurality of measure areas. An image processing module computes the Modulation Transfer Function (MTF) of each measure area. A comparing module compares the MTF with a predetermined MTF to determine quality of the lenses.

Abstract: A surveillance system, an image compression serializer and an image decompression deserializer are disclosed. The Surveillance System includes a video camera, a coaxial cable and a central control machine. The video camera provides a real time record and has an image compression serializer which compresses a digital image, captured by the video camera, down to a specific resolution and converts the digital image of the specific resolution into a serial format. The coaxial cable couples the image compression serializer to an image decompression deserializer of the central control machine. The digital image in the specific resolution and serial format is conveyed to the image decompression deserializer to be converted into a parallel format and decompressed to be video encoded.

Abstract: Packaging structures and methods for semiconductor devices are disclosed. In one embodiment, a substrate for packaging a semiconductor device includes a core substrate, an insulating material disposed over the core substrate, and conductive lines disposed in the insulating material. Contact pads are disposed over the insulating material and the conductive lines. The contact pads are disposed in an integrated circuit mounting region of the core substrate. A solder mask define (SMD) material is disposed over the insulating material. Portions of the contact pads are exposed through openings in the SMD material. A stress-relief structure (SRS) is disposed in the SMD material proximate the contact pads. The SRS is disposed entirely in the integrated circuit mounting region of the core substrate.

Abstract: A mobile communication device including a system ground plane, an antenna, a signal distributor, a transceiver and a sensing controller is provided. The antenna converts an electromagnetic wave to a radio-frequency signal. Besides, the antenna and the system ground plane form a sensing capacitor to detect an object and generate a detecting signal accordingly. The signal distributor is electrically connected to the antenna through a first connection terminal and a second connection terminal and guides the radio-frequency signal and the detecting signal from the antenna to a third connection terminal and a fourth connection terminal. The transceiver is electrically connected to the third connection terminal and processes the radio-frequency signal. The sensing controller is electrically connected to the fourth connection terminal and determines whether the object exists around the antenna according to the sensing signal.

Abstract: An antenna module is provided. The antenna module includes a first ground element, a body, a radiator and a parasitic element. The body is electrically connected to the first ground element. The radiator is connected to the body, wherein the radiator includes an extending portion, a bending portion and a terminal portion, and the bending portion is connected to the extending portion, and the terminal portion is connected to the bending portion. The parasitic element includes a parasitic extending portion and a parasitic conductive portion, wherein the parasitic extending portion is connected to the parasitic conductive portion, and the terminal portion and the parasitic extending portion is located on a same straight line, and the terminal portion is separated from the parasitic extending portion.

Abstract: A cell has a substrate, a first microstructure and an active layer. The first microstructure is formed on the substrate and has therein a first material with a concentration gradient toward one side of the substrate to provide a first built-in electric field. The active layer is mounted on the first microstructure so as to reduce recombination of electrons and holes in the cell.

Abstract: An electronic device is provided, which includes a display, a housing and a supporting structure. The display is disposed in the housing and a side of the housing opposite to the display has a storeroom. The supporting structure is disposed at the storeroom and has a flexible sheet, a first supporting-part and a second supporting-part. One end of the flexible sheet is fixed to the storeroom, the first supporting-part and the second supporting-part are respectively disposed at the flexible sheet, and the second supporting-part is bent relatively to the first supporting-part through the flexible sheet so as to provide the housing with a supporting force.

Abstract: The present invention discloses a double diffused drain metal oxide semiconductor (DDMOS) device and a manufacturing method thereof. The DDDMOS device is formed in a substrate, and includes: a drift region, a gate, a source, a drain, a dielectric layer, and a conductive layer. The drift region includes a first region and a second region. The gate is formed on the substrate, and overlaps the first region from top view. The source and drain are formed at both sides of the gate respectively, and the drain is located in the second region. The drain and the gate are separated by a portion of the second region from top view. The dielectric layer is formed by dielectric material on the gate and the second region. The conductive layer is formed by conductive material on the dielectric layer, and overlaps at least part of the second region from top view.

Abstract: The present invention relates to a multi-lens monitoring system for bed elevation around a pier according to the present invention comprises a container, a holder, a plurality of photographing units, and a processing module. The container is disposed on the pier; the holder is disposed inside the container; and the plurality of photographing units are disposed on the holder for photographing the bed under water and producing a monitoring image. The processing module is used for activating one of the plurality of photographing units for photographing the bed under water. The processing module also analyzes the monitoring image, gives the elevation variation of the bed, and transmits the elevation variation of the bed to a remote monitoring unit for real-timely monitoring and recording. During the monitoring process, the processing module will change activating one of the plurality of photographing units according to the monitoring image, and hence the electrical power can be saved.

