Abstract: Various packages and methods of forming packages are disclosed. In an embodiment, a package includes a hybrid encapsulant encapsulating a chip attached to a substrate. The hybrid encapsulant comprises a first molding compound and a second molding compound that has a different composition than the first molding compound. In another embodiment, a package includes an encapsulant encapsulating a chip attached to a substrate. A surface of the chip is exposed through the encapsulant. The encapsulant comprises a recess in a surface of a first molding compound proximate the surface of the chip. A thermal interface material is on the surface of the chip and in the recess, and a lid is attached to the thermal interface material.

Abstract: A rubber-modified polystyrene resin composition is for making an electroplatable article which has a sectioned layer defining a unit area. The rubber-modified polystyrene resin composition includes a resin matrix, occlusion rubber particles dispersed in the resin matrix, and non-occlusion rubber particles dispersed in the resin matrix. A total sectional area ratio of the occlusion rubber particles to the non-occlusion rubber particles in the unit area ranges from 1.1 to 14.

Abstract: Die structures for electronic device packages and related fabrication methods are provided. An exemplary die structure includes a substrate having a first layer of semiconductor material including a semiconductor device formed thereon, a handle layer of semiconductor material, and a buried layer of dielectric material between the handle layer and the first layer. The die structure also includes a plurality of shunting regions in the first layer of semiconductor material, wherein each shunting region includes a doped region in the first layer that is electrically connected to the handle layer of semiconductor material, and a body region underlying the doped region that is contiguous with at least a portion of the first layer underlying a semiconductor device.

Abstract: A mobile communication device including a system ground plane, an antenna, a signal distributor, a transceiver and a sensing controller is provided. The antenna converts an electromagnetic wave to a radio-frequency signal. Besides, the antenna and the system ground plane form a sensing capacitor to detect an object and generate a detecting signal accordingly. The signal distributor is electrically connected to the antenna through a first connection terminal and a second connection terminal and guides the radio-frequency signal and the detecting signal from the antenna to a third connection terminal and a fourth connection terminal. The transceiver is electrically connected to the third connection terminal and processes the radio-frequency signal. The sensing controller is electrically connected to the fourth connection terminal and determines whether the object exists around the antenna according to the sensing signal.

Abstract: A method of using Neutrilized DNA (N-DNA) as a surface probe for a high throughput detection platform is disclosed. FET and SPRi are used as high throughput detection platforms to demonstrate that the N-DNA surface probe produces good results and enhances detection sensitivity. The N-DNA modifies the charged oxygen ions (O?) on the phosphate backbone through methylation, ethylation, propylation, or alkylation, so that the backbone is not charged after this modification to increase the hybridization efficiency, sensitivity and to make the signal more clear.

Abstract: An integrated circuit is provided. The integrated circuit may include, but is not limited to, a first node, a second node configured to be coupled to ground, an output driver, and a electrostatic discharge circuit electrically coupled to the first node, the second node, and the output driver. The electrostatic discharge circuit may include, but is not limited a high-pass filter configured to detect an electrostatic discharge event at the first node, a driving stage circuit electrically coupled to the high-pass filter and the output driver, the driving stage circuit configured to receive a signal from the high-pass filter when the high-pass filter detects the electrostatic discharge event and further configured to shunt an input of the output driver to the second node in response to the signal from the high-pass filter, and a step-down circuit electrically coupled to the driving stage circuit and configured to bias the driving stage circuit.

Abstract: A mobile communication device including a main board, a flexible printed circuit board (FPCB) and a transmission line. The main board includes a central process unit (CPU) disposed on the main board for outputting and receiving a control signal, and a wireless transmitter disposed on the main board and coupled to the CPU for modulating and demodulating a wireless signal. The FPCB is coupled to the CPU to operate as an antenna for transmitting the control signal and radiating and receiving the wireless signal. The FPCB includes a transmission unit coupled to the CPU for transmitting the control signal, a radiation unit for radiating and receiving the wireless signal, and a feed point formed on the radiation unit for feeding the wireless signal to the radiation unit. The transmission line is coupled between the feed point and the wireless transmitter for transmitting the wireless signal.

Abstract: An electrical contact for being loaded in an electrical connector electrically connecting an IC module to a printed circuit board (PCB) includes a first contact, a second contact and an elastic arm. The first contact includes a first mating portion and a first connecting portion. The first mating portion defines a first contacting end for connecting with the IC socket. The second contact includes a second mating portion and a second connecting portion. The second contacting portion defines a second contacting end for connecting with the PCB. The first and second connecting portions are coupled with each other, the first elastic element rings around the first mating portion of the first contact and presses against the second connecting portion of the second contact.

Abstract: A method for forming an isolation structure includes the following steps. A hard mask layer is formed on a substrate and a trench is formed in the substrate and the hard mask layer. A protective layer is formed to cover the trench and the hard mask layer. A first isolation material is filled into the trench. An etching process is performed to etch back part of the first isolation material.

Abstract: Provided is a brake distribution structure including a first sliding block, a second sliding block, and a tube. The first sliding block connects to a rear brake line of a bicycle. The second sliding block connects to a front brake line of the bicycle. The first sliding block moves to brake a rear wheel of the bicycle, and then the first sliding block drives the second sliding block to move and thereby brake the front wheel of the bicycle. The brake distribution structure ensures that the rear wheel is always braked first, prevents brake lockup, reduces hazards otherwise arising from manmade false action, and maximizes rider safety.

