Abstract: A method for fabricating a high-voltage (HV) transistor is provided. The method includes providing a substrate, having a first isolation structure and a second isolation structure in the substrate and a recess in the substrate between the first and second isolation structures. Further, a hydrogen annealing process is performed over the recess. A sacrificial dielectric layer is formed on the recess. The sacrificial dielectric layer is removed, wherein a portion of the first and second isolation structures is also removed. A gate oxide layer is formed in the recess between the first and second isolation structures after the hydrogen annealing process.

Abstract: A method for fabricating of semiconductor device is provided, including providing a substrate. A first trench isolation and a second trench isolation are formed in the substrate. A portion of the substrate is etched to have a height between a top and a bottom of the first and second trench isolations. A germanium (Ge) doped layer region is formed in the portion of the substrate. A fluorine (F) doped layer region is formed in the portion of the substrate, lower than and overlapping with the germanium doped layer region. An oxidation process is performed on the portion of the substrate to form a gate oxide layer between the first and second trench isolations.

Abstract: The disclosure discloses a structure of high-voltage (HV) transistor which includes a substrate. An epitaxial doped structure with a first conductive type is formed in the substrate, wherein a top portion of the epitaxial doped structure includes a top undoped epitaxial layer. A gate structure is disposed on the substrate and at least overlapping with the top undoped epitaxial layer. A source/drain (S/D) region with a second conductive type is formed in the epitaxial doped structure at a side of the gate structure. The first conductive type is different from the second conductive type.

Abstract: A semiconductor device includes a semiconductor substrate, a recess, a first gate oxide layer, and a gate structure. The semiconductor substrate includes a first region and a second region adjacent to the first region. The recess is disposed in the first region of the semiconductor substrate, and an edge of the recess is located at an interface between the first region and the second region. At least a part of the first gate oxide layer is disposed in the recess. The first gate oxide layer includes a hump portion disposed adjacent to the edge of the recess, and a height of the hump portion is less than a depth of the recess. The gate structure is disposed on the first region and the second region of the semiconductor substrate, and the gate structure overlaps the hump portion of the first gate oxide layer in a vertical direction.

Abstract: System and methods are provided that can address cold-start problems in database keyword searches. The search system generates machine-learned values for new items based on historical signals for already existing items. These initial values are generated at the time of new item's inclusion in the search index. The values are used as input in a ranking model to rank search results for a user query. The initial values for the new items predict user engagement with the new items based on historical data for existing items and increase the visibility of new items to accumulate user interaction data for the new items.

Abstract: A touch display apparatus is disclosed, which includes a touch display panel and a driving circuit coupled to the touch display panel. The touch display panel is configured for display and touch sensing, and includes plural touch sensing pads. The driving circuit is configured to provide a voltage signal with a test pattern to the touch sensing pads, and is configured to determine whether an open circuit or a short circuit exists in the touch display panel from a detected signal in response to the voltage signal.

Abstract: A manufacturing method of a semiconductor device includes the following steps. An opening is formed penetrating a dielectric layer on a semiconductor substrate. A stacked structure is formed on the dielectric layer. The stacked structure includes a first semiconductor layer partly formed in the opening and partly formed on the dielectric layer, a sacrificial layer formed on the first semiconductor layer, and a second semiconductor layer formed on the sacrificial layer. A patterning process is performed for forming a fin-shaped structure including the first semiconductor layer, the sacrificial layer, and the second semiconductor layer. An etching process is performed to remove the sacrificial layer in the fin-shaped structure. The first semiconductor layer in the fin-shaped structure is etched to become a first semiconductor wire by the etching process. The second semiconductor layer in the fin-shaped structure is etched to become a second semiconductor wire by the etching process.

Abstract: An aqueous lithium-ion battery and an electrode used therein are provided, wherein the electrode includes a current collector, a coating layer, and a composite layer. The coating layer is disposed on at least one surface of the current collector, and the coating layer contains an active material. The composite layer is disposed on a surface of the coating layer. The composite layer includes a first film and a second film, wherein the first film is between the second film and the surface of the coating layer, and the water contact angle of the first film is greater than the water contact angle of the second film.

Abstract: A knob device is applicable to a touch panel. The touch panel includes a plurality of panel sensors. The knob device includes a knob cover, a sensing pad, a compensation sensor and a switch. The sensing pad is arranged between the knob cover and the touch panel. The switch is configured to selectively connect the sensing pad to the compensation sensor. When a move event of the knob device occurs, the switch is turned on and the sensing pad is electrically connected to the compensate sensor through the switch, such that a feedback loop is generated by the sensing pad, the compensation sensor and the touch panel to change a quantity of electric charge of at least one of the plurality of panel sensors. When a touch and rotation event of the knob device occurs, a location of the sensing pad controls a rotation sensing signal.

Abstract: A structure of semiconductor device is provided, including a substrate. A first trench isolation and a second trench isolation are disposed in the substrate. A height of a portion of the substrate is between a top and a bottom of the first and second trench isolations. A gate insulation layer is disposed on the portion of the substrate between the first and second trench isolations. A germanium (Ge) doped layer region is disposed in the portion of the substrate just under the gate insulation layer. A fluorine (F) doped layer region is in the portion of the substrate, lower than and overlapping with the germanium doped layer region.

