Abstract: A method and an apparatus for analyzing a portion of a sample, such as a minute pattern formed on a semiconductor substrate, by employing a Fast Fourier Transformation (FFT) method, in which a magnified image of a region of a sample to be analyzed is generated and converted into data having a frequency by the FFT method. The converted data are analyzed to determine whether the region of the sample is normal or abnormal. It is possible to measure and analyze the sample simultaneously and automatically by using the apparatus in accordance with the method for analyzing the sample.

Abstract: A heat sink for electronic devices, and circuit board and plasma display panel assembly, each equipped with the heat sink. The heat sink for electronic devices, and circuit board and PDP assembly each equipped with the heat sink includes a base portion fixedly attached to a circuit board, a contact portion fixedly and tightly brought into contact with one or more electronic devices, and a plurality of heat radiation fins each extended from the contact portion to a certain distance. A heat radiation fin distant from the base portion has a width shorter than that of a heat radiation fin nearer to the base portion.

Abstract: An automated and integrated substrate inspecting apparatus for performing an EBR/EEW inspection, a defect inspection of patterns and reticle error inspection of a substrate includes a first stage for supporting a substrate; a first image acquisition unit for acquiring a first image of a peripheral portion of the substrate supported by the first stage; a second stage for supporting the substrate; a second image acquisition unit for acquiring a second image of the substrate supported by the second stage; a transfer robot for transferring the substrate between the first stage and the second stage; and a data processing unit, connected to the first image acquisition unit and the second image acquisition unit, for inspecting results of an edge bead removal process and an edge exposure process performed on the substrate using the first image, and for inspecting for defects of patterns formed on the substrate using the second image.

Abstract: A clothes dryer and a method for controlling its operation are disclosed, in which the clothes dryer includes a second motor being separately driven from a drum or a circulation fan to control a cooling fan for cooling a condenser. As for the second motor, a variable speed motor is used and amount of heating of a heater of the clothes dryer is variable. In the method for controlling an operation of a clothes dryer, the cooling fan is operated when a predetermined period of time passes after the cooling fan being stopped during an initial operation, or the cooling fan is operated at a regular speed when a temperature of air circulating reaches a predetermined degree after the cooling fan being operated at a low speed during the initial operation of the clothes dryer. Also, the speed of the cooling fan is varied according to amount of heating of the heater.

Abstract: There is disclosed a cart for transportation, which includes a plurality of trays, a support for supporting the trays, a handle provided to the uppermost tray, and a wheel provided to the lowermost tray, which comprises a connecting pipe 112 attached to each corner of each of the trays 110, a supporting member 120 provided between upper and lower trays, a connecting member 130 for joining the supporting member 120 and the connecting pipe of the tray 110 with each other, a handle connecting member 140 for joining the handle 150 with the connecting pipe of the uppermost tray, and a wheel connecting member 160 for joining the wheel 170 with the connecting pipe of the lowermost tray. The invention can be assembled easily without using coupling devices and shipping charges can reduced as the volume of the components is minimized before the cart is assembled.

Abstract: Disclosed is a sectional table with gussets, in which a table top and legs thereof can be easily assembled in a simple manner by virtue of a gusset mechanism. The sectional table with gussets includes a table top; an inverted hat-shaped channel frame having cylindrical parts on the central portion thereof and flanges on both ends thereof, the cylindrical parts being formed through a deep-drawing process and the flanges being fixedly secured to the underside of the table top; cylindrical gussets inserted into the cylindrical parts of the channel frame at the upper end thereof to be fixedly secured to the cylindrical parts; and table legs secured to the underside of the table top by the gussets by being inserted into openings of the gussets.

Abstract: An electric system of a vehicle includes a motor-generator unit disposed between an engine and a transmission for selectively functioning as a motor for driving the engine, and as an electric generator driven by the engine. A control unit recharges a battery unit (of a voltage higher than 14V) by controlling output electric power of the motor-generator unit, and drives the motor-generator unit with electric power of the battery unit. The control unit counts a number of pulses sequentially received from a magnetic sensor for a predetermined period, and calculates a rotation speed of the motor-generator unit based at least in part a value obtained by dividing the number of the received pulses by the predetermined period.

Abstract: Disclosed is a method for fabricating planar light waveguide circuits, wherein the circuit has a structure that includes a substrate comprised of a core and under-clad layers, an optical circuit, and a plurality of arrayed waveguides coupled thereon. More specifically, the method includes the steps of layering a hard layer on the core layer for forming a mask pattern of the planar light waveguide circuit; forming the mask pattern on the hard layer; layering a photoresist layer on a branch of the optical circuit and the arrayed waveguides of the mask pattern; forming a vertical taper structure on the photoresist layer using a gray scale mask; and, etching the core layer using the photoresist layer with the vertical taper structure and the mask pattern.

Abstract: Disclosed are a flip-chip bonding structure for improving the vertical alignment of an optical device relative to a PLC and a flip-chip bonding method for achieving this structure. The flip-chip bonding structure includes: a semiconductor substrate; a lower-clad layer formed on the upper surface of the semiconductor substrate, wherein the lower-clad layer is depressed on a designated area for mounting an optical device; vertical alignment structures formed on a part of the upper surface of the depressed area of the lower-clad layer and determining a vertical alignment position of the optical device on the semiconductor substrate; electrodes formed on another part of the upper surface of the depressed area of the lower-clad layer; a solder bump formed on the upper surfaces of the electrodes; and, an optical device bonded to the substrate by a flip-chip bonding method using the solder bump.