Abstract: A collector device of an electric train and a collector method thereof are provided. The collector device includes a collector unit and a magnetic unit. The collector unit has a first side, a second side and a graphite skateboard. The first side and the second side are the two opposite sides of the collector unit, and the graphite skateboard is disposed on the first side, wherein the first side of the collector unit is in contact with a power source having a magnetically permeable capacity via the graphite skateboard, so as to draw an operation voltage. The magnetic unit has an electromagnetic coil body. The magnetic unit is configured on the second side of the collector unit, for providing an attractive force between the collector unit with the power source, so as to reduce a contact loss rate.

Abstract: An integrated circuit chip package is described. The integrated circuit package comprises a substrate, a chip attached to the substrate, and a heat spreader mounted over the chip for sealing the chip therein. The heat spreader includes a thermally-conductive element having a side opposed to the top of the chip for transmitting heat away from the chip to the heat spreader, and a compliant element having a first portion attached to and positioned around the periphery of the thermally-conductive element and a second portion affixed to a surface of the substrate.

Abstract: The present invention discloses a double diffused drain metal oxide semiconductor (DDMOS) device and a manufacturing method thereof. The DDDMOS device is formed in a substrate, and includes: a drift region, a gate, a source, a drain, a dielectric layer, and a conductive layer. The drift region includes a first region and a second region. The gate is formed on the substrate, and overlaps the first region from top view. The source and drain are formed at both sides of the gate respectively, and the drain is located in the second region. The drain and the gate are separated by a portion of the second region from top view. The dielectric layer is formed by dielectric material on the gate and the second region. The conductive layer is formed by conductive material on the dielectric layer, and overlaps at least part of the second region from top view.

Abstract: A method of charging a battery includes following steps: First, a charging voltage is provided to charge the battery. Afterward, a charging control variable is judged whether to reach to an adjustment value. Afterward, the charging voltage is adjusted with a first voltage difference to continuously charge the battery when the charging control variable reaches to the adjustment value. Afterward, a health state value of the battery is judged whether less than or equal to a critical health state value. Finally, the charging voltage is increased with a second voltage difference to continuously charge the battery when the health state value of the battery is less than or equal to the critical health state value.

Abstract: The present invention relates to a method for measuring cracks remotely and the device thereof. First, multiple laser spots with known a shape are projected onto a remote wall and beside a crack. Then, by using geometric calculations, the relative coordinates of the laser spots on the wail and the real distance can be given and used as the reference length of the crack. Next, a camera is used for taking a picture of the remote crack along with the laser spots; the image identification technology is used for calculating the relevant parameters of the crack. Thereby, to acquire the parameters of the crack, a user needs not to be present at the site for measuring at a short distance or placing a reference object, and thus providing safety and convenience.

Abstract: A method of fabricating a dielectric layer includes the following steps. At first, a dielectric layer is formed on a substrate, and a chemical mechanical polishing (CMP) process is performed on the dielectric layer. Subsequently, a surface treatment process is performed on the dielectric layer after the chemical mechanical polishing process, and the surface treatment process includes introducing an oxygen plasma.

Abstract: An electronic device includes a main body having a top wall, a bottom wall and a front sidewall, and a hard disk drive received in the main body adjacent to the front sidewall. The hard disk drive includes a first end adjacent to the front sidewall and a second end parallel to and opposite to the first end. The hard disk drive is mounted at a slant to the top wall, at an angle of ?, and the distance between the first end and the top wall is less than the distance between the second end and the top wall, to slant up the hard disk drive, allowing the thickness of a front portion of the main body adjacent to the front sidewall to be thinner and cosmetically sleeker.

Abstract: The present invention relates to a method of forming an isolation structure, in which, a trench is formed in a substrate through a hard mask, and deposition, etch back, deposition, planarization, and etch back are performed in the order to form an isolation material layer of the isolation structure after the hard mask is removed. A silicon layer may be formed to cover the trench and original surface of the substrate before the former deposition, or to cover a part of the trench and original surface of the substrate after the former etch back and before the later deposition, to serve as a stop layer for the planarization process. Voids existing within the isolation material layer can be exposed or removed by partially etching the isolation material layer by the former etch back. The later deposition can be performed with a less aspect ratio to avoid forming voids.

Abstract: The present invention relates to a composition for the prevention and treatment of diabetes mellitus and diabetic complications. The composition includes as an active ingredient, a heat-treated powder or extract of glycine soja with hypoglycemic effects. The heat-treated powder and extract of glycine soja have outstanding hypoglycemic effects and therapeutic effects on diabetic complications. The composition of the present invention is useful as a pharmaceutical or food composition for the prevention and treatment (amelioration) of diabetes mellitus or diabetic complications.

Abstract: A test socket includes an insulating seat defining a package-receiving room and loaded with a plurality of terminals, a retaining member retained on the insulating seat, a first cover and a second cover. The retaining member defines a first end and a second end. The first cover is assembled to the first end of the retaining member via a pivot pin at a lower end thereof The second cover is assembled to the second end of the retaining member via a second pivot pin at a lower end thereof The second cover presses against the first cover and is locked after the two covers rotate to close the package-receiving room. The first cover defines a pair of wheels at an upper end thereof and rolling along the second cover during the covers rotate downwards.