Abstract: A method and apparatus for detecting contaminants in an ion-implanted wafer by annealing and activating the ion-implanted wafer by heating or charging or both, and measuring the thermal wave absorbance generated from the activated wafer.

Abstract: Disclosed is a method for fabricating planar light waveguide circuits, wherein the circuit has a structure that includes a substrate comprised of a core and under-clad layers, an optical circuit, and a plurality of arrayed waveguides coupled thereon. More specifically, the method includes the steps of layering a hard layer on the core layer for forming a mask pattern of the planar light waveguide circuit; forming the mask pattern on the hard layer; layering a photoresist layer on a branch of the optical circuit and the arrayed waveguides of the mask pattern; forming a vertical taper structure on the photoresist layer using a gray scale mask; and, etching the core layer using the photoresist layer with the vertical taper structure and the mask pattern.

Abstract: An apparatus for monitoring a photolithography process includes a measurer and a data processor. The measurer measures an optical characteristic of a substrate. The data processor determines defectiveness of the substrate based on the optical the measurer.

Abstract: A method for classifying defects of an object includes irradiating lights having different wavelengths onto the object to create an inspection spot on the object, collecting scattered lights generated by the irradiated lights scattering from the inspection spot, and classifying defects of the object by type of defect by analyzing the scattered lights. An apparatus for classifying defects of an object includes light creating means emitting lights having different wavelengths to create an inspection spot on the object, and a detecting member for collecting scattered lights that are created from the lights scattering from the inspection spot, wherein the scattered lights are analyzed and classified in accordance with defects positioned on the inspection spot of the object.

Abstract: A packaged semiconductor device (a wafer-level chip scale package) containing a conductive adhesive material as an electrical interconnect route between the semiconductor die and a patterned conductive substrate is described. The patterned conductive substrate acts not only as a substrate, but also as a redistribution layer that converts the dense pad layout of the die to a larger array configuration of the solder balls in the circuit board. Using the invention allows the formation of a lower priced chip scale package that also overcomes the restriction of the die size used in die-sized chip packages and the input-output pattern that can be required by the printed circuit board. Thus, the invention can provide a familiar pitch (i.e.,interface) to the printed circuit board for any small die.

Abstract: There is disclosed a connection structure and method of a plasma display panel that is adaptive for preventing a short circuit caused by conductive ball mass and improving connection cohesiveness. A connection structure of a plasma display panel according to an embodiment of the present invention includes a first substrate having a plurality of panel-electrodes; a second substrate having a plurality of connecting-electrodes arranged to correspond to the panel-electrodes; and a connection member located between the first substrate and the second substrate to directly connect the connecting-electrodes with the panel-electrodes upon compression. Accordingly, there is no conductive ball, so the occurrence of short circuit caused by the conductive ball mass of prior art is prevented and, at the same time, the copper electrode penetrates the panel-electrode, thereby improving connection cohesiveness.

Abstract: Disclosed are a flip-chip bonding structure for improving the vertical alignment of an optical device relative to a PLC and a flip-chip bonding method for achieving this structure. The flip-chip bonding structure includes: a semiconductor substrate; a lower-clad layer formed on the upper surface of the semiconductor substrate, wherein the lower-clad layer is depressed on a designated area for mounting an optical device; vertical alignment structures formed on a part of the upper surface of the depressed area of the lower-clad layer and determining a vertical alignment position of the optical device on the semiconductor substrate; electrodes formed on another part of the upper surface of the depressed area of the lower-clad layer; a solder bump formed on the upper surfaces of the electrodes; and, an optical device bonded to the substrate by a flip-chip bonding method using the solder bump.

Abstract: Disclosed are a chip scale package and a method of fabricating the chip scale package. The chip scale package comprises an insulating layer formed on the upper surface of a chip provided with a plurality of terminals on its one surface, a plurality of conductive layers formed on the insulating layer and spaced from each other by a designated distance so as to be connected to each of a plurality of the terminals, and a plurality of electrode surfaces formed on each of the upper surfaces of a plurality of the conductive layers. The chip scale package is miniaturized in the whole package size. Further, the method of fabricating the chip scale package does not require a wire-bonding step or a via hole forming step, thereby simplifying the fabrication process of the chip scale package and improving the reliability of the chip scale package.

Abstract: In a method and an apparatus for inspecting a wafer surface, a wafer is loaded into a chamber. An incident light including a first light for sensing a vertical position of the wafer and a second light for inspecting the wafer surface is irradiated onto the wafer. The first light is reflected on an inspection region or a next inspection region of the wafer and is detected to control a wafer position. The second light is scattered on the inspection region and is detected to inspect the wafer surface of the inspection region. Position information of a wafer is examined and a position of the wafer is adjusted before inspecting a surface of inspection region of a wafer so as to enable accurate inspection of the wafer surface.

Abstract: A method for the preparation of water-soluble chitosan with high purity and biological activity includes steps of: reacting chitosan oligo sugar acid salt, covalently bonded to an organic or inorganic acid, with trialkylamine in phosphate buffered saline followed by addition of an organic solvent to remove acid salt at C-2 position; adding the thus obtained reaction mixture to an inorganic acid to remove trialkylamine salt at C-6 position; and passing the thus obtained free amine chitosan through an activated carbon/ion exchange resin. The free amine chitosan is water-soluble and has a high bioavailability for application to the medicine and food industries.

Abstract: A cathode ray tube comprising a panel of which an outer surface is substantially flat; a shadow mask installed with a certain interval from an inner surface of the panel, having a plurality of apertures through which electron beams pass, and formed as a pin-cushion shape in which long and short sides of the shadow mask are inwardly concaved; and the mask frame for fixing and supporting the shadow mask, wherein long and short sides of the mask frame are slanted from ends toward centers thereof in order to maintain a predetermined interval with the long and short sides of the shadow mask. According to this, a strength of the shadow mask is increased and an influence of a magnetic field is reduced thus to obtain an optimum quality.

