Abstract: A memory device, such as an MRAM memory, includes a memory array with a plurality of bit cells. The memory array is configured to store trimming information and store user data. A sense amplifier is configured to read the trimming information from the memory array, and a trimming register is configured to receive the trimming information from the sense amplifier. The sense amplifier is configured to receive the trimming information from the trimming register so as to operate in a trimmed mode for reading the user data from the memory array.

Abstract: A memory device including a memory array with a plurality of memory macros, a power supplying circuit, and a controller is provided. The power supplying circuit is coupled to the memory array. The controller is coupled to the memory array. The power supplying circuit is configured to provide power to perform write operations to a number of the memory macros at the same time. The number of the memory macros for the write operations performed at the same time is not higher than a maximum number of the memory macros. The controller obtains the maximum number of the memory macros for the write operations performed at the same time by the power supplying circuit. The controller re-arranges a schedule for a sequence of the write operations of the memory macros to generate a re-arranged schedule. The maximum number is taken as a threshold value. In the re-arranged schedule, a number of part of the memory macros for the write operations performed at the same time is equal to or less then the threshold value.

Abstract: A memory device is provided. The memory device includes a first transistor and a second transistor connected in series with the first transistor. The second transistor is programmable between a first state and a second state. A bit line connected to the second transistor. A sense amplifier connected to the bit line. The sense amplifier is operative to sense data from the bit line. A feedback circuit connected to the sense amplifier, wherein the feedback circuit is operative to control a bit line current of the bit-line.

Abstract: Disclosed herein are related to a memory cell including one or more programmable resistors and a control transistor. In one aspect, a programmable resistor includes a gate structure and one or more source/drain structures for forming a transistor. A resistance of the programmable resistor may be set by applying a voltage to the gate structure, while the control transistor is enabled. Data stored by the programmable resistor can be read by sensing current through the programmable resistor, while the control transistor is disabled. In one aspect, the one or more programmable resistors and the control transistor are implemented by same type of components, allowing the memory cell to be formed in a compact manner through a simplified the fabrication process.

Abstract: Systems and methods for floating-point processors and methods for operating floating-point processors are provided. A floating-point processor includes a quantizer, a compute-in-memory device, and a decoder. The floating-processor is configured to receive an input array in which the values of the input array are represented in floating-point format. The floating-point processor may be configured to convert the floating-point numbers into integer format so that multiply-accumulate operations can be performed on the numbers. The multiply-accumulate operations generate partial sums, which are in integer format. The partial sums can be accumulated until a full sum is achieved, wherein the full sum can then be converted to floating-point format.

Abstract: A circuit includes cross coupled invertors including a first invertor and a second inventor. The first invertor and the second invertor are cross coupled at a first data node and a second data node. An input unit is coupled between the cross-coupled invertors and a power node. The input unit controls the cross-coupled invertors in response to a first input signal received at a first input terminal of the input unit and a second input signal received at a second input terminal of the input unit. A first transistor is connected between the power node and a supply node. The first transistor connects the power node to the supply node in response to an enable signal changing to a first value. A second transistor is connected between the power node and ground. The second transistor connects the power node to the ground in response to the enable signal changing to a second value.

Abstract: A memory device includes a computing-in-memory macro and a clock generating circuit. The computing-in-memory macro is configured to perform in-memory computing based on a first clock signal. The clock generating circuit is arranged within the computing-in-memory macro and configured to generate the first clock signal. A frequency of the first clock signal is modified according to a condition of the computing-in-memory macro to cause the first clock signal to conform to an operation speed of the in-memory computing.

Abstract: A memory circuit includes a first driver circuit, a first column of memory cells coupled to the first driver circuit, a first current source, a tracking circuit configured to track a leakage current of the first column of memory cells, and a footer circuit coupled to the first column of memory cells, the first current source and the tracking circuit.

Abstract: A system includes: a processor; a register configured to store a plurality of words, non-volatile memory having a plurality of cells, each cell corresponding to one of the words of the register, and wherein the each cell of the plurality of cells are set to an initial reset value; a first controller that in response to a loss in power: determines the word stored by the register; and changes the initial reset value of the cell of the non-volatile memory corresponding to the determined word stored by the register to a set value; a second controller that in response to detecting a restoration in power: identifies the cell having the set value; writes the word corresponding to the identified cell to the register; and resets the cells of the non-volatile memory to the initial reset value.

Abstract: Systems and methods of generating a security key for an integrated circuit device include generating a plurality of key bits with a physically unclonable function (PUF) device. The PUF can include a random number generator that can create random bits. The random bits may be stored in a nonvolatile memory. The number of random bits stored in the nonvolatile memory allows for a plurality of challenge and response interactions to obtain a plurality of security keys from the PUF.