Abstract: A condenser of a condensing-type clothes dryer is disclosed, which includes a plurality of condensing ducts provided in a middle portion of a circulation duct, the condensing ducts condensing air being circulated there-through after being discharged from a drum; and a plurality of cooling fins provided to be in contact with an outer surface of the condensing ducts, wherein an interval or a pitch of the cooling fins is different partially according to flow rate of air blown from a cooling fan for a heat-exchange with air flowing through the condensing duct. At this time, the pitch or interval of the cooling fins is narrow at a portion where air blown from the cooling fan flows fast, and the pitch or internal of the cooling fins is wide at a portion where air blown from the cooling fan flows slowly.

Abstract: The present invention provides a susceptor power-interface assembly which is used for a chamber process module that includes a power supply, a process chamber and a susceptor, wherein the susceptor includes a susceptor shaft penetrating a bottom of the process chamber and a susceptor base on which a wafer is disposed for the process. The susceptor power-interface assembly electrically connects the power supply to the susceptor base.

Abstract: An external high/low voltage compatible semiconductor memory device includes an internal voltage pad, an internal voltage generation circuit, and an internal voltage control signal generation circuit. The internal voltage pad connects a low external voltage with an internal voltage, and the internal voltage generation circuit generates an internal voltage in response to an internal voltage control signal and a high external voltage. The internal voltage control signal generation circuit generates an internal voltage control signal according to an high or low external voltage. Thus, a database of the semiconductor memory device can be managed without classifying the database into databases for the high voltage and databases for the low voltage because of the internal voltage control signal. In addition, the internal voltage level is stable because charges provided to the internal voltage are regulated according to a voltage level of the external voltage.

Abstract: Disclosed is a sectional table with gussets, in which a table top and legs thereof can be easily assembled in a simple manner by virtue of a gusset mechanism. The sectional table with gussets includes a table top; an inverted hat-shaped channel frame having cylindrical parts on the central portion thereof and flanges on both ends thereof, the cylindrical parts being formed through a deep-drawing process and the flanges being fixedly secured to the underside of the table top; cylindrical gussets inserted into the cylindrical parts of the channel frame at the upper end thereof to be fixedly secured to the cylindrical parts; and table legs secured to the underside of the table top by the gussets by being inserted into openings of the gussets.

Abstract: Disclosed is a method for manufacturing a tapered optical waveguide through which waveguides of different sizes are connected with each other optically. In the method, a photo-resist pattern having an inclined profile is formed on the core layer by means of a gray-scale mask, then the profile of the tapered waveguide can be precisely controlled by controlling the profile of the photo-resist pattern and the etching-selection ratio between the photo-resist and the core layer.

Abstract: The method for controlling a hybrid air conditioning system of a direct coupled motor-driven hybrid electric vehicle includes detecting operating conditions of the air conditioning system; and controlling the hybrid air conditioning system. The hybrid air conditioning system includes a mechanical air conditioner driven by an engine and an electric air conditioner driven by electric power of a battery.

Abstract: Method for controlling a washing and drying machine, for improving drying performance, and saving energy, the method having a drying cycle for supplying heated air into an inner tub to dry laundry in the inner tub, wherein the drying cycle includes a plurality of drying steps each having the steps of rotating a pulsator for a preset time period, and rotating the inner tub for a preset time period in regular and reverse directions, for enhancing flow of the laundry.

Abstract: A color cathode ray tube comprising a panel having a substantially flat outer surface, a funnel mounted on a rear side of the panel, a shadow mask including a plurality of electron beam through holes, and a mask frame for supporting the shadow mask, said mask frame satisfying the following condition: d/v≧0.9, d/h≧0.9 wherein d is a height of a center of a diagonal portion of the mask frame, h is a height of a center of a short side portion of the mask frame, and v is a height of a center of a long side portion of the mask frame.

Abstract: A semiconductor package mounted on a printed circuit board using improved-reliability solder joints is described. The semiconductor package includes a lead frame pad and lead frame lead attached to the solder joints, a semiconductor chip mounted on top of the lead frame pad, wires electrically connecting the semiconductor chip and the lead frame lead, an epoxy molding compound that exposes the lower portion surface of the lead frame pad and part of the lead frame lead, and protrusions fixed to the lower portion surface of the epoxy molding compound and positioned between the solder joints, with the protrusions supporting the semiconductor package when the epoxy molding compound is mounted on the printed circuit board.

Abstract: A visual and audio system for theaters includes a spherical screen having a desired radius of curvature while having a surface reflectivity of 5-50%, and a projector located at a focal point of the spherical screen. The curvature radius of the spherical screen corresponds to the projection distance of the projector. The image projected from the projector at the focal point of the spherical screen is reflected from the spherical screen in a horizontal direction. Accordingly, viewers can view images projected on the screen corresponding to 5-50 time the brightness of images viewed on conventional theaters screens. Central speakers are arranged at the focal point of the spherical screen, so that viewers perceive the sound effect as coming directly from the spherical screen. This visual and audio system can be effectively used in theaters for stereoscopic moves, theaters for high resolution images, and theaters for viewing of images at a higher brightness such as sports arenas, and restaurant theaters, etc.

Abstract: Disclosed are a flip-chip bonding structure for improving the vertical alignment of an optical device relative to a PLC and a flip-chip bonding method for achieving this structure. The flip-chip bonding structure includes: a semiconductor substrate; a lower-clad layer formed on the upper surface of the semiconductor substrate, wherein the lower-clad layer is depressed on a designated area for mounting an optical device; vertical alignment structures formed on a part of the upper surface of the depressed area of the lower-clad layer and determining a vertical alignment position of the optical device on the semiconductor substrate; electrodes formed on another part of the upper surface of the depressed area of the lower-clad layer; a solder bump formed on the upper surfaces of the electrodes; and, an optical device bonded to the substrate by a flip-chip bonding method using the solder bump.