Abstract: Provided is a lens assembly driving module including a photographing lens assembly, a first driving mechanism and a second driving mechanism. The photographing lens assembly includes N lens elements and has an optical axis passing through the N lens elements. The first driving mechanism drives at least N/2 said lens elements to move along the optical axis of the photographing lens assembly. The second driving mechanism enables a relative distance along the optical axis of two adjacent ones of the N lens elements to vary. Therefore, any specific one of the lens elements is capable of being driven to optimize optical imaging resolution of various fields of view independently within a real shot at different object distances.

Abstract: Various embodiments of the present disclosure are directed towards a semiconductor structure including a buffer layer disposed between an active layer and a substrate. The active layer overlies the substrate. The substrate and the buffer layer include a plurality of pillar structures that extend vertically from a bottom surface of the active layer in a direction away from the active layer. A top electrode overlies an upper surface of the active layer. A bottom electrode underlies the substrate. The bottom electrode includes a conductive body and a plurality of conductive structures that respectively extend continuously from the conductive body, along sidewalls of the pillar structures, to a lower surface of the active layer.

Abstract: A lens driving module includes a base, a shield can, a driving mechanism, a space maintaining element and a damping element. The base has an opening. The shield can is coupled to the base and has a central aperture corresponding to the opening. The driving mechanism is disposed in the shield and configured to drive a lens unit to move. The space maintaining element is in physical contact with the shield can. The space maintaining element includes a plastic frame portion and a metal structure portion. The metal structure portion includes pins extending toward the base. The metal structure portion is insert-molded with the plastic frame portion to form the space maintaining element. The damping element is connected to the pins and the lens unit. The pins of the metal structure portion are located closer to the optical axis than part of the metal structure portion without the pins.

Abstract: An imaging camera driving module includes a lens unit, a driving mechanism, a sensing mechanism and an image surface. At least a part of the driving mechanism is coupled to the lens unit to drive the lens unit to move in a direction parallel to the optical axis. The sensing mechanism includes sensing magnets fixed to the lens unit and sensing elements not facing the driving mechanism. The sensing elements are disposed on an image side of the imaging lens assembly of the lens unit and corresponding to the sensing magnets. The sensing elements are configured to detect a relative position of the sensing magnets. The image surface is disposed on the image side of the imaging lens assembly, and the optical axis passes through the image surface. The sensing mechanism is configured to detect a tilt of the optical axis with respect to the central axis.

Abstract: A display device may include a substrate and a light emitting element disposed on the substrate. An encapsulation layer covers the light emitting element. The encapsulation layer includes at least two inorganic encapsulation layers and at least one organic encapsulation layer. The at least one organic encapsulation layer includes a first organic material having a permittivity less than or equal to about 3.0. A low permittivity layer is disposed on the encapsulation layer. The low permittivity layer includes a second organic material and first hollow particles dispersed in the second organic material. An input sensing layer is disposed on the low permittivity layer.

Abstract: A method includes performing a cleaning operation on a supporting surface of a wafer table by using a cleaning scrubber having a plurality of microstructures, the plurality of microstructures being spaced apart from each other and having a tapered width; placing a semiconductor wafer on the supporting surface of the wafer table; and performing a photolithography process on the semiconductor wafer.

Abstract: A process to treat fines tailings generated from mining operations, wherein tailings material is sprayed onto a solid substrate as a thin layer and allowed to dry. The spray may be re-applied on top of the dried tailings film leading to multiple layers of dried tailings solids. The method may yield a solid, dry, and consolidated tailings material.

Abstract: A filter includes M filter circuits. The M filter circuits are sequentially cascaded from an input terminal to an output terminal, in order to generate an output signal according to an input signal, in which M is a positive integer greater than or equal to 2. The M filter circuits include at least one first filter circuit and at least one second filter circuit. Each of the at least one first filter circuit is set to be an active filter circuit, and each of the at least one second filter circuit is set to be a passive filter circuit.

Abstract: Various embodiments of the present application are directed towards an integrated circuit (IC) in which a high voltage metal-oxide-semiconductor (HVMOS) device is integrated with a high voltage junction termination (HVJT) device. In some embodiments, a first drift well and a second drift well are in a substrate. The first and second drift wells border in a ring-shaped pattern and have a first doping type. A peripheral well is in the substrate and has a second doping type opposite the first doping type. The peripheral well surrounds and separates the first and second drift wells. A body well is in the substrate and has the second doping type. Further, the body well overlies the first drift well and is spaced from the peripheral well by the first drift well. A gate electrode overlies a junction between the first drift well and the body well.

