Patents by Inventor Yu Min Lin
Yu Min Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11635988Abstract: A computing device determines an optimal number of threads for a computer task. Execution of a computing task is controlled in a computing environment based on each task configuration included in a plurality of task configurations to determine an execution runtime value for each task configuration. An optimal number of threads value is determined for each set of task configurations having common values for a task parameter value, a dataset indicator, and a hardware indicator. The optimal number of threads value is an extremum value of an execution parameter value as a function of a number of threads value. A dataset parameter value is determined for a dataset. A hardware parameter value is determined as a characteristic of each distinct executing computing device in the computing environment. The optimal number of threads value for each set of task configurations is stored in a performance dataset in association with the common values.Type: GrantFiled: August 19, 2022Date of Patent: April 25, 2023Assignee: SAS Institute Inc.Inventors: Yan Gao, Joshua David Griffin, Yu-Min Lin, Yan Xu, Seyedalireza Yektamaram, Amod Anil Ankulkar, Aishwarya Sharma, Girish Vinayak Kolapkar, Kiran Devidas Bhole, Kushawah Yogender Singh, Jorge Manuel Gomes da Silva
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Patent number: 11630114Abstract: The present invention relates to a method for quantitative measurement of catechol estrogen bound protein in blood sample. By detecting adduction levels of binding sites of the catechol estrogen on the protein in blood sample, the catechol estrogen bound protein in the blood sample can be detected quantitatively and a limit of quantitation can be decreased.Type: GrantFiled: May 28, 2021Date of Patent: April 18, 2023Assignee: NATIONAL CHENG KUNG UNIVERSITYInventors: Shu-Hui Chen, Yu-Shan Huang, Hung-Hsiang Jen, Yu-Min Lin
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Publication number: 20230074241Abstract: The present invention provides an electronic device including a display panel, at least one fingerprint sensing module, and at least one optical module. The display panel is adapted to provide an illumination beam to a finger to reflect a sensing beam. The fingerprint sensing module is disposed under the display panel and adapted to receive the sensing beam. The fingerprint sensing module includes a sensing area and a non-sensing area. The optical module is disposed between the display panel and the fingerprint sensing module. The optical module is adapted to transmit the sensing beam to the sensing area. The optical module has a light incidence surface, a light exit surface, and a side surface connected between the light incidence surface and the light exit surface. Both the light incidence surface and the light exit surface are non-planar surfaces, and the side surface is opaque.Type: ApplicationFiled: October 22, 2020Publication date: March 9, 2023Applicant: Egis Technology Inc.Inventors: Chih-Chung Tu, Po-Jui Liao, Yu-Min Lin
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Patent number: 11587905Abstract: A multi-chip package and a manufacturing method thereof are provided. The multi-chip package includes a redistribution circuit structure; a first semiconductor chip disposed on the redistribution structure and having a first active surface on which a first conductive post is disposed; a second semiconductor chip disposed above the first semiconductor chip and having a second active surface on which a first conductor is disposed; and a first encapsulant disposed on the redistribution circuit structure and encapsulating at least the first semiconductor chip, wherein the first conductive post and the first conductor are aligned and bonded to each other to electrically connect the first semiconductor chip and the second semiconductor chip.Type: GrantFiled: October 8, 2020Date of Patent: February 21, 2023Assignee: Industrial Technology Research InstituteInventors: Yu-Min Lin, Ang-Ying Lin, Sheng-Tsai Wu, Chao-Jung Chen, Tzu-Hsuan Ni, Shin-Yi Huang, Yuan-Yin Lo
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Patent number: 11569217Abstract: An image sensor package and a manufacturing method thereof are provided. The image sensor package includes a redistribution circuit structure; an image sensing chip disposed on the redistribution circuit structure and having a sensing surface, on which a sensing area and a first conductive pillar arranged in the periphery of the sensing area are disposed; a lid covering the sensing area; an encapsulant disposed on the redistribution circuit structure and encapsulating at least part of the image sensing chip and the cover; and a top tier semiconductor chip disposed above the image sensing chip and having an active surface on which a first conductor is disposed. The first conductor overlaps the image sensing chip in a direction perpendicular to the sensing surface. The first conductive pillar and the first conductor are aligned and bonded to each other to electrically connect the image sensing chip and the top tier semiconductor chip.Type: GrantFiled: January 5, 2022Date of Patent: January 31, 2023Assignee: Industrial Technology Research InstituteInventors: Sheng-Tsai Wu, Yu-Min Lin, Yuan-Yin Lo, Ang-Ying Lin, Tzu-Hsuan Ni, Chao-Jung Chen, Shin-Yi Huang
