Patents by Inventor Yin Liu

Yin Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12080603
    Abstract: A method of the present disclosure includes forming a fin-shaped structure including a plurality of semiconductor layers, a first hard mask layer, a second hard mask layer, and a third hard mask layer, forming a patterned masking layer having a mask portion and a window portion, wherein the third hard mask layer is exposed through the window portion, performing a first etch process to expose the second hard mask layer through the window portion, performing a second etch process to etch the exposed second hard mask layer and to leave behind second hard mask layer residues, performing a third etch process to remove the second hard mask layer residues, etching the plurality of semiconductor layers in the fin-shaped structure through the window portion to divide the fin-shaped structure into a first segment and a second segment, and forming an isolation feature around the first segment and the second segment.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: September 3, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Han-Yu Tsai, Zu-Yin Liu, You-Ting Lin, Jiun-Ming Kuo, Kuo-Chin Liu
  • Publication number: 20240189878
    Abstract: A waste liquid-crystalline glass recycling system includes a liquid-crystalline glass film removing module and a liquid-crystalline glass separation module connected with the liquid-crystalline glass film removing module. The liquid-crystalline glass film removing module includes a crushing device and a film removal device. The crushing device is configured to crush a liquid crystal panel. The film removal device is connected with the crushing device, and is configured to separate the liquid crystal panel into a glass-liquid crystal mixture and optical film debris. The liquid-crystalline glass separation module is connected with the liquid-crystalline glass film removing module, and is configured to separate the glass-liquid crystal mixture into glass sand and a liquid crystal mixture by using a solvent, in which the liquid crystal mixture includes the solvent.
    Type: Application
    Filed: August 8, 2023
    Publication date: June 13, 2024
    Inventors: Hsiang-Ming WANG, Pei-Yin Liu, Po-Wen Chi
  • Patent number: 11999831
    Abstract: An aluminum borate whisker reinforced and toughened non-metallic matrix composite is provided, which specifically includes a non-metallic material reinforced and toughened with aluminum borate whiskers. The composite exhibits a higher bending strength and fracture toughness and a higher wear resistance. A method for preparing the composite is also provided. The method includes mixing the aluminum borate whiskers and the non-metallic material to form a mixture; and sintering the mixture by a vacuum hot press method, or molding the mixture.
    Type: Grant
    Filed: June 23, 2022
    Date of Patent: June 4, 2024
    Assignees: Chongqing University of Science and Technology, Chongqing Stio Measurement & Control Tech Co., Ltd
    Inventors: Bi Jia, Jinliang Shi, Zhigang Zou, Yong Zhou, Yongjiang Di, Yin Liu, Yue Shi, Huichao He, Rong Wang, Xueyi Wang, Hao Tian, Jun Zhu, Rui Tang, Xingyu Chen, Danxia Zhang
  • Publication number: 20240178263
    Abstract: A device includes two BSI image sensor elements and a third element. The third element is bonded in between the two BSI image sensor elements using element level stacking methods. Each of the BSI image sensor elements includes a substrate and a metal stack disposed over a first side of the substrate. The substrate of the BSI image sensor element includes a photodiode region for accumulating an image charge in response to radiation incident upon a second side of the substrate. The third element also includes a substrate and a metal stack disposed over a first side of the substrate. The metal stacks of the two BSI image sensor elements and the third element are electrically coupled.
    Type: Application
    Filed: February 5, 2024
    Publication date: May 30, 2024
    Inventors: Ping-Yin Liu, Yeur-Luen Tu, Chia-Shiung Tsai, Xiaomeng Chen, Pin-Nan Tseng
  • Publication number: 20240118349
    Abstract: The disclosure discloses a battery device, a detection method thereof, a method and device for screening battery cells. The characteristic values are determined according to parameters of two peaks in the frequency-domain impedance diagram. The characteristic values may reflect the magnitude of charge transfer impedance and diffusion impedance in each battery cell, then reflect the characteristics of the interface and characteristics of solid phase particles during charging and discharging, and further reflect the health and performance of battery cells. The battery set screened in this way still have good consistency after storage and shelving, and the consistency between battery cells will not deteriorate after storage for a period of time, so that the battery device may have better performance.
    Type: Application
    Filed: December 1, 2022
    Publication date: April 11, 2024
    Applicant: CALB Co., Ltd.
    Inventors: Ruijun Ma, Fengsong Fan, Shengjie Wang, Yin Liu, Kui Li
  • Patent number: 11932534
    Abstract: A microelectromechanical system (MEMS) structure and method of forming the MEMS device, including forming a first metallization structure over a complementary metal-oxide-semiconductor (CMOS) wafer, where the first metallization structure includes a first sacrificial oxide layer and a first metal contact pad. A second metallization structure is formed over a MEMS wafer, where the second metallization structure includes a second sacrificial oxide layer and a second metal contact pad. The first metallization structure and second metallization structure are then bonded together. After the first metallization structure and second metallization structure are bonded together, patterning and etching the MEMS wafer to form a MEMS element over the second sacrificial oxide layer. After the MEMS element is formed, removing the first sacrificial oxide layer and second sacrificial oxide layer to allow the MEMS element to move freely about an axis.