Abstract: A memory architecture includes: a plurality of cell arrays each of which comprises a plurality of bit cells, wherein each of bit cells of the plurality of cell arrays uses a respective variable resistance dielectric layer to transition between first and second logic states; and a control logic circuit, coupled to the plurality of cell arrays, and configured to cause a first information bit to be written into respective bit cells of a pair of cell arrays as an original logic state of the first information bit and a logically complementary logic state of the first information bit, wherein the respective variable resistance dielectric layers are formed by using a same recipe of deposition equipment and have different diameters.

Abstract: A system includes a global generator and local generators. The global generator is coupled to a memory array, and is configured to generate global signals, according to a number of a computational output of the memory array. The local generators are coupled to the global generator and the memory array, and are configured to generate local signals, according to the global signals. Each one of the local generators includes a first reference circuit and a local current mirror. The first reference circuit is coupled to the global generator, and is configured to generate a first reference signal at a node, in response to a first global signal of the global signals. The local current mirror is coupled to the first reference circuit at the node, and is configured to generate the local signals, by mirroring a summation of at least one signal at the node.

Abstract: Memories are provided. A memory includes a first memory array, a second memory array and a read circuit. The first memory array is configured to store first data. The second memory array is configured to store second data that is complementary to the first data. The read circuit includes a decoding circuit, a sensing circuit and an output buffer. The decoding circuit is configured to provide a first signal according to the first data and a second signal according to the second data in response to an address signal. The sensing circuit is configured to provide a first sensing signal according to a reference signal and the first signal, and a second sensing signal according to the reference signal and the second signal. The output buffer is configured to provide the first sensing signal or the second sensing signal as an output according to a control signal.

Abstract: A semiconductor device includes a memory circuit, an error correction code circuit, a register circuit and a write circuit. The memory circuit is configured to output, in response to at least one address signal, first data associated with at least one memory cell in the memory circuit. The error correction code circuit is configured to convert the first data to second data and configured to generate error information when the first data is not identical to the second data. The register circuit is configured to output, based on the error information, reset information corresponding to the at least one address signal. The write circuit is configured to reset the at least one memory cell according to the reset information. A method is also disclosed herein.

Abstract: A memory device includes: a memory cell array comprising a plurality of memory cells; a temperature sensor configured to detect a temperature of the memory cell array; a write circuit configured to write data into the plurality of memory cells; and a controller coupled to the temperature sensor and the write circuit, wherein the controller is configured to determine a target write pulse width used by the write circuit based on the detected temperature of the memory device.

Abstract: The disclosed invention presents a self-tracking reference circuit that compensates for IR drops and achieves the target resistance state at different temperatures after write operations. The disclosed self-tracking reference circuit includes a replica access path, a configurable resistor network, a replica selector mini-array and a step current generator that track PVT variations to provide a PVT tracking level for RRAM verify operation.

Abstract: A semiconductor device includes a memory circuit, an error correction code circuit, a register circuit and a write circuit. The memory circuit is configured to output, in response to at least one address signal, first data associated with at least one memory cell in the memory circuit. The error correction code circuit is configured to convert the first data to second data and configured to generate error information when the first data is not identical to the second data. The register circuit is configured to output, based on the error information, reset information corresponding to the at least one address signal. The write circuit is configured to reset the at least one memory cell according to the reset information. A method is also disclosed herein.

Abstract: A method for performing an in-memory computation includes: storing data in memory cells of a memory array, the data including weights for computation; determining whether an update command to change at least one of the weights is received; in response to receiving the update command, performing a write operation on the memory array to update the at least one weight; and disabling the write operation on the memory array until receiving a next update command to change the at least one weight.

Abstract: A semiconductor device and a method of manufacturing the same are provided. The semiconductor device includes a first transistor, a first resistive random access memory (RRAM) resistor, and a second RRAM resistor. The first resistor includes a first resistive material layer, a first electrode shared by the second resistor, and a second electrode. The second resistor includes the first electrode, a second resistive material layer, and a third electrode. The first electrode is electrically coupled to the first transistor.

Abstract: An integrated circuit includes a first encoder, a compute in-memory (CIM) array and a de-encoder. The first encoder is configured to quantize a first received signal into a first signal. The first received signal has a first floating point number format. The first signal has an integer number format. The compute in-memory (CIM) array is coupled to the first encoder. The CIM array is configured to generate a CIM signal in response to at least the first signal. The CIM signal has the integer number format. The de-encoder is coupled to the CIM array, and is configured to generate a first output signal in response to the CIM signal. The first output signal has a second floating point number format.