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Publication number: 20230013981Abstract: Disclosed herein is a water-dispersible dry powder formulation that includes, based on the total weight of the water-dispersible dry powder formulation, 0.2 wt % to 4.0 wt % of glucagon, 10 wt % to 95.0 wt % of lactose, 0.001 wt % to 5.0 wt % of acetone, and 0.1 wt % to 10.0 wt % of water. The water-dispersible dry powder formulation has a pH value ranging from 2.0 to 6.0. A method for producing the water-dispersible dry powder formulation is also disclosed.Type: ApplicationFiled: July 12, 2021Publication date: January 19, 2023Inventors: Fu-Ya Wang, Chia-Ann Yang, Yu-Min Lin
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Patent number: 11555653Abstract: A vapor/liquid condensation system includes a condensation unit and an evaporation unit. The condensation unit is connected with the evaporation unit via conduits. The evaporation unit has a liquid inlet, a vapor outlet and an evaporation chamber in communication with each other. The evaporation unit converts liquid-phase working fluid into vapor-phase working fluid, which spreads to the condensation unit. The condensation unit cools and condenses the vapor-phase working fluid into liquid-phase working fluid, which goes back the evaporation unit. After the vapor-phase working fluid enters the condensation unit, the vapor-phase working fluid is distributed and condensed into liquid-phase working fluid. Then the liquid-phase working fluid is collected and then goes back to the evaporation unit. The length of the pipeline is shortened and the pipeline pressure is lowered to avoid interruption of heat dissipation circulation and failure in heat dissipation.Type: GrantFiled: March 11, 2022Date of Patent: January 17, 2023Assignee: ASIA VITAL COMPONENTS CO. LTD.Inventors: Chih-Peng Chen, Yu-Min Lin
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Patent number: 11538842Abstract: A chip scale package structure is provided. The chip scale package structure includes an image sensor chip and a chip. The image sensor chip includes a first redistribution layer including a conductive wire and a conductive pad formed on the conductive wire, wherein the conductive pad is exposed from the surface of the first redistribution layer. The chip includes a plurality of through silicon via (TSV) and a second redistribution layer including a conductive wire and a conductive pad formed on the conductive wire, wherein the conductive pad is exposed from the surface of the second redistribution layer. The area of the chip is smaller than that of the image sensor chip. The second redistribution layer of the chip bonds to the first redistribution layer of the image sensor chip.Type: GrantFiled: September 11, 2020Date of Patent: December 27, 2022Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Yu-Min Lin, Tao-Chih Chang
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Publication number: 20220367385Abstract: A package carrier, including a first redistribution structure layer, multiple conductive connecting members, a connection structure layer, at least one stiffener, and a molding compound, is provided. The conductive connecting members are disposed on a first surface of the first redistribution structure layer and are electrically connected to the first redistribution structure layer. The connection structure layer is disposed on a second surface of the first redistribution structure layer and includes a substrate and multiple pads. A top surface and a bottom surface of each pad are respectively exposed to an upper surface and a lower surface of the substrate. The pads are electrically connected to the first redistribution structure layer. The stiffener is disposed on the first surface and is located at least between the conductive connecting members. The molding compound is disposed on the first surface and covers the conductive connecting members and the stiffener.Type: ApplicationFiled: December 9, 2021Publication date: November 17, 2022Applicant: Industrial Technology Research InstituteInventors: Yu-Min Lin, Ching-Kuan Lee, Chao-Jung Chen, Ren-Shin Cheng, Ang-Ying Lin, Po-Chih Chang
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Patent number: 11424190Abstract: A multi-chip package and a manufacturing method thereof are provided. The multi-chip package includes: an interposer including a dielectric body, a plurality of semiconductor bodies separated by the dielectric body, a through via penetrating through the dielectric body, and a wiring structure located in each of the plurality of semiconductor bodies; a plurality of semiconductor chips located side by side on a first surface of the interposer and electrically connected to the wiring structure; an encapsulant located on the first surface of the interposer and encapsulating at least a portion of the plurality of semiconductor chips; and a redistribution circuit structure located on a second surface of the interposer opposite to the first surface of the interposer and electrically connected to the plurality of semiconductor chips through the through via.Type: GrantFiled: August 27, 2020Date of Patent: August 23, 2022Assignee: Industrial Technology Research InstituteInventors: Chao-Jung Chen, Yu-Min Lin, Sheng-Tsai Wu, Shin-Yi Huang, Ang-Ying Lin, Tzu-Hsuan Ni, Yuan-Yin Lo
