Abstract: A polymer composition including a polymer having a hydroxyl group and a histidine or a histidine derivative grafted to the polymer having a hydroxyl group. A polymer material is also provided, including a polymer composition which includes a polymer having a hydroxyl group, and a histidine or a histidine derivative grafted to the polymer having a hydroxyl group.

Abstract: A package substrate and a method for forming the package substrate are disclosed. The package substrate includes an interposer having a plurality of conductive through vias and a first insulating layer formed on the sidewalls of the conductive through vias, a second insulating layer formed on one side of the interposer, and a plurality of conductive vias formed in the second insulating layer and electrically connected to the conductive through vias. By increasing the thickness of the first insulating layer, the face diameter of the conductive through vias can be reduced, and the layout density of the conductive through vias in the interposer can thus be increased.

Abstract: A package substrate and a method of fabricating the package substrate are provided. The package substrate may include an interposer having at least one conductive through via, a photo-sensitive dielectric layer formed on one side of the interposer, and at least one conductive via formed in the photo-sensitive dielectric layer and electrically connected to the conductive through via. By means of a photo lithography process with high alignment accuracy, at least one via with an extremely small diameter can be formed on the photo-sensitive dielectric layer and align with the conductive through via. Therefore, the conductive through via can have its diameter reduced as required, without considering the alignment with the at least one via. Accordingly, the interconnection density of the conductive through via on the interposer is increased.

Abstract: A package substrate and a method of fabricating the package substrate are provided. The package substrate includes a substrate having a top surface and a bottom surface opposing the top surface; an insulating protective layer formed on the top surface of the substrate; an interposer embedded in and exposed from the insulating protective layer; and passive components provided on or embedded in the interposer. By integrating the passive components into the package substrate, when a chip is provided on the interposer, the conductive path between the chip and the passive components can be shortened, and the pins of the chip have a stable voltage. Therefore, the overall electrical performance is enhanced.

Abstract: A wafer-leveled chip packaging method, comprising the steps of: providing a wafer; attaching at least one first chip to the wafer; forming a first insulating layer on the wafer; forming a plurality of first conductive vias penetrating the first insulating layer, wherein parts of the first conductive vias are electrically connected with the first chip; forming a conductive pattern layer on the surface of the first insulating layer wherein the conductive pattern layer is electrically connected with the first conductive vias; forming a plurality of through holes penetrating the wafer; filling a second insulating layer in the through holes; and forming a plurality of second conductive vias in the second insulating layer, wherein the second conductive vias are electrically connected with the first conductive vias.

Abstract: A flexible circuit structure with stretchability comprises a flexible substrate, a metal layer, and a plurality of flexible bumps. The metal layer is formed on the flexible substrate. These flexible bumps are formed on the metal layer and the flexible substrate.

Abstract: The present disclosure provides a brush polymer, including: a linear polymer main chain; and brush structural side chains, including: a hydrophobic molecular branch, and a hydrophilic molecular branch and/or an anti-biofilm/or an anti-microbial molecular branch, wherein the linear polymer main chain is conjugated to the side chains by covalent bonds formed between a hydroxyl group and a reactive functional group, wherein the reactive functional group includes: isocyanate, carboxyl, or epoxy. The present disclosure also provides a medical application of the brush polymer.

Abstract: A plane light source including a circuit substrate, a plurality of sets of side-view light-emitting devices (LEDs), and a diffusive light-guiding layer is provided. The side-view LEDs are arranged in array over the circuit substrate and are electrically connected with the circuit substrate. The diffusive light-guiding layer covers the side-view LEDs, wherein the diffusive light-guiding layer includes a plurality of diffusive light-guiding units arranged in array and connected to each other. Each of the diffusive light-guiding units is respectively corresponded to illumination coverage of one set of side-view LEDs. Each set of side-view LEDs at least includes two side-view LEDs for emitting light respectively along two different directions and towards into one single diffusive light-guiding units.

Abstract: The description provides a biodegradable hyaluronic acid derivative including at least one modified hyaluronic acid repeating unit represented by the formula (HA)-[O(C?O)NH-M]p, wherein HA is a unit including N-acetyl-D-glucosamine and D-glucuronic acid, M is a modifying moiety containing a C2-16 hydrocarbyl group, and p is an integer of 1 to 4.

Abstract: The invention provides a biodegradable hyaluronic acid derivative including at least one modified hyaluronic acid repeating unit represented by the formula (HA)-[O(C?O)NH-M]p, wherein HA is a unit including N-acetyl-D-glucosamine and D-glucuronic acid, M is a modifying moiety containing a C2-16 hydrocarbyl group, and p is an integer of 1 to 4.

