Abstract: Provided are a defect observation method and a defect observation device which detect a defect from an image obtained by imaging the defect on a sample with an optical microscope by using positional information of the defect on the sample detected by a different inspection device to correct the positional information of the defect and observe in detail the defect on the sample with a scanning electron microscope using the corrected positional information. The defect observation method includes detecting the defect from the image to correct the positional information of the defect, switching a spatially-distributed optical element of a detection optical system of the optical microscope according to the defect to be detected, and changing an image acquisition condition for acquiring the image and an image processing condition for detecting the defect from the image according to a type of the switched spatially-distributed optical element.

Abstract: To address the problem in which when measuring the overlay of patterns formed on upper and lower layers of a semiconductor pattern by comparing a reference image and measurement image obtained through imaging by an SEM, the contrast of the SEM image of the pattern of the lower layer is low relative to that of the SEM image of the pattern of the upper layer and alignment state verification is difficult even if the reference image and measurement image are superposed on the basis of measurement results, the present invention determines the amount of positional displacement of patterns of an object of overlay measurement from a reference image and measurement image obtained through imaging by an SEM, carries out differential processing on the reference image and measurement image, aligns the reference image and measurement image that have been subjected to differential processing on the basis of the positional displacement amount determined previously, expresses the gradation values of the aligned differential r

Abstract: To quantify the degree of a defect, and provide information useful for yield management. Disclosed is a defect quantification method wherein: a defect image is classified; a measurement region and a measurement area are set to each of the defect image and a reference image on the basis of defect image classification results, said reference image corresponding to the defect image; and an evaluation value of a defect is calculated using each of the measurement values obtained from each of the measurement areas of the defect image and the reference image, and the defect is quantified.

Abstract: The purpose of the present invention is to easily extract, from samples to be observed, defect candidates that can be labeled as a defect or “nuisance” (a part for which a manufacturing tolerance or the like is erroneously detected) and to allow parameters pertaining to observation processing to be easily adjusted. This defect observation method comprises: an imaging step to image, on the basis of defect information from an inspection device, an object to be inspected and obtain a defect image and a reference image corresponding to the defect image; a parameter determining step to determine a first parameter to be used in the defect extraction by using a first feature set distribution acquired from the reference image and the defect image captured in the imaging step and a second feature net distribution acquired from the reference image; and an observing step to observe using the first parameter determined in the parameter determining step.

Abstract: A method for measuring overlay at a semiconductor device on which circuit patterns are formed by a plurality of exposure processes is characterized in including an image capturing step for capturing images of a plurality of areas of the semiconductor device, a reference image setting step for setting a reference image based on a plurality of the images captured in the image capturing step, a difference quantifying step for quantifying a difference between the reference image set in the reference image setting step and the plurality of images captured in the image capturing step, and an overlay calculating step for calculating the overlay based on the difference quantified in the difference quantifying step.

Abstract: In an optical disc apparatus that records and reproduces data onto and from an optical disc in units of predetermined block, an information divider divides the data so as to reduce an amount of the data included in each of blocks when a recording state of the optical disc does not satisfy a predetermined criterion, and reproduces recording data in units of the block by adding sub-information including a value indicating the amount of the data included in each of the blocks. An error-correction encoder circuit encodes the recording data in a first error-correction code format, and a recorder converts encoded recording data into a recording signal, and records the recording signal onto the optical disc. A quality evaluator circuit produces an evaluation value indicating a recording quality based on a result of reproducing the recording signal recorded on the optical disc.

Abstract: A cutting insert and an indexable insert-type cutting tool includes a cutting edge (6A) formed on each of a pair of side ridge portions of at least one of the side faces, wherein an insert main body (1) is formed in the shape of having front-back inversion symmetry which is 180° rotationally symmetrical with respect to a line of symmetry (N) passing through the center of the side faces; a flank face adjacent to the cutting edge (6A) is formed on the side face in the vicinity of each of the pair of polygonal faces (2); each of the flank faces is formed in the shape of a twisted face; the pair of side ridge portions on which the cutting edge (6A) is formed intersect each other in such a manner that the second corner portion (B) of one side ridge portion protrudes outside the other side ridge portion.

