Abstract: A millimeter wave channel estimation method comprises sending signals through a millimeter wave channel according to a first beamforming matrix, performing a channel estimation on the millimeter wave to generate a first measured matrix, and estimating and obtaining at least one angle of departure of the millimeter wave channel according to the first measured matrix and an angle compressive sensing matrix. The first beamforming matrix comprises a plurality of first beamforming vectors, and the first beamforming vectors respectively corresponds to a plurality of first beamforming patterns. The first measured matrix comprises a plurality of first measured parameters respectively corresponding to the first beamforming vectors.

Abstract: A semiconductor package includes a first redistribution structure, a semiconductor die disposed on the first redistribution structure, a die attach material disposed between the first redistribution structure and the semiconductor die, and an insulating encapsulant disposed on the first redistribution structure. A first shortest distance from a midpoint of a bottom edge of the semiconductor die to a midpoint of an bottom edge of an extruded region of the die attach material in a width direction of the semiconductor die is greater than a second shortest distance between an endpoint of the bottom edge of the semiconductor die to an endpoint of the bottom edge of the extruded region of the die attach material. The insulating encapsulant encapsulates the semiconductor die and the die attach material. An inclined interface is between the insulating encapsulant and the extruded region of the die attach material.

Abstract: A manufacturing method of a semiconductor package includes at least the following steps. A dielectric layer is formed on a conductive pattern and in a space between the conductive pattern, where a concave area of the dielectric layer is formed corresponding to the space between the conductive pattern. A semiconductor die is disposed on the concave area of the dielectric layer with a die attach material interposed therebetween. A pressure is applied to the die attach material so that the concave area of the dielectric layer is filled with the die attach material, and a portion of the die attach material is extruded from the concave area to expand wider than an area of the semiconductor die. An insulating encapsulant is formed on the dielectric layer to cover the semiconductor die. Other methods for forming a semiconductor package are also provided.

Abstract: A channel estimation system and method thereof is provided. By utilizing the nature of the millimeter-wave channel with sparse path, the channel estimation problem is transformed from estimating the entire channel matrix to estimating independent parameters of the millimeter-wave channel. These parameters are angle of arrival (AoA) and angle of departure (AoD), and complex gain of the channel paths.

Abstract: A memory device that includes a driver IC, a voltage-dividing resistor, at least two noise-suppressing resistors and at least three memory ICs is provided. A terminal of the voltage-dividing resistor is electrically coupled to a voltage source and another other terminal of the voltage-dividing resistor is electrically coupled to the driver IC through an end a connection path. One of the memory ICs is electrically coupled to the voltage-dividing resistor and the driver IC through the end the connection path. Each of at least two of the other memory ICs is electrically coupled to the connection path through one of the noise-suppressing resistors and is further electrically coupled to the driver IC.

Abstract: A color reflective display device includes a plurality of color sub-pixels and a control circuit. The control circuit is configured to provide a first driving signal to at least one of a plurality of mini-pixels of a first color sub-pixel, such that the at least one of mini-pixels receiving the first driving signal displays a first color, provide a second driving signal to another at least one of the mini-pixels of the first color sub-pixel, such that the another at least one of the mini-pixels receiving the second driving signal displays a second color, and provide a third driving signal to a second color sub-pixel of the color sub-pixels, such that the second color sub-pixel displays a third color.

Abstract: A mobile device includes a metal back cover, a display device, a display frame, a nonconductive filling element, a dielectric substrate, a ground element, and a radiator. The metal back cover has a slot. The display device and the display frame are disposed opposite to the metal back cover. The nonconductive filling element is at least partially embedded in the slot. The dielectric substrate is disposed on the nonconductive filling element. The ground element is coupled to the metal back cover. The radiator is coupled to the ground element and is disposed on the dielectric substrate. An antenna structure is formed by the radiator and the slot of the metal back cover. The distance from the slot to an edge of the metal back cover is shorter than 10 mm.

Abstract: A multi-time programming non-volatile memory includes a select transistor, a floating gate transistor, a switch transistor, a capacitor and an erase gate element. The select transistor is connected with a select line and a source line. The floating gate transistor includes a floating gate. The floating gate transistor is connected with the select transistor. The switch transistor is connected with a word line, the floating gate transistor and a bit line. A first terminal of the capacitor is connected with the floating gate. A second terminal of the capacitor is connected with a control line. The erase gate element includes the floating gate, a gate oxide layer and a p-type region. The erase gate element is connected with an erase line. The floating gate of the erase gate element at least includes an n-type floating gate part.

Abstract: In an embodiment, a device includes: a first redistribution structure including a first dielectric layer; a die adhered to a first side of the first redistribution structure; an encapsulant laterally encapsulating the die, the encapsulant being bonded to the first dielectric layer with first covalent bonds; a through via extending through the encapsulant; and first conductive connectors electrically connected to a second side of the first redistribution structure, a subset of the first conductive connectors overlapping an interface of the encapsulant and the die.