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Publication number: 20220196328Abstract: A vapor/liquid condensation system includes a condensation unit and an evaporation unit. The condensation unit is connected with the evaporation unit via conduits. The evaporation unit has a liquid inlet, a vapor outlet and an evaporation chamber in communication with each other. The evaporation unit converts liquid-phase working fluid into vapor-phase working fluid, which spreads to the condensation unit. The condensation unit cools and condenses the vapor-phase working fluid into liquid-phase working fluid, which goes back the evaporation unit. After the vapor-phase working fluid enters the condensation unit, the vapor-phase working fluid is distributed and condensed into liquid-phase working fluid. Then the liquid-phase working fluid is collected and then goes back to the evaporation unit. The length of the pipeline is shortened and the pipeline pressure is lowered to avoid interruption of heat dissipation circulation and failure in heat dissipation.Type: ApplicationFiled: March 11, 2022Publication date: June 23, 2022Inventors: Chih-Peng Chen, Yu-Min Lin
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Publication number: 20220198340Abstract: A computing device selects new test configurations for testing software. Software under test is executed with first test configurations to generate a test result for each test configuration. Each test configuration includes a value for each test parameter where each test parameter is an input to the software under test. A predictive model is trained using each test configuration of the first test configurations in association with the test result generated for each test configuration based on an objective function value. The predictive model is executed with second test configurations to predict the test result for each test configuration of the second test configurations. Test configurations are selected from the second test configurations based on the predicted test results to define third test configurations. The software under test is executed with the defined third test configurations to generate the test result for each test configuration of the third test configurations.Type: ApplicationFiled: November 10, 2021Publication date: June 23, 2022Inventors: Yan Gao, Joshua David Griffin, Yu-Min Lin, Bengt Wisen Pederson, Ricky Dee Tharrington,, JR., Pei-Yi Tan, Raymond Eugene Wright
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Publication number: 20220178951Abstract: The present invention relates to a method for quantitative measurement of catechol estrogen bound protein in blood sample. By detecting adduction levels of binding sites of the catechol estrogen on the protein in blood sample, the catechol estrogen bound protein in the blood sample can be detected quantitatively and a limit of quantitation can be decreased.Type: ApplicationFiled: May 28, 2021Publication date: June 9, 2022Inventors: Shu-Hui CHEN, Yu-Shan HUANG, Hung-Hsiang JEN, Yu-Min LIN
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Patent number: 11355472Abstract: A package structure and a method for connecting components are provided, in which the package includes a first substrate including a first wiring and at least one first contact connecting to the first wiring; a second substrate including a second wiring and at least one second contact connecting to the second wiring, the at least one first contact and the at least one second contact partially physically contacting with each other or partially chemically interface reactive contacting with each other; and at least one third contact surrounding the at least one first contact and the at least one second contact. The first substrate and the second substrate are electrically connected with each other at least through the at least one first contact and the at least one second contact.Type: GrantFiled: February 1, 2019Date of Patent: June 7, 2022Assignee: Industrial Technology Research InstituteInventors: Yu-Min Lin, Tao-Chih Chang, Wei-Chung Lo
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Patent number: 11326836Abstract: A vapor/liquid condensation system includes a condensation unit and an evaporation unit. The condensation unit is connected with the evaporation unit via conduits. The evaporation unit has a liquid inlet, a vapor outlet and an evaporation chamber in communication with each other. The evaporation unit converts liquid-phase working fluid into vapor-phase working fluid, which spreads to the condensation unit. The condensation unit cools and condenses the vapor-phase working fluid into liquid-phase working fluid, which goes back the evaporation unit. After the vapor-phase working fluid enters the condensation unit, the vapor-phase working fluid is distributed and condensed into liquid-phase working fluid. Then the liquid-phase working fluid is collected and then goes back to the evaporation unit. The length of the pipeline is shortened and the pipeline pressure is lowered to avoid interruption of heat dissipation circulation and failure in heat dissipation.Type: GrantFiled: October 22, 2020Date of Patent: May 10, 2022Assignee: ASIA VITAL COMPONENTS CO., LTD.Inventors: Chih-Peng Chen, Yu-Min Lin