    Type: Grant
    Filed: March 16, 2022
    Date of Patent: March 19, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hung-Hua Lin, Chang-Ming Wu, Chung-Yi Yu, Ping-Yin Liu, Jung-Huei Peng
  • Patent number: 11935620
    Abstract: A memory device for memory cell programming and erasing with refreshing operation is disclosed. The memory device includes multiple location-related memory cells and a refresh module. The location-related memory cells are coupled to a bit line on which a selecting voltage is applied. The refresh module rewrites a stored data of a first cell of the location-related memory cells to the first cell of the location-related memory cells in response to an operation count being smaller than a number N. N is related to the number of the location-related memory cells.
    Type: Grant
    Filed: June 21, 2021
    Date of Patent: March 19, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yue-Der Chih, Cheng-Hsiung Kuo, Gu-Huan Li, Chien-Yin Liu
  • Publication number: 20240087879
    Abstract: A method includes performing a plasma activation on a surface of a first package component, removing oxide regions from surfaces of metal pads of the first package component, and performing a pre-bonding to bond the first package component to a second package component.
    Type: Application
    Filed: November 14, 2023
    Publication date: March 14, 2024
    Inventors: Xin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Hsun-Chung Kuang, Yuan-Chih Hsieh, Lan-Lin Chao, Chia-Shiung Tsai, Xiaomeng Chen
  • Publication number: 20240089333
    Abstract: A method that includes collecting, by a computer, social network posts by social network friends of a user containing images. The method further includes identifying, by the computer, images within the social network posts containing the user through facial image recognition based on an image of the user in a user social network profile and determining, by the computer, information from the identified images containing the user within the social network posts for inclusion in the user social network profile. The method may further include updating, by the computer, the profile information of the user social network profile to include the information from the identified images containing the user within the social network posts.
    Type: Application
    Filed: November 21, 2023
    Publication date: March 14, 2024
    Inventors: Wen Wang, Yan Bin Fu, Shuang Yin Liu, Yi Wu, Qing Jun Gao
  • Patent number: 11921788
    Abstract: A system level search module receives system level search user interface registration information for an application of the computing device. The registration information includes an indication of how the system level search module can launch the application. The registration information is added to a registration store, and the application is included as one of one or more applications that can be searched using the system level search user interface.
    Type: Grant
    Filed: November 29, 2022
    Date of Patent: March 5, 2024
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Priya Vaidyanathan, Brian E. Uphoff, Brandon H. Paddock, Stephanie M. Monk, Dona Sarkar, Wentao Chen, Edward Boyle Averett, Manav Mishra, Derek S. Gebhard, Richard Jacob White, Yin Liu
  • Publication number: 20240067782
    Abstract: An aluminum borate whisker reinforced and toughened non-metallic matrix composite is provided, which specifically includes a non-metallic material reinforced and toughened with aluminum borate whiskers. The composite exhibits a higher bending strength and fracture toughness and a higher wear resistance. A method for preparing the composite is also provided. The method includes mixing the aluminum borate whiskers and the non-metallic material to form a mixture; and sintering the mixture by a vacuum hot press method, or molding the mixture.
    Type: Application
    Filed: November 6, 2023
    Publication date: February 29, 2024
    Inventors: Yue Shi, Bi Jia, Jinliang Shi, Zhigang Zou, Yong Zhou, Yongjiang Di, Yin Liu, Huichao He, Rong Wang, Xueyi Wang, Hao Tian, Jun Zhu, Rui Tang, Xingyu Chen, Danxia Zhang
  • Patent number: 11895199
    Abstract: Updating a user social network profile of a user based on relevant activities posted by other users in a same social network.
    Type: Grant
    Filed: August 19, 2022
    Date of Patent: February 6, 2024
    Assignee: KYNDRYL, INC.
    Inventors: Yan Bin Fu, Qing Jun Gao, Shuang Yin Liu, Wen Wang, Yi Wu
  • Patent number: 11894408
    Abstract: A device includes two BSI image sensor elements and a third element. The third element is bonded in between the two BSI image sensor elements using element level stacking methods. Each of the BSI image sensor elements includes a substrate and a metal stack disposed over a first side of the substrate. The substrate of the BSI image sensor element includes a photodiode region for accumulating an image charge in response to radiation incident upon a second side of the substrate. The third element also includes a substrate and a metal stack disposed over a first side of the substrate. The metal stacks of the two BSI image sensor elements and the third element are electrically coupled.
    Type: Grant
    Filed: June 14, 2021
    Date of Patent: February 6, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Ping-Yin Liu, Yeur-Luen Tu, Chia-Shiung Tsai, Xiaomeng Chen, Pin-Nan Tseng
  • Publication number: 20240025158
    Abstract: A film comprises an elastomeric or soft polymer substrate that is capable of converting light to heat a second layer comprising a hydrophilic polymer and nanosheets of layered inorganic material dispersed in the hydrophilic polymer. The substrate can comprise a photothermal particle. The film can be used in a method by irradiating the film to cause wrinkles and optionally further exposing the film to moisture with optional drying.