Abstract: A reflective color electrophoresis display device includes a plurality of sub-pixel structures, and each of the sub-pixel structures includes a columnar body, an electronic ink layer, two electrodes and a rotation control unit. The columnar body includes at least one spacer radially disposed to divide the columnar body into at least two portions. The electronic ink layer is disposed over one of the at least two portions of the columnar body, and the electronic ink layer contains two different color particles. The two electrodes electrically connect the electronic ink layer to control movement of the two different color particles. The rotation control unit is configured to control rotation of the columnar body.

Abstract: A semiconductor package and a manufacturing method thereof are provided with the following steps, attaching a rear surface of a semiconductor die on a first redistribution structure by a die attach material, wherein the semiconductor die is pressed so that the die attach material is extruded laterally out and climbs upwardly to cover a sidewall of the semiconductor die, and after attaching, the die attach material comprises an extruded region surrounding the semiconductor die, a first shortest distance from a midpoint of an bottom edge of semiconductor die to a midpoint of an bottom edge of extruded region in a width direction is greater than a second shortest distance between an endpoint of the bottom edge of semiconductor die to an endpoint of the bottom edge of extruded region; and forming an insulating encapsulant on the first redistribution structure to encapsulate the semiconductor die and the die attach material.

Abstract: A liquid-crystal composition and a liquid-crystal display device employing the liquid-crystal composition are provided. The liquid-crystal composition includes a first component and a second component. The first component includes one or more compounds represented by Formula (I), and the second component includes one or more compounds represented by Formula (II): wherein R1, R2, A1, A2, A3, A4, Z1, Z2, Z3, m, m?, n, and n? are defined as in the specification.

Abstract: A liquid crystal composition includes at least one of a difunctional compound represented by Formula (1) defined herein and a difunctional compound represented by Formula (2) defined herein, and at least one of a monofunctional compound represented by Formula (3) defined herein and a monofunctional compound represented by Formula (4) defined herein.

Abstract: An electrophoretic display device includes an electrophoretic display module, and a polymer light emitting diode (PLED) module. The polymer light emitting diode (PLED) module is over the electrophoretic display module, and is aligned with and is attached to the electrophoretic display module. In a dark environment, the polymer light emitting diode (PLED) module can emit light to supplement the insufficient ambient light, so that the users may observe the information or pattern displayed by the electrophoretic display device. The electrophoretic display device can be a flexible electrophoretic display device.

Abstract: A liquid crystal composition includes at least one of a monofunctional compound represented by Formula (1) defined herein and a monofunctional compound represented by Formula (2) defined herein, and at least one of a difunctional compound represented by Formula (3) defined herein and a multifunctional compound represented by Formula (4) defined herein.

Abstract: A silicon-containing compound, liquid-crystal composition and a liquid-crystal display using the silicon-containing compound are provided. The silicon-containing compound has a structure represented by Formula (I): wherein K, R1, A1, A2, A3, A4, Z1, Z2, Z3, L7, L8, L9, X6, X7, n1, n2, n3, and n4 are defined as in the specification.

Abstract: A semiconductor package and a manufacturing method thereof are provided with the following steps, attaching a rear surface of a semiconductor die on a first redistribution structure by a die attach material, wherein the semiconductor die is pressed so that the die attach material is extruded laterally out and climbs upwardly to cover a sidewall of the semiconductor die, and after attaching, the die attach material comprises an extruded region surrounding the semiconductor die, a first shortest distance from a midpoint of an bottom edge of semiconductor die to a midpoint of an bottom edge of extruded region in a width direction is greater than a second shortest distance between an endpoint of the bottom edge of semiconductor die to an endpoint of the bottom edge of extruded region; and forming an insulating encapsulant on the first redistribution structure to encapsulate the semiconductor die and the die attach material.

Abstract: Semiconductor package s and methods of forming the same are disclosed. The semiconductor package includes a chip, a redistribution circuit structure and a UBM pattern. The redistribution circuit structure is disposed over and electrically connected to the chip and includes a topmost conductive pattern. The UBM pattern is disposed over and electrically connected to the topmost conductive pattern, wherein the UBM pattern includes a set of vias and a pad on the set of vias, wherein the vias are arranged in an array and electrically connected to the pad and the topmost conductive pattern.

Abstract: A display apparatus includes a first substrate, a plurality of sub-pixel structures, a color filter array, and a display layer. The sub-pixel structures are disposed on the first substrate, and each of the sub-pixel structures includes at least two sub-pixel sub-structures. The color filter array is disposed above the sub-pixel structures, and includes a plurality of filter units. The filter units are divided into a plurality of groups having different colors, and the filter units belonging to the groups having different colors are alternately disposed above the sub-pixel structures. Each of the filter units corresponds to the at least two sub-pixel sub-structures of at least one sub-pixel structure, and the at least two sub-pixel sub-structures of the same sub-pixel structure are adapted to be applied different voltages. The display layer is disposed on the sub-pixel structures.

Abstract: A reflective color electrophoresis display device includes a plurality of sub-pixel structures, and each of the sub-pixel structures includes a columnar body, an electronic ink layer, two electrodes and a rotation control unit. The columnar body includes at least one spacer radially disposed to divide the columnar body into at least two portions. The electronic ink layer is disposed over one of the at least two portions of the columnar body, and the electronic ink layer contains two different color particles. The two electrodes electrically connect the electronic ink layer to control movement of the two different color particles. The rotation control unit is configured to control rotation of the columnar body.