Abstract: A display device and a method of fabricating the same are provided. The display device includes a substrate, a first electrode on the substrate, a second electrode on the substrate and spaced apart from the first electrode, a plurality of light emitting elements, at least a portion of each of which is between the first electrode and the second electrode, and contact electrodes on the first electrode, the second electrode and the light emitting elements, the contact electrodes including a conductive polymer, wherein the contact electrodes include a first contact electrode which contacts an end portion of a first portion of the light emitting elements and the first electrode and a second contact electrode which contacts an end portion of a second portion of the light emitting elements, and the second electrode and is spaced apart from the first contact electrode.

Abstract: A display device includes a display panel including a display area and non-display areas surrounding the display area; an encapsulation substrate disposed on the display panel and including melting patterns formed in regions overlapping the non-display areas; a sealing member disposed between the display panel and the encapsulation substrate to couple the display panel with the encapsulation substrate; and fusing patterns disposed across the sealing member and the encapsulation substrate. The display panel further includes a metal line layer disposed in at least a portion of the non-display areas, at least a portion of the sealing member is disposed on the metal line layer in the non-display areas, the melting patterns are disposed to overlap the metal line layer in a thickness direction, and the fusing patterns are disposed not to overlap the metal line layer in the thickness direction.

Abstract: A substrate-on-substrate structure and an electronic device including the same are provided. The substrate-on-substrate structure includes: a first printed circuit board having a first side and a second side; a second printed circuit board disposed on the second side of the first printed circuit board, and having a first side connected to the second side of the first printed circuit board and a second side opposite to the first side connected to the second side of the first printed circuit board; a reinforcing structure attached to the first side of the second printed circuit board, and spaced apart from the second side of the first printed circuit board; and an underfill resin disposed between the second side of the first printed circuit board and the first side of the second printed circuit board, and covering at least a portion of the reinforcing structure.

Abstract: The present invention relates to an aluminum-resin composite and provides the aluminum-resin composite which is excellent in adhesive property between metal and resin and is applicable to a continuous production process such as a wire production process. Specifically, the present invention uses the aluminum-resin composite including a metal made of aluminum or an aluminum alloy and resin adhering to the metal via an alumina nanoporous layer formed on a surface of the metal. The alumina nanoporous layer contains alumina nanoparticles of 5 nm to 10 nm in average particle diameter and holes three-dimensionally communicating with one another.

Abstract: A display device includes a pixel circuit, an insulating layer covering the pixel circuit, a first partition portion which is disposed on the insulating layer and extends in a first direction, a second partition portion which is spaced apart from the first partition portion in a second direction intersecting the first direction and extends in the first direction, a plurality of connection partition portions disposed between the first and second partition portions, where each of the plurality of connection partition portions extends in the second direction, a first electrode disposed on the first partition portion and electrically connected to the pixel circuit, a second electrode disposed on the second partition portion, and a light emitting element disposed between the plurality of connection partition portions and electrically connected to the first electrode and the second electrode.

Abstract: Semiconductor memory devices and methods of forming the same are provided. The semiconductor devices may include a vertical insulating structure extending in a first direction on a substrate, a semiconductor pattern extending along a sidewall of the vertical insulating structure, a bitline on a first side of the semiconductor pattern, an information storage element on a second side of the semiconductor pattern and including first and second electrodes, and a gate electrode on the semiconductor pattern and extending in a second direction that is different from the first direction. The bitline may extend in the first direction and may be electrically connected to the semiconductor pattern. The first electrode may have a cylindrical shape that extends in the first direction, and the second electrode may extend along a sidewall of the first electrode.

Abstract: A semiconductor device includes a bit line extending in a first direction, a gate electrode extending in a second direction, and a semiconductor pattern extending in a third direction and connected to the bit line, and a capacitor. The capacitor includes a first electrode connected to the semiconductor pattern and a dielectric film between the first and second electrodes. The first or the second direction is perpendicular to an upper surface of the substrate. The first electrode includes an upper and a lower plate region parallel to the upper surface of the substrate, and a connecting region which connects the upper and the lower plate regions. The upper and the lower plate regions of the first electrode include an upper and a lower surface facing each other. The dielectric film extends along the upper and the lower surfaces of the upper and lower plate regions of the first electrode.

Abstract: A display device includes: a substrate; a first bank on the substrate, at least portions of the first bank being spaced apart from each other; a plurality of first electrodes on the substrate, at least portions of the first electrodes being on portions of the first bank; a second electrode on the substrate, the second electrode being spaced apart from and between adjacent ones of the first electrodes; and a plurality of light emitting elements on the first electrodes and the second electrode.

Abstract: A substrate-on-substrate structure and an electronic device including the same are provided, and the substrate-on-substrate structure includes: a first printed circuit board having a first side and a second side, opposite to the first side; a second printed circuit board disposed on the second side of the first printed circuit board, and having a first side connected to the second side of the first printed circuit board and a second side opposite to the first side connected to the second side of the first printed circuit board; a first structure disposed on the second side of the first printed circuit board, and disposed around the second printed circuit board; a second structure disposed on the second side of the second printed circuit board; and a third structure disposed on the first and second structures, and connected to each of the first and second structures.

Abstract: A quantum hybridization negative differential resistance device having negative differential resistance (NDR) under a low voltage condition using a nanowire based on an organic-inorganic hybrid halide perovskite, and a circuit thereof are provided. The quantum hybridization negative differential resistance device includes a channel formed of an organic-inorganic hybrid halide perovskite crystal and electrodes formed of its inorganic framework and is connected to opposite ends of the channel.