Abstract: This invention relates to a wafer-leveled chip packaging method, comprising the steps of: providing a wafer; attaching at least one first chip to the wafer; forming a first insulating layer on the wafer; forming a plurality of first conductive vias penetrating the first insulating layer, wherein parts of the first conductive vias are electrically connected with the first chip; forming a conductive pattern layer on the surface of the first insulating layer wherein the conductive pattern layer is electrically connected with the first conductive vias; forming a plurality of through holes penetrating the wafer; filling a second insulating layer in the through holes; and forming a plurality of second conductive vias in the second insulating layer, wherein the second conductive vias are electrically connected with the first conductive vias.

Abstract: The description provides a biodegradable hyaluronic acid derivative including at least one modified hyaluronic acid repeating unit represented by the formula (HA)-[O(C?O)NH-M]p, wherein HA is a unit including N-acetyl-D-glucosamine and D-glucuronic acid, M is a modifying moiety containing a C2-16 hydrocarbyl group, and p is an integer of 1 to 4.

Abstract: A plurality of coaxial leads is made within a single via in a circuit substrate to enhance the density of vertical interconnection so as to match the demand for higher density multi-layers circuit interconnection between top circuit layer and bottom circuit layer of the substrate. Coaxial leads provide electromagnetic interference shielding among the plurality of coaxial leads in a single via.

Abstract: A wafer-leveled chip packaging method, comprising the steps of: providing a wafer; attaching at least one first chip to the wafer; forming a first insulating layer on the wafer; forming a plurality of first conductive vias penetrating the first insulating layer, wherein parts of the first conductive vias are electrically connected with the first chip; forming a conductive pattern layer on the surface of the first insulating layer wherein the conductive pattern layer is electrically connected with the first conductive vias; forming a plurality of through holes penetrating the wafer; filling a second insulating layer in the through holes; and forming a plurality of second conductive vias in the second insulating layer, wherein the second conductive vias are electrically connected with the first conductive vias.

Abstract: A circuit structure and a fabrication method thereof manly use a plurality of wires to connect in series a plurality of pads to form a stretchable circuit. Each of the wires has a first end, a second end and an intermediate segment located between the first end and the second end, wherein the first end and the second end are respectively connected to different pads, and the position of the intermediate segment is higher than the positions of the first end and the second end. Since the connection manner of the wires and the pads has 3-D freedoms, the circuit structure can withstand both horizontal and vertical deformations and has an outstanding reliability.

Abstract: A medical dressing is provided. The medical dressing includes a first and a second woven layers respectively having a fiber of polyurethane or a yarn of polyurethane; and a plurality of linear support portions woven between the first and second woven layers.

Abstract: In one example embodiment, a flexible circuit structure with stretchability is provided that includes a flexible substrate, a plurality of flexible bumps formed on the flexible substrate, and a metal layer formed on the plurality of flexible bumps and the flexible substrate.

Abstract: The invention provides a biodegradable hyaluronic acid derivative including at least one modified hyaluronic acid repeating unit represented by the formula (HA)-[O(C?O)NH-M]p, wherein HA is a unit including N-acetyl-D-glucosamine and D-glucuronic acid, M is a modifying moiety containing a C2-16 hydrocarbyl group, and p is an integer of 1 to 4.

Abstract: The present invention discloses an electronic device package and a method of the package. In particular, an electronic device package and a method of the package suitable for a bumpless electronic device package with enhanced electrical performance and heat-dissipation efficiency are disclosed. The method comprises: providing a substrate having a plurality of vias and a plurality of electronic devices; forming a gluing layer on a surface of the substrate and fixing the electronic devices on the gluing layer, wherein the electronic devices have I/O units aligned with the vias respectively; forming a plurality of fixing layers in the gaps between the electronic devices; trenching a plurality of openings aligned with the vias respectively in the fixing layer; forming a plurality of metallic conductive units in the vias, the openings and part of the surface of the substrate; and forming a passivation layer over the other surface of the substrate.

Abstract: A biodegradable hyaluronic acid derivative comprising a modified hyaluronic acid repeating unit represented by the formula (HA)-[O(C?O)NH-M]p, wherein HA is a unit including N-acetyl-D-glucosamine and D-glucuronic acid, M is a modifying moiety containing a C2-16 hydrocarbyl group or a prepolymer, and p is an integer of 1 to 4. The biodegradable hyaluronic acid derivative when dissolved in a hydrophilic medium can form micelles and can be used to entrap a pharmaceutically active or bioactive molecule.