Abstract: A sit/stand assistance includes a seat, a frame, a lifting device, and a driving device. This lifting device has a fixed portion connected to the frame and a movable portion pivoted with the seat so as to move the seat up or down. The driving device includes a link, a power portion, and a working rod. One of the power portion and the working rod is pivoted with the link. The other one is pivoted with the frame. When the power portion pushes the working rod, the working rod extends out so as to make said seat moving up or tilting. Hence, it can assist a user from a seated position to a standing position. So, it matches a user's continuous sit-to-stand motion. Plus, it can be directly applied on an existing flush toilet.

Abstract: A telescopic probe monitoring system for riverbed elevation monitoring at a bridge pier is revealed. The system includes a measurement module for measuring riverbed elevation under water and a control module. The measurement module includes a housing, a multi-layer tube, a driving member with scales, a photographic unit for capturing images, and a sensing unit. The control module controls the driving member to extend the multi-layer tube. Thus the sensing unit on the bottom of the multi-layer tube contacts the riverbed and then sends a sensing signal to the control module for stopping pushing the multi-layer tube and controlling the photographic unit to capture images of the driving member. According to the images and movement of the measurement module, the control module learns the riverbed elevation and sends the riverbed elevation to a remote monitor unit for real-time monitoring of the riverbed elevation.

Abstract: An electrical socket (100) comprises an insulative housing (1) and an optical module (3) arranged on the insulative housing (1), the insulative housing (1) comprises a plurality of electrical contacts (2) received therein to transmit electrical signal, the optical module (3) comprises a plurality of optical members (4) to transmit optical signal.

Abstract: An electrical connector includes an insulative housing, a plurality of contacts and an actuator. The insulative housing defines a front opening and a back receiving space. The receiving space defines a horizontal plane and a vertical plane connecting each other. The contacts include retaining portions, contacting portions and pressing portions. Each contacting portion and corresponding pressing portion extends oppositely from the retained portion. The actuator includes a base portion and several separate costal parts extending from the base portion. Adjacent costal parts are connected by a shaft and the pressing portions are against to the shaft. The actuator rotates around the shaft and defines a cambered surface at the costal parts, the cambered surface slides between the horizontal plane and the vertical plane.

Abstract: An electrical connector includes an insulative housing defining a mounting face, a pair of pivotal grooves on opposite sides of a rear end of the housing and a pair of locking recesses in front of the pivotal grooves respectively; a plurality of contacts arranged in the housing and a metal shell defining a pair of pivotal posts assembled in the pivotal grooves and a pair locking tabs to couple with the pair of locking recesses in a condition that the metal shell rotates to cover on the insulating housing and move forwards. The pair of pivotal posts therebetween defines an axis paralleling to the mounting face and the axis of the pair of pivotal posts is closer gradually to the mounting face during forward movement of the metal shell.

Abstract: A manufacturing method for a metal gate includes providing a substrate having at least a semiconductor device with a conductivity type formed thereon, forming a gate trench in the semiconductor device, forming a work function metal layer having the conductivity type and an intrinsic work function corresponding to the conductivity type in the gate trench, and performing an ion implantation to adjust the intrinsic work function of the work function metal layer to a target work function.

Abstract: An electrostatic discharge (ESD) protection device including a substrate, a first doped region, a second doped region, and a third doped region, a gate and a plurality of contacts is disclosed. The substrate includes a first conductive type. The first doped region is formed in the substrate and includes a second conductive type. The second doped region is formed in the substrate and includes the second conductive type. The third doped region is formed in the substrate, includes the first conductive type and is located between the first and the second doped regions. The gate is formed on the substrate, located between the first and the second doped regions and comprises a first through hole. The contacts pass through the first through hole to contact with the third doped region.

Abstract: A solar cell includes a substrate; multiple silicon rods formed on a surface of the substrate; an insulator layer formed on the surface of the substrate while the silicon rods are still exposed; a silicon shell layer formed on outside of each of the silicon rods; and a InxGa1?xAsyP1?y layer formed on the silicon shell layer to form a first cell, wherein 0?x?1 and 0?y?1.

Abstract: An electronic device including a first body, an input module and a functional element is provided. The input module is movably disposed on the first body and adapted to be moved between a first position and a second position. The functional element is disposed on the input module. When the input module is located at the first position, the functional element is concealed in the first body. When the input module is located at the second position, the functional element is exposed outside the first body.