Abstract: A display device includes a display panel having a display area comprising pixels and a non-display area surrounding the display area, an encapsulation substrate which faces the display panel and is disposed on a surface of the display panel, and a sealing member disposed in the non-display area and interposed between the display panel and the encapsulation substrate for bonding. The display panel comprises a base substrate and a first conductive layer disposed on a first surface of the base substrate, the base substrate provides a through hole defined in a part of the non-display area to penetrate the base substrate in a thickness direction, the first conductive layer comprises a signal line disposed in a part of the non-display area and filling the through hole, and the sealing member does not overlap the first conductive layer and the through hole in the thickness direction.

Abstract: A component mounting board includes first and second substrates, a connection substrate, an interposer, and an electronic component. The first substrate has first and second surfaces opposing each other, a first side surface between the first and second surfaces, and a first signal pattern. The second substrate is disposed on the first substrate, has third and fourth surfaces opposing each other and a second side surface between the third and fourth surfaces, and includes a second signal pattern. The connection substrate is bent to connect the first and second side surfaces, and the interposer is disposed between the first and third surfaces and electrically connects the first and second signal patterns. The electronic component is mounted on at least one of the first to fourth surfaces.

Abstract: A display device includes a display panel including a display area and a non-display area surrounding the display area, and a metal wiring layer disposed on at least a portion of the non-display area, an encapsulation substrate disposed on the display panel, a sealing member which is disposed between the display panel and the encapsulation substrate and bonds the display panel to the encapsulation substrate and a first fusion region provided in at least a partial region between the sealing member and the encapsulation substrate, where the first fusion region has no physical boundary, and where at least a portion of the sealing member is disposed on the metal wiring layer in the non-display area, and the first fusion region is separated from the metal wiring layer while overlapping the metal wiring layer in a thickness direction.

Abstract: A non-volatile memory structure can include a substrate extending horizontally and a filling insulating pattern extending vertically from the substrate. A plurality of active channel patterns can extend vertically from the substrate in a zig-zag pattern around a perimeter of the filling insulating pattern, where each of the active channel patterns having a respective non-circular shaped horizontal cross-section. A vertical stack of a plurality of gate lines can each extend horizontally around the filling insulating pattern and the plurality of active channel patterns.

Abstract: An organic light emitting diode display device includes a substrate including at least one subpixel having a non-emitting area and an emitting area; a thin film transistor in the non-emitting area on the substrate; an overcoating layer on the thin film transistor and having a plurality of microlenses at a top surface of the overcoating layer; and a light emitting diode in the emitting area on the overcoating layer and connected to the thin film transistor, wherein a surface of the plurality of microlenses in a sampling area of the emitting area is divided into a plurality of convex portions and a plurality of concave portions with respect to a central surface, and a total volume of the plurality of convex portions with respect to the central surface is equal to a total volume of the plurality of concave portions with respect to the central surface.

Abstract: Provided are an implantable medical device control system and a control method therefor, the system comprising: an implantable medical device implanted into the body so as to stimulate a specific area in the body; a management terminal for controlling the driving of the implantable medical device by communicating with the implantable medical device through a wireless communication method; and a management server connected with the management terminal so as to be capable of communicating therewith, assigning priority to each parameter included in patient condition information and storing and managing same, and providing the stored information, and thus, since priority is assigned to each parameter included in patient condition information and stimulation applied to a specific part in the body is adjusted according to the assigned priority, the entire parameter can be controlled such that a patient condition is maintained in a stabilized state by satisfying a preset reference value.

Abstract: An electronic component-embedded substrate includes an electronic component module having a first surface and a second surface opposite to the first surface, and including a first support member having a first through-portion, a first electronic component disposed in the first through-portion, a first resin layer covering at least a portion of the first electronic component, a second support member disposed on one side of the first support member and having a second through-portion, a second electronic component disposed in the second through-portion and connected to the first electronic component, and a second resin layer covering at least a portion of the second electronic component, an insulating material covering at least a portion of each of a side surface of the electronic component module and the first surface, and a first wiring layer disposed on the insulating material and connected to the first electronic component.

Abstract: An electronic component-embedded substrate includes a first wiring layer, a first electronic component disposed on the first wiring layer, a first insulating material covering at least a portion of each of the first wiring layer and the first electronic component, a second wiring layer disposed on the first insulating material, a second electronic component disposed on the second wiring layer and connected to the first electronic component in an electrical parallel connection, a second insulating material disposed on the first insulating material and covering at least a portion of each of the second wiring layer and the second electronic component, and a first via penetrating through the first insulating material and connecting the first electronic component and the second wiring layer.

Abstract: A substrate-on-substrate structure and an electronic device including the same are provided, and the substrate-on-substrate structure includes: a first printed circuit board having a first side and a second side, opposite to the first side; a second printed circuit board disposed on the second side of the first printed circuit board, and having a first side connected to the second side of the first printed circuit board and a second side opposite to the first side connected to the second side of the first printed circuit board; a reinforcing structure attached to the first side of the second printed circuit board, and spaced apart from the second side of the first printed circuit board; and an underfill resin disposed between the second side of the first printed circuit board and the first side of the second printed circuit board, and covering at least a portion of the reinforcing structure.

Abstract: A semiconductor memory device includes a stack structure comprising a plurality of layers vertically stacked on a substrate, each layer including a semiconductor pattern, a gate electrode extending in a first direction on the semiconductor pattern, and a data storage element electrically connected to the semiconductor pattern, a plurality of vertical insulators penetrating the stack structure, the vertical insulators arranged in the first direction, and a bit line provided at a side of the stack structure and extending vertically. The bit line electrically connects the semiconductor patterns which are stacked. Each of the vertical insulators includes first and second vertical insulators adjacent to each other. The gate electrode includes a connection portion disposed between the first and second vertical insulators.