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Publication number: 20220128311Abstract: A vapor-phase/liquid-phase fluid heat exchange unit includes: a first cover body having a first and a second side, a vapor outlet and a liquid inlet, the vapor outlet and the liquid inlet being in communication with the first and second sides; and a second cover body having a third and a fourth side, the first and second cover bodies being correspondingly mated with each other to together define a heat exchange space. A working fluid and a fluid separation unit are disposed in the heat exchange space. The fluid separation unit partitions the heat exchange space into an evaporation section corresponding to the vapor outlet and a backflow section corresponding to the liquid inlet. In the present invention, the conventional motor is replaced with the vapor-liquid circulation principle as the driving source of the working fluid so that the total volume is minified and the manufacturing cost is lowered.Type: ApplicationFiled: October 22, 2020Publication date: April 28, 2022Inventors: Chih-Peng Chen, Yu-Min Lin
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Publication number: 20220130812Abstract: An image sensor package and a manufacturing method thereof are provided. The image sensor package includes a redistribution circuit structure; an image sensing chip disposed on the redistribution circuit structure and having a sensing surface, on which a sensing area and a first conductive pillar arranged in the periphery of the sensing area are disposed; a lid covering the sensing area; an encapsulant disposed on the redistribution circuit structure and encapsulating at least part of the image sensing chip and the cover; and a top tier semiconductor chip disposed above the image sensing chip and having an active surface on which a first conductor is disposed. The first conductor overlaps the image sensing chip in a direction perpendicular to the sensing surface. The first conductive pillar and the first conductor are aligned and bonded to each other to electrically connect the image sensing chip and the top tier semiconductor chip.Type: ApplicationFiled: January 5, 2022Publication date: April 28, 2022Applicant: Industrial Technology Research InstituteInventors: Sheng-Tsai Wu, Yu-Min Lin, Yuan-Yin Lo, Ang-Ying Lin, Tzu-Hsuan Ni, Chao-Jung Chen, Shin-Yi Huang
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Publication number: 20220128307Abstract: A vapor/liquid condensation system includes a condensation unit and an evaporation unit. The condensation unit is connected with the evaporation unit via conduits. The evaporation unit has a liquid inlet, a vapor outlet and an evaporation chamber in communication with each other. The evaporation unit converts liquid-phase working fluid into vapor-phase working fluid, which spreads to the condensation unit. The condensation unit cools and condenses the vapor-phase working fluid into liquid-phase working fluid, which goes back the evaporation unit. After the vapor-phase working fluid enters the condensation unit, the vapor-phase working fluid is distributed and condensed into liquid-phase working fluid. Then the liquid-phase working fluid is collected and then goes back to the evaporation unit. The length of the pipeline is shortened and the pipeline pressure is lowered to avoid interruption of heat dissipation circulation and failure in heat dissipation.Type: ApplicationFiled: October 22, 2020Publication date: April 28, 2022Inventors: Chih-Peng Chen, Yu-Min Lin
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Patent number: 11258378Abstract: A piezoelectric motorization system has a mechanically flexible body that has one or more surfaces for placing piezoelectric actuators. The system has groups of piezoelectric actuators each positioned on one of the surfaces of the mechanically flexible body that is connected to the electronic circuitry. The electronic circuitry controls the driving of the mechanical loads by the mechanically flexible body by injecting sets of control signals into different groups of actuators positioned on the mechanically flexible body. Each control signal operates groups of driving frequencies with an adjustable amplitude ratio and an adjustable phase difference among driving frequencies. And, under a set of boundary conditions exhibited by a set of structural dimensions of the mechanically flexible body, each control signal induces multi-mode resonance of the mechanically flexible body for driving the mechanical loads multi-dimensionally.Type: GrantFiled: May 29, 2019Date of Patent: February 22, 2022Assignee: NATIONAL TAIWAN UNIVERSITYInventors: Chih-Kung Lee, Yu-Hsiang Hsu, Wen-Jong Wu, Tsung-Yu Chu, Yu-Min Lin
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Patent number: 11251174Abstract: An image sensor package and a manufacturing method thereof are provided. The image sensor package includes a redistribution circuit structure; an image sensing chip disposed on the redistribution circuit structure and having a sensing surface, on which a sensing area and a first conductive pillar arranged in the periphery of the sensing area are disposed; a lid covering the sensing area; an encapsulant disposed on the redistribution circuit structure and encapsulating at least part of the image sensing chip and the cover; and a top tier semiconductor chip disposed above the image sensing chip and having an active surface on which a first conductor is disposed. The first conductor overlaps the image sensing chip in a direction perpendicular to the sensing surface. The first conductive pillar and the first conductor are aligned and bonded to each other to electrically connect the image sensing chip and the top tier semiconductor chip.Type: GrantFiled: May 27, 2020Date of Patent: February 15, 2022Assignee: Industrial Technology Research InstituteInventors: Sheng-Tsai Wu, Yu-Min Lin, Yuan-Yin Lo, Ang-Ying Lin, Tzu-Hsuan Ni, Chao-Jung Chen, Shin-Yi Huang