Abstract: A light-guiding pillar used in a vehicle lamp includes a major structure and a light-guiding structure. The major structure has a light incident surface, a light outgoing surface, an upper surface, and a bottom surface. The upper surface and the bottom surface are disposed between the light incident surface and the light outgoing surface, in which the upper surface and the bottom surface are opposite to each other. The major structure is configured to guide a portion of a light beam entering the major structure through the light incident surface to the light caving surface. The light-guiding structure is disposed on the upper surface and configured to guide another portion of the light beam entering the major structure through the light incident surface from the upper surface to the bottom surface with passing through the bottom surface.

Abstract: In a flexible LED pad for use in phototherapy treatment of humans or animals, the PCBs in the pad are securely linked together with electrical connectors and ribbon cables to prevent the connections from being broken as the flexible pad is bent or otherwise deformed during the treatment. In one embodiment, low-profile socket connectors are mounted to the PCBs and mate with plug connectors at the ends of the ribbon cables. For similar reasons, the LED pad may be connected to an LED control unit by means of an electrical connector (e.g. a USB socket) mounted to a PCB in the LED pad. The PCBs, on which the LEDs are mounted, are fitted into a downset in the flexible pad to prevent the LEDs from becoming misaligned with openings in the flexible pad.

Abstract: A chip packaging includes a substrate, a first chip, a molding material, a first circuit, and a second circuit. The substrate includes a bottom surface, a first top surface disposed above the bottom surface with a first height, and a second top surface disposed above the bottom surface with a second height. The first height is smaller than the second height. The first chip is disposed on the first top surface. The molding material is disposed on the substrate and covers the first chip. The first and second circuits are disposed on the molding material, and are respectively and electrically connected to the first chip and the second top surface of the substrate. The substrate is made of copper material with huge area and has the properties of high current withstand capacity and high thermal efficiency. The second top surface protects the first chip from damage.

Abstract: A lighting system including a LED light source, a convex lens, and a light guide post disposed between the LED light source and the convex lens. The light guide post includes a light emitting portion and a light collecting portion connected to the light emitting portion. The light emitting portion has a light guide post-light emitting surface facing the convex lens. The light collecting portion has an internal reflective surface including at least an elliptical surface having a first focal point and a second focal point. The second focal point is located between the first focal point and the convex lens, and the second focal point is located inside the light guide post.

Abstract: The present invention provides a manufacturing method of a curved circuit board which includes the following steps. The first step is to provide a flexible substrate. The next step is to form a patterned catalyst layer on the flexible substrate. The next step is to deposit metal on the patterned catalyst layer by electroless plating to form a wiring substrate, wherein the wiring substrate includes a planar wiring structure. The last step is to place the wiring substrate into a mold having a molding surface with a three-dimensional design, and then execute a heating process to shape the planar wiring structure to a three-dimensional wiring structure, wherein the heated wiring substrate is laminated to the molding surface of the mold. The present invention further provides an electronic product using the curved circuit board.

Abstract: A measurement matrix generating system based on scrambling and a method thereof are disclosed. A plurality of independent identically distributed (i.i.d) elements is pre-stored in a circulant matrix register array, selections are made among the elements so as to perform an algebraic operation on the selected elements, and a measurement matrix with high availability is generated according to results of the operations, so as to achieve the technical effect of improving the availability of the measurement matrix in compressive sensing.

Abstract: A heat dissipation device includes a housing and a heat pipe. The heat pipe has an open end, which is inserted into an opening on a top side of the housing, such that a heat pipe chamber of the heat pipe is communicated with a housing chamber of the housing and an extended portion extended from the open end of the heat pipe is pressed against a bottom side of the housing, as well as a heat pipe wick structure of the heat pipe is connected to a housing wick structure of the housing, so as to increase heat transfer effect.

Abstract: Disclosed are a compressive sensing system based on a personalized basis and a method thereof; first a sensing end senses an original signal and transmits the original signal to a reconstruction end; the reconstruction end generates a personalized basis by means of a dictionary learning method; next, the sensing end is made to sample the original signal according to a sampling matrix to generate a compressed signal and transmit the compressed signal to the reconstruction end, so that the reconstruction end executes a compressive sensing reconstruction algorithm according to the personalized basis and the compressed signal to recover the compressed signal into the original signal, thereby achieving an effect of improving signal recovering quality and a compression ratio.

Abstract: An electrode structure of a transistor, and a pixel structure and a display apparatus comprising the electrode structure of the transistor are disclosed. The electrode structure of the transistor comprises a first electrode and a second electrode. The first electrode has at least two first portions and at least one second portion. The first portions are substantially parallel with each other and each has a first width. The second portion has a second width, and connects the substantially parallel first portions to define a space with an opening. The first width is substantially greater than the second width.

Abstract: Disclosed are a compressive sensing system based on a personalized basis and a method thereof; first a sensing end senses an original signal and transmits the original signal to a reconstruction end; the reconstruction end generates a personalized basis by means of a dictionary learning method; next, the sensing end is made to sample the original signal according to a sampling matrix to generate a compressed signal and transmit the compressed signal to the reconstruction end, so that the reconstruction end executes a compressive sensing reconstruction algorithm according to the personalized basis and the compressed signal to recover the compressed signal into the original signal, thereby achieving an effect of improving signal recovering quality and a compression ratio.