Abstract: To review minute defects that were buried in roughness scattered light with an observation device provided with a dark-field microscope, a scanning electron microscope (SEM), and a control unit, the present invention configures the dark-field microscope by installing a filter for blocking a portion of the scattered light, an imaging lens for focusing the scattered light that has passed through the filter, and a detector for dividing the image of the scattered light focused by the imaging lens into the polarization directions converted by a wavelength plate and detecting the resulting images, and the control has a calculation unit for determining the position of a defect candidate detected by another inspection device using the plurality of images separated into polarization directions and detected by the detector.

Abstract: There is provided a technique to correctly select and measure a pattern to be measured even when contours of the pattern are close to each other in a sample including a plurality of patterns on a substantially same plane. A pattern measuring apparatus that scans a sample with charged particles, forms a detected image by detecting secondary charged particles or backscattered charged particles generated from the sample, and measures a pattern imaged on the detected image includes: an image acquiring section acquiring a plurality of detected images taken at a substantially same location on the sample under different imaging conditions; a contour extracting section extracting a plurality of pattern contours from the plurality of detected images; a contour reconstructing section reconstructing a contour to be measured by combining the plurality of pattern contours; and a contour measuring section making a measurement using the reconstructed contour to be measured.

Abstract: A cutting insert and an indexable insert-type cutting tool includes a cutting edge (6A) formed on each of a pair of side ridge portions of at least one of the side faces, wherein an insert main body (1) is formed in the shape of having front-back inversion symmetry which is 180° rotationally symmetrical with respect to a line of symmetry (N) passing through the center of the side faces; a flank face adjacent to the cutting edge (6A) is formed on the side face in the vicinity of each of the pair of polygonal faces (2); each of the flank faces is formed in the shape of a twisted face; the pair of side ridge portions on which the cutting edge (6A) is formed intersect each other in such a manner that the second corner portion (B) of one side ridge portion protrudes outside the other side ridge portion.

Abstract: A decoding system includes: a modulator which modulates user data by using a modulation rule which converts the user data into a modulation pattern; a regenerator which generates a regenerative signal from a signal obtained by transmitting the user data after modulation through a transmission path; a transmission path decoder which generates signals as generation signals corresponding to the modulation pattern, and calculates k (k is a positive integer) distances between the regenerative signal and the k generation signals in an interval having a length fixedly or dynamically determined; and a demodulator which calculates reliability information for each bit of the user data, and estimates each bit of the user data based on the calculated reliability information. The demodulator calculates likelihood that each bit of the user data is 1 and each bit of the user data is 0 by Formula (A), and calculates the reliability information by Formula (B).

Abstract: In automatic defect classification, a classification recipe must be set for each defect observation device. If a plurality of devices operate at the same stage, the classification class in the classification recipes must be the same. Problems have arisen whereby differences occur in the classification class in different devices when a new classification recipe is created. This defect classification system has a classification recipe storage unit; an information specification unit, the stage of a stored image, and device information. A corresponding defect specification unit specifies images of the same type of defect from images obtained from different image pickup devices at the same stage. An image conversion unit converts the images obtained from the different image pickup devices at the same stage into comparable similar images; and a recipe update unit records the classification classes in the classification recipes corresponding to the specified images of the same type of defect.

Abstract: In performing a programmed-point inspection of a circuit pattern using a review SEM, stable inspection can be performed while suppressing the generation of a false report even when a variation in a circuit pattern to be inspected is large. SEM images that are obtained by sequentially imaging a predetermined circuit pattern using the review SEM are stored into a storage unit. Images that meet a set condition are selected from the stored SEM images, and averaged to create an average image (GP image). By performing pattern check by GP comparison using this GP image, an inspection can be performed while suppressing the generation of a false report even when a variation in the circuit patterns is large.