Abstract: A lens driving apparatus includes an imaging lens assembly, a driving mechanism and a carrier element. The imaging lens assembly includes at least one plastic lens element. The plastic element includes an effective optical portion, a peripheral portion and a light-shielding layer. The peripheral portion surrounds the effective optical portion. The light-shielding layer is disposed on an object side of the peripheral and surrounds the effective optical portion. The driving mechanism includes at least one coil and at least one magnet. The magnet is disposed correspondingly with the coil. Both of the plastic element and the one of the coil and the magnet are directly connected with the carrier element. An outer surface of the carrier element includes an assembling structure. The assembling structure is directly contacted with one of the coil and the magnet. The assembling structure and the carrier element are made integrally.

Abstract: The present disclosure describes a leakage handling device and a method for handling a fluid leakage in a semiconductor manufacturing apparatus. The semiconductor manufacturing apparatus can include a lithography apparatus with a chuck configured to hold a substrate, and a photoresist feeder configured to dispatch a coating material on one or more areas of the substrate. The photoresist feeder can include a photoresist cartridge configured to output the coating material, a conduit fluidly connected to the photoresist cartridge, and a fluid leakage handling device disposed above the chuck, where the conduit can be configured to fluidly transport the coating material and circulate a coolant and the fluid leakage handling device can be configured to detect a fluid leakage from the conduit.

Abstract: Properly parking personal mobility vehicles (PMVs) is an important for safety and public satisfaction. The large number of daily rides of ride-share PMVs makes it impossible to verify manually that each PMV is properly parked. Aspects of this disclosure include systems and methods for verifying that PMVs are properly parked. These systems and methods can include training a machine learning model on a server. The system can request that users submit images to the server, such that the server can verify that the user properly parked the PMV. The server can transmit a finished indication when it determines that the user properly parked the vehicle. The server can transmit instructions to the user to take various actions when it determines that the user improperly parked the vehicle or when the image is insufficient to determine whether the user properly parked the vehicle.

Abstract: Provided are a method and apparatus for evaluating a degree of frequency regulation urgency of a generator set, a power system and a storage medium.

Abstract: A filter includes multiple filter circuits. The filter circuits are coupled in series between an input terminal and an output terminal, to generate an output signal according to an input signal. One of the filter circuits operates as an active filter circuit or a passive filter circuit according to amplitude of the input signal.

Abstract: An imaging lens assembly includes a plastic barrel and an optical element set. The optical element set includes an optical lens element, a light blocking sheet and a light-shielding layer. At least one surface of an object-side peripheral surface and an image-side peripheral surface of the optical lens element includes an annular side wall. An annular abutting surface of the light blocking sheet and the annular side wall of the optical lens element are disposed correspondingly to each other. The light-shielding layer surrounds a central opening of the light blocking sheet and includes an annular concave-curved portion. The annular concave-curved portion is for retaining the light blocking sheet, so that there is no relative displacement in a direction parallel to an optical axis between the annular abutting surface of the light blocking sheet and the annular side wall of the optical lens element.

Abstract: A portable handheld cleaning device is provided capable of cleaning the surface of the substrate table without damaging the surface. The portable handheld cleaning device in accordance with the present disclosure includes a base having a first side and a second side (the first side and the second side overlapping each other), a hollow structure on the first side of the base, and a weight holding space within the hollow structure. A grinding pad is provided on the second side of the base. The grinding pad includes a cleaning surface, the cleaning surface having a plurality of substantial pyramid shaped grits.

Abstract: Certain embodiments of a semiconductor device and a method of forming a semiconductor device comprise forming a high-k gate dielectric layer over a short channel semiconductor fin. A work function metal layer is formed over the high-k gate dielectric layer. A seamless metal fill layer is conformally formed over the work function metal layer.

Abstract: The present disclosure describes a lithography apparatus comprising a photoresist coating unit configured to perform one or more coating processes on a substrate. The lithography apparatus further comprises a detection unit configured to determine a contamination level of a contaminant from the one or more coating processes adheres on a sidewall of the lithography apparatus. The lithography apparatus further comprises a controller unit configured to adjust one or more operations of the lithography apparatus based on a comparison between the contamination level and a baseline cleanliness requirement of the lithography apparatus.