Abstract: Method for controlling a drying process of a washing and drying machine including a preheating step for tightly closing and heating an inner tub for preparing an environment favorable for vaporization of water by elevating a temperature of the inner tub within a short time period, and a drying step for supplying heated air to the inner tub, to make heat exchange between the heated air and laundry, for drying the laundry, whereby improving a drying performance and reducing occurrence of environmental problem.

Abstract: A method of monitoring a density profile of impurities, the method including presetting a monitoring position of a thin layer coated on a substrate, the density profile of impurities being monitored from the monitoring position in a direction of thickness of the thin layer, moving an exposer for exposing a local area of the thin layer to the monitoring position, exposing the local area of the thin layer along the direction of thickness of the thin layer, forming a shape profile of the exposed local area of the thin layer, and monitoring the density profile of impurities by determining a density of impurities in accordance with the shape profile, and an apparatus therefor. The impurity density profile may be monitored without destroying a substrate on which a thin layer is coated, and an amount of impurities used for forming the thin layer may be monitored and controlled in real-time.

Abstract: The present invention relates to novel aminopeptidase derived from Bacillus licheniformis, a gene encoding the aminopeptidase, an expression vector containing the gene, a cell transformant transfected with the expression vector and a process for preparing a natural type protein using thereof. More particularly, the present invention relates to a gene encoding aminopeptidase which is cloned and manufactured using the recombinant DNA technique, an expression vector containing the gene, a cell transformant transfected with the expression vector and a recombinant aminopeptidase which is necessary to produce recombinant human growth hormone in a natural type protein and can be expressed in a high yield more stably and advantageously, compared with conventional methods for the purification.

Abstract: A method of measuring a concentration of dopants of an objective thin film includes measuring a concentration of dopants of a first wafer, forming the objective thin film on the first wafer to form a second wafer, measuring a concentration of dopants of the second wafer, and obtaining the concentration of dopants of the objective thin film by subtracting the concentration of dopants of the first wafer from the concentration of dopants of the second wafer. Therefore, the concentration of dopants of the objective thin film may be measured without the use of a criterion wafer, thereby reducing measuring time. Also, the concentration of dopants of the objective thin film may be easily controlled, and therefore promptly corrected if necessary.

Abstract: A method of measuring a concentration of a material includes irradiating an infrared light onto a substrate having a layer including a first material and dopants, wherein the infrared light is partially absorbed by and partially transmitted through the substrate including the layer. Intensities of the infrared light absorbed in the first material and the dopants are computed according to light wave numbers by utilizing a difference between intensities of the infrared light before and after transmitting the substrate and layer and by utilizing a difference between intensities of the infrared light absorbed in the substrate and layer and absorbed in only the substrate. Concentrations of the dopants are obtained by utilizing a ratio of light wave number regions corresponding to predetermined intensities of infrared light absorbed in the dopants relative to light wave number regions corresponding to the predetermined intensity of infrared light absorbed in the first material.

Abstract: The present invention provides certain alpha-amino acids and derivatives thereof, such as, but not limited to, esters, amides and salts. These derivatives may comprise such representative side groups as a phenyl, pyridyl, piperidinyl, tetrahydropyranyl, tetrahydrothiopyranyl, or thienyl group. The present invention further provides a method for synthesizing alpha-amino acids and derivatives thereof via a modified Ugi type reaction using an aldehyde, ammonium formate and a C1-C5 alkyl isocyanide. The compounds provided by this method are useful in the development of new pharmaceuticals for the treatment of human diseases.

Abstract: A method for monitoring an ion implanter includes positioning a substrate behind an interceptor for intercepting a portion of an ion beam to be irradiated toward the substrate, irradiating a first ion beam toward the substrate to form a first shadow on the substrate, rotating the substrate about a central axis of the substrate, irradiating a second ion beam toward the substrate to form a second shadow on the substrate, and measuring a dosage of ions implanted into the substrate to monitor whether the rotation of the substrate has been normally performed. Preferably, a dosage of ions implanted into the substrate is calculated from a thermal wave value of the substrate and whether the rotation of the substrate has been normally performed is monitored by comparing the thermal wave value corresponding to the first shadow with a reference thermal wave value.

Abstract: Disclosed are a flip-chip bonding structure for improving the vertical alignment of an optical device relative to a PLC and a flip-chip bonding method for achieving this structure. The flip-chip bonding structure includes: a semiconductor substrate; a lower-clad layer formed on the upper surface of the semiconductor substrate, wherein the lower-clad layer is depressed on a designated area for mounting an optical device; vertical alignment structures formed on a part of the upper surface of the depressed area of the lower-clad layer and determining a vertical alignment position of the optical device on the semiconductor substrate; electrodes formed on another part of the upper surface of the depressed area of the lower-clad layer; a solder bump formed on the upper surfaces of the electrodes; and, an optical device bonded to the substrate by a flip-chip bonding method using the solder bump.

Abstract: There is disclosed a cart for transportation, which includes a plurality of trays, a support for supporting the trays, a handle provided to the uppermost tray, and a wheel provided to the lowermost tray, which comprises a connecting pipe 112 attached to each corner of each of the trays 110, a supporting member 120 provided between upper and lower trays, a connecting member 130 for joining the supporting member 120 and the connecting pipe of the tray 110 with each other, a handle connecting member 140 for joining the handle 150 with the connecting pipe of the uppermost tray, and a wheel connecting member 160 for joining the wheel 170 with the connecting pipe of the lowermost tray. The invention can be assembled easily without using coupling devices and shipping charges can reduced as the volume of the components is minimized before the cart is assembled.