Abstract: A data writing method, a memory controlling circuit unit and a memory storage device are provided. The method includes: obtaining a data; encoding a plurality of sub-data in the data to obtain a plurality of first error checking and correction codes respectively corresponding to the plurality of sub-data; writing the plurality of sub-data and the plurality of first error checking and correction codes into a first physical programming unit; encoding the plurality of sub-data to obtain a second error checking and correction code; and writing the second error checking and correction code into a second physical programming unit.

Abstract: A manufacturing method of a semiconductor device includes the following steps. An opening is formed penetrating a dielectric layer on a semiconductor substrate. A stacked structure is formed on the dielectric layer. The stacked structure includes a first semiconductor layer partly formed in the opening and partly formed on the dielectric layer, a sacrificial layer formed on the first semiconductor layer, and a second semiconductor layer formed on the sacrificial layer. A patterning process is performed for forming a fin-shaped structure including the first semiconductor layer, the sacrificial layer, and the second semiconductor layer. An etching process is performed to remove the sacrificial layer in the fin-shaped structure. The first semiconductor layer in the fin-shaped structure is etched to become a first semiconductor wire by the etching process. The second semiconductor layer in the fin-shaped structure is etched to become a second semiconductor wire by the etching process.

Abstract: A decoding method, a memory storage device and a memory controlling circuit unit are provided. The method includes: receiving a read command sequence for reading a plurality of bits from the memory cells; calculating a first count value of a first value and a second count value of a second value in the bits; and adjusting a decoding parameter corresponding to the bits to a specific decoding parameter according to the first count value and the second count value, and performing a decoding operation according to the specific decoding parameter, where the adjusted decoding parameter affects a probability that the bits are considered as an error bit in the decoding operation.

Abstract: The present invention discloses a method for forming a semiconductor device with a reduced silicon horn structure. After a pad nitride layer is removed from a substrate, a hard mask layer is conformally deposited over the substrate. The hard mask layer is then etched and trimmed to completely remove a portion of the hard mask layer from an active area and a portion of the hard mask layer from an oblique sidewall of a protruding portion of a trench isolation region around the active area. The active area is then etched to form a recessed region. A gate dielectric layer is formed in the recessed region and a gate electrode layer is formed on the gate dielectric layer.

Abstract: A decoding method, a memory storage device and a memory controlling circuit unit are provided. The method includes: receiving a read command sequence for reading a plurality of bits from the memory cells; calculating a first count value of a first value and a second count value of a second value in the bits; and adjusting a decoding parameter corresponding to the bits to a specific decoding parameter according to the first count value and the second count value, and performing a decoding operation according to the specific decoding parameter, where the adjusted decoding parameter affects a probability that the bits are considered as an error bit in the decoding operation.

Abstract: A semiconductor device includes a single diffusion break (SDB) structure dividing a fin-shaped structure into a first portion and a second portion, an isolation structure on the SDB structure, a first spacer adjacent to the isolation structure, and a metal gate adjacent to the isolation structure. Preferably, a top surface of the first spacer is lower than a top surface of the isolation structure and a bottom surface of the first spacer is lower than a bottom surface of the metal gate.

Abstract: A method for fabricating semiconductor device includes the steps of: providing a substrate having a fin-shaped structure thereon; forming a single diffusion break (SDB) structure in the substrate to divide the fin-shaped structure into a first portion and a second portion; forming a first gate structure on the SDB structure; forming an interlayer dielectric (ILD) layer around the first gate structure; transforming the first gate structure into a first metal gate; removing the first metal gate to form a first recess; and forming a dielectric layer in the first recess.

Abstract: One embodiment of the invention provides an optical lens including a first lens group with at least two lenses, a second lens group with at least two lenses, and a parting line located between the first lens group and the second lens group. Each of the lenses of the first and the second lens groups is associated with a respective distance, the respective distance is a distance value measured along an optical axis between two focal points of two end points of an image circle diameter formed at an image plane of the optical lens, under the condition that an optical center of one of the lenses is shifted a distance away from the optical axis. The two lenses with the two largest distance values among all lenses are disposed on the same side of the parting line.

Abstract: A heat dissipation apparatus includes a heat sink unit, a flow guiding structure and a fan. In addition, the heat sink unit includes a base and a fin set arranged on the base. The flow guiding structure includes an air shield and an engagement frame arranged at one end of the air shield. The air shield includes an enclosure space formed at an internal thereof. The enclosure space includes an opening formed at two ends of the air shield respectively, and the air shield covers an exterior of the fin set with the enclosure space. The engagement frame is selectively arranged at an exterior of any one of the openings of the air shield; and a fan is arranged on the engagement frame.

Abstract: A method for fabricating semiconductor device includes the steps of: providing a substrate having a fin-shaped structure thereon; forming a single diffusion break (SDB) structure in the substrate to divide the fin-shaped structure into a first portion and a second portion; forming a first gate structure on the SDB structure; forming an interlayer dielectric (ILD) layer around the first gate structure; transforming the first gate structure into a first metal gate; removing the first metal gate to form a first recess; and forming a dielectric layer in the first recess.