Abstract: In order to reduce the amount of time it takes to collect images of defects, this defect inspection device is provided with the following: a read-out unit that reads out positions of defects in a semiconductor wafer that have already been detected; a first imaging unit that takes, at a first magnification, a reference image of a chip other than the chip where one of the read-out defects is; a second imaging unit that takes, at the first magnification, a first defect image that contains the read-out defect; a defect-position identification unit that identifies the position of the defect in the first defect image taken by the second imaging unit by comparing said first defect image with the reference image taken by the first imaging unit; a third imaging unit that, on the basis of the identified defect position, takes a second defect image at a second magnification that is higher than the first magnification; a rearrangement unit that rearranges the read-out defects in an order corresponding to a path that goes

Abstract: The purpose of the present invention is to easily extract, from samples to be observed, defect candidates that can be labeled as a defect or “nuisance” (a part for which a manufacturing tolerance or the like is erroneously detected) and to allow parameters pertaining to observation processing to be easily adjusted. This defect observation method comprises: an imaging step to image, on the basis of defect information from an inspection device, an object to be inspected and obtain a defect image and a reference image corresponding to the defect image; a parameter determining step to determine a first parameter to be used in the defect extraction by using a first feature set distribution acquired from the reference image and the defect image captured in the imaging step and a second feature net distribution acquired from the reference image; and an observing step to observe using the first parameter determined in the parameter determining step.

Abstract: A technique for calculating the angle from an auxiliary dot sequence indicating the track of a pattern and for performing pattern measurement is provided, thereby enabling achievement of high-accuracy pattern measurement with reduced influence of the roughness of pattern edges.

Abstract: A decoding device includes: an interference canceling circuit (104) which extracts, from states of 2K-number (where K is a natural number) of detected signals that are likely within a range of K bit width where an interference between bits of the digital information occurs due to predetermined frequency characteristics, most likely 2M-number (where M is a natural number) of detected signals respectively corresponding to states of 2M-number of detected signals which exist within a range of M bit width that is included in the range of K bit width; and a Viterbi decoding circuit (105) which generates a decoded signal by calculating differences between the 2M-number of detected signals extracted by the interference canceling circuit (104) and expectation signals respectively corresponding to the 2M-number of detected signals and also by selecting a transition sequence of a state of a detected signal for which the calculated difference is smallest.

Abstract: Provided are a semiconductor device defect inspection method and system thereof, with which predetermined hot spots are inspected using a SEM, and with which the frequency of defects occurring at the hot spot is estimated statistically and with reliability. An inspection point is designated in design data by the defect type. A plurality of pre-designated inspection points is selected by the defect type from the designated inspection points. The plurality of pre-designated inspection points by defect type thus selected are image captured by the inspection points. A defect ratio, which is a ratio of the plural inspection points which are image captured by the defect type to the plural defects detected, and a reliability interval of the defect ratio which is computed by the defect type is compared with a preset reference value. A defect type having a defect occurrence ratio which exceeds the reference value is derived.

Abstract: A decoding device (1) has: a reliability calculating unit (5) which calculates reliability information having a non-linear relationship with a noise distribution of a PR communication path (3) in at least part of or all of the reliability information based on characteristics of the PR communication path (3) and a predetermined modulation rule from an encoded signal that is obtained from the PR communication path (3); a reliability correcting unit (17) which corrects the reliability information calculated by a reliability calculating unit (5); and an error correction decoding unit (18) which performs error correction decoding on the reliability information corrected by the reliability correcting unit (17).

Abstract: A composite hose is constructed to have an outer peripheral portion and an inner peripheral portion. The outer peripheral portion includes an elastic layer and a reinforcing layer provided on an outer periphery of the elastic layer. The inner peripheral portion includes a corrugated metal tube which is provided with a corrugated portion formed with corrugation hills and corrugation valleys. A distance between the reinforcing layer and tops of the corrugation hills of the corrugated metal tube is designed 0.27 mm or less.