    Type: Application
    Filed: October 5, 2021
    Publication date: January 25, 2024
    Inventors: Luyi Sun, Songshan Zeng, Zi Chen, Yin Liu
  • Publication number: 20230421165
    Abstract: The present invention discloses a SAADC circuit having optimized linearity. A lower-bit capacitor array includes lower-bit capacitors. A higher-bit capacitor array includes unit capacitors. In an initializing mode, a control circuit sorts the unit capacitors according to unit capacitances thereof such that the unit capacitors are configured to be higher-bit capacitors having a linearity parameter within a predetermined range. In an operation mode, the capacitor array receives an analog input signal and a reference voltage to generate an analog output signal, a comparator generates a comparison result according to the analog output signal and the control circuit generates an enabling signal according to the comparison result based on the successive approximation mechanism to selectively enable the higher-bit and the lower-bit capacitors to connect to the reference voltage by using the capacitor enabling circuit and outputs a digital output signal according to the final comparison result.
    Type: Application
    Filed: June 20, 2023
    Publication date: December 28, 2023
    Inventors: WEI-JYUN WANG, KAI-YIN LIU, SHIH-HSIUNG HUANG, CHIEN-MING WU
  • Patent number: 11854795
    Abstract: A method includes performing a plasma activation on a surface of a first package component, removing oxide regions from surfaces of metal pads of the first package component, and performing a pre-bonding to bond the first package component to a second package component.
    Type: Grant
    Filed: March 21, 2022
    Date of Patent: December 26, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Xin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Hsun-Chung Kuang, Yuan-Chih Hsieh, Lan-Lin Chao, Chia-Shiung Tsai, Xiaomeng Chen
  • Patent number: 11854999
    Abstract: In some embodiments, the present disclosure relates to an integrated chip that includes bonding structure arranged directly between a first substrate and a second substrate. The first substrate includes a first transparent material and a first alignment mark. The first alignment mark is arranged on an outer region of the first substrate and also includes the first transparent material. The first alignment mark is defined by surfaces of the first substrate that are arranged between an uppermost surface of the first substrate and a lowermost surface of the first substrate. The second substrate includes a second alignment mark on an outer region of the second substrate. The second alignment mark directly underlies the first alignment mark, and the bonding structure is arranged directly between the first alignment mark and the second alignment mark.
    Type: Grant
    Filed: August 4, 2022
    Date of Patent: December 26, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Xin-Hua Huang, Ping-Yin Liu
  • Publication number: 20230385623
    Abstract: Disclosed is a methods and apparatus which can improve defect tolerability of a hardware-based neural network. In one embodiment, a method for performing a calculation of values on first neurons of a first layer in a neural network, includes: receiving a first pattern of a memory cell array; determining a second pattern of the memory cell array according to a third pattern; determining at least one pair of columns of the memory cell array according to the first pattern and the second pattern; switching input data of two columns of each of the at least one pair of columns of the memory cell array; and switching output data of the two columns in each of the at least one pair of columns of the memory cell array so as to determine the values on the first neurons of the first layer.
    Type: Application
    Filed: August 8, 2023
    Publication date: November 30, 2023
    Inventors: Win-San KHWA, Yu-Der CHIH, Yi-Chun SHIH, Chien-Yin LIU
  • Patent number: 11828177
    Abstract: The present disclosure provides a comprehensive utilization method and test equipment for surface water, a goaf and geothermal energy in a coal mining subsidence area. The method comprises the following steps: determining a geothermal water collection area, arranging heat energy exchange equipment in a main roadway, and arranging a geothermal water extraction system, wherein the geothermal water extraction system comprises geothermal wells, extraction pipelines and tail water reinjection pipelines, the extraction pipelines are connected with the heat energy exchange equipment, and the tail water reinjection pipelines are connected with a water outlet of the heat energy exchange equipment; arranging a water channel on the surface, and arranging a drainage system on a subsidence trough to guide surface water to flow underground; and controlling directional and ordered flow of surface water through the coal mining subsidence area formed by ground mining to achieve sustainable mining of underground water.
    Type: Grant
    Filed: January 26, 2022
    Date of Patent: November 28, 2023
    Assignee: Shandong University of Science and Technology
    Inventors: Jinhai Zhao, Liming Yin, Xinguo Zhang, Wenbin Sun, Changjian Zhou, Juntao Chen, Shichuan Zhang, Ning Jiang, Yangyang Li, Yin Liu, Yunzhao Zhang, Shupeng Zhang, Zhixue Zhang, Yang Qiao, Dan Kang
  • Patent number: D1033321
    Type: Grant
    Filed: April 29, 2020
    Date of Patent: July 2, 2024
    Assignee: Ningbo Yonk Machiery Co., Ltd.
    Inventor: Yin Liu