Abstract: A light-guiding pillar used in a vehicle lamp includes a major structure and a light-guiding structure. The major structure has a light incident surface, a light outgoing surface, an upper surface, and a bottom surface. The upper surface and the bottom surface are disposed between the light incident surface and the light outgoing surface, in which the upper surface and the bottom surface are opposite to each other. The major structure is configured to guide a portion of a light beam entering the major structure through the light incident surface to the light caving surface. The light-guiding structure is disposed on the upper surface and configured to guide another portion of the light beam entering the major structure through the light incident surface from the upper surface to the bottom surface with passing through the bottom surface.

Abstract: A light-guiding pillar used in a vehicle lamp includes a major structure and a light-guiding structure. The major structure has a light incident surface, a light outgoing surface, an upper surface, and a bottom surface. The upper surface and the bottom surface are disposed between the light incident surface and the light outgoing surface, in which the upper surface and the bottom surface are opposite to each other. The major structure is configured to guide a portion of a light beam entering the major structure through the light incident surface to the light outgoing surface. The light-guiding structure is disposed on the upper surface and configured to guide another portion of the light beam entering the major structure through the light incident surface from the upper surface to the bottom surface with passing through the bottom surface.

Abstract: An electrode structure of a transistor, and a pixel structure and a display apparatus comprising the electrode structure of the transistor are disclosed. The electrode structure of the transistor comprises a first electrode and a second electrode. The first electrode has at least two first portions and at least one second portion. The first portions are substantially parallel with each other and each has a first width. The second portion has a second width, and connects the substantially parallel first portions to define a space with an opening. The first width is substantially greater than the second width.

Abstract: A light-emitting diode (LED) module and a lamp using the same are provided. The LED module includes a substrate and several light-emitting packages. Each light-emitting package includes an optical wavelength conversion layer and a light-emitting diode having a first light-output surface, a bonding surface, and several second light-output surfaces. The bonding surface is opposite the first light-output surface and connected to the substrate. The second light-output surfaces are between the first light-output surface and the bonding surface. The optical wavelength conversion layer covers the first and second light-output surfaces. The distance between the bonding surface and the top surface of the optical wavelength conversion layer represents a light source thickness. The distance between two adjacent light-emitting packages represents a spacing of light sources. Specifically, the ratio of the spacing of light sources to the light source thickness is between 1 and 6.3.

Abstract: A chip structure includes a chip, a first metal layer, a second metal layer and a bonding wire. The first metal layer is disposed on the chip, and a material of the first metal layer includes nickel or nickel alloy. The second metal layer is disposed on the first metal layer, and a material of the second metal layer includes copper, copper alloy, aluminum, aluminum alloy, palladium or palladium alloy. The bonding wire is connected to the second metal layer, and a material of the bonding wire includes copper or copper alloy.

Abstract: A vehicle lamp includes a condenser lens, a heat-dissipation base, a first light source, a second light source, and a reflector. The condenser lens has a focal plane and an optical axis. The heat-dissipation base is disposed at a side of the condenser lens, and the focal plane is disposed between the condenser lens and the heat-dissipation base. The first light source is disposed on the heat-dissipation base, and includes a first light-emitting surface facing toward the focal plane. The second light source is disposed on the heat-dissipation base, and includes a substrate and second light-emitting surfaces disposed on the substrate. A reflector is disposed on the heat-dissipation base and has reflective surfaces. Each of the reflective surfaces is a partial curved surface of an ellipsoid, and has a first focal point and a second focal point located on the focal plane.

Abstract: An LED headlight includes a lens, a heat sink, at least one LED module and a shelter. The lens includes a focal length and a focal plane, wherein the focal plane extends from a focal point of the lens and is perpendicular to an optical axis of the lens. The heat sink is arranged along the optical axis of the lens, and a distance between the heat sink and the lens is greater than a distance between the focal point and the lens. The at least one LED module is arranged along the optical axis of the lens and in contact with the heat sink, a distance between the LED module and the lens is greater than the distance between the focal point and the lens. The shelter is arranged along the focal plane and configured to block light emitted from the LED module.

Abstract: A molding package assembly is provided, which includes a substrate and first and second molding packages stacked on the substrate. Each of the first and second molding packages has a semiconductor element, an anti-warping structure disposed around a periphery of the semiconductor element, a molding material encapsulating the semiconductor element and the anti-warping structure, and a protection layer formed on the semiconductor element, the molding material and the anti-warping structure. The anti-warping structure facilitates to prevent warping of the molding package assembly during a molding process.

Abstract: An LED vehicle headlight includes a lens, a reflector, a first light source, and a second light source. The lens has a focal plane. The reflector is located at a side of the lens, and the reflector is equipped with a first focal point and a second focal point, wherein the second focal point is located on the focal plane. The first light source has a first light-emitting surface confronting the lens. The second light source has a second light-emitting surface confronting the reflector. The first focal point is located on the second light-emitting surface, and the reflector is configured to reflect and focus light beams emitted from the second light-emitting surface onto the second focal point.

Abstract: A chip structure includes a chip, a first metal layer, a second metal layer and a bonding wire. The first metal layer is disposed on the chip, and a material of the first metal layer includes nickel or nickel alloy. The second metal layer is disposed on the first metal layer, and a material of the second metal layer includes copper, copper alloy, aluminum, aluminum alloy, palladium or palladium alloy. The bonding wire is connected to the second metal layer, and a material of the bonding wire includes copper or copper alloy.