Abstract: A method for measuring overlay at a semiconductor device on which circuit patterns are formed by a plurality of exposure processes is characterized in including an image capturing step for capturing images of a plurality of areas of the semiconductor device, a reference image setting step for setting a reference image based on a plurality of the images captured in the image capturing step, a difference quantifying step for quantifying a difference between the reference image set in the reference image setting step and the plurality of images captured in the image capturing step, and an overlay calculating step for calculating the overlay based on the difference quantified in the difference quantifying step.

Abstract: A decoding device includes: an interference canceling circuit (104) which extracts, from states of 2K-number (where K is a natural number) of detected signals that are likely within a range of K bit width where an interference between bits of the digital information occurs due to predetermined frequency characteristics, most likely 2M-number (where M is a natural number) of detected signals respectively corresponding to states of 2M-number of detected signals which exist within a range of M bit width that is included in the range of K bit width; and a Viterbi decoding circuit (105) which generates a decoded signal by calculating differences between the 2M-number of detected signals extracted by the interference canceling circuit (104) and expectation signals respectively corresponding to the 2M-number of detected signals and also by selecting a transition sequence of a state of a detected signal for which the calculated difference is smallest.

Abstract: Provided is a GUI including: an unadded pane region that hierarchically displays folders which are sets of images having no class information added thereto; an image pane region that displays the images displayed in the unadded pane region, the displayed images having no classification added thereto; and a class pane region that displays images having classification added thereto, wherein by externally inputting class information for one image having the class information added thereto, the input class information is displayed.

Abstract: A cutting insert and an indexable insert-type cutting tool includes a cutting edge (6A) formed on each of a pair of side ridge portions of at least one of the side faces, wherein an insert main body (1) is formed in the shape of having front-back inversion symmetry which is 180° rotationally symmetrical with respect to a line of symmetry (N) passing through the center of the side faces; a flank face adjacent to the cutting edge (6A) is formed on the side face in the vicinity of each of the pair of polygonal faces (2); each of the flank faces is formed in the shape of a twisted face; the pair of side ridge portions on which the cutting edge (6A) is formed intersect each other in such a manner that the second corner portion (B) of one side ridge portion protrudes outside the other side ridge portion.

Abstract: A cutting insert and an indexable insert-type cutting tool includes a cutting edge (6A) formed on each of a pair of side ridge portions of at least one of the side faces, wherein an insert main body (1) is formed in the shape of having front-back inversion symmetry which is 180° rotationally symmetrical with respect to a line of symmetry (N) passing through the center of the side faces; a flank face adjacent to the cutting edge (6A) is formed on the side face in the vicinity of each of the pair of polygonal faces (2); each of the flank faces is formed in the shape of a twisted face; the pair of side ridge portions on which the cutting edge (6A) is formed intersect each other in such a manner that the second corner portion (B) of one side ridge portion protrudes outside the other side ridge portion.

Abstract: Provided are a semiconductor device defect inspection method and system thereof, with which predetermined hot spots are inspected using a SEM, and with which the frequency of defects occurring at the hot spot is estimated statistically and with reliability. An inspection point is designated in design data by the defect type. A plurality of pre-designated inspection points is selected by the defect type from the designated inspection points. The plurality of pre-designated inspection points by defect type thus selected are image captured by the inspection points. A defect ratio, which is a ratio of the plural inspection points which are image captured by the defect type to the plural defects detected, and a reliability interval of the defect ratio which is computed by the defect type is compared with a preset reference value. A defect type having a defect occurrence ratio which exceeds the reference value is derived.

Abstract: A storage device 101 in one aspect of the present invention records/reproduces data to/from a plurality of exchangeable recording media 105 using a plurality of drive units 111. The plurality of recording media are stored in magazines 104, and are attached/detached to/from the storage device in a magazine-by-magazine manner. The storage device includes a transport section 108 for transporting a plurality of recording media between the magazine attached to the storage device and the plurality of drive units, and a RAID control section 103 for dividing data depending on a predetermined RAID to be formed by a plurality of recording media and recording in parallel the data to the plurality of recording media using two or more of the drive units, wherein one RAID is formed by one magazine.

Abstract: A decoding system includes: a modulator which modulates user data by using a modulation rule which converts the user data into a modulation pattern; a regenerator which generates a regenerative signal from a signal obtained by transmitting the user data after modulation through a transmission path; a transmission path decoder which generates signals as generation signals corresponding to the modulation pattern, and calculates k (k is a positive integer) distances between the regenerative signal and the k generation signals in an interval having a length fixedly or dynamically determined; and a demodulator which calculates reliability information for each bit of the user data, and estimates each bit of the user data based on the calculated reliability information. The demodulator calculates likelihood that each bit of the user data is 1 and each bit of the user data is 0 by Formula (A), and calculates the reliability information by Formula (B).

Abstract: An end mill including multiple spiral flutes in a helical shape around an axis that are formed in a periphery of the top portion of an end mill body which rotates on the axis. Cutting edges are formed at peripheral side ridge portions of wall surfaces of the flutes facing a front side in an end mill rotating direction. Honing is applied along each peripheral cutting edge such that the cutting edge has a variable honing width in the direction of the axis.

Abstract: The present invention relates to semiconductor inspection and provides a technology capable of efficiently detecting a systematic defect. In the present system, with regard to the process (S7, S8) of matching hot spot (HS) points that can be simulated in advance and defect points obtained as a result of a visual inspection each other and the unmatched defect points, a process (S6, S9) of classifying the defect points into groups based on similarity of pattern layout at the defect points to determine the defects belonging to a pattern layout where defects frequently occur, thereby reliably detecting the systematic defect. Also, with a process (S11) of acquiring an uneven distribution in a defect occurrence distribution on a wafer, the systematic defect occurring due to topography of the wafer can also be detected.

Abstract: In automatic defect classification, a classification recipe must be set for each defect observation device. If a plurality of devices operate at the same stage, the classification class in the classification recipes must be the same. Problems have arisen whereby differences occur in the classification class in different devices when a new classification recipe is created. This defect classification system has a classification recipe storage unit; an information specification unit, the stage of a stored image, and device information. A corresponding defect specification unit specifies images of the same type of defect from images obtained from different image pickup devices at the same stage. An image conversion unit converts the images obtained from the different image pickup devices at the same stage into comparable similar images; and a recipe update unit records the classification classes in the classification recipes corresponding to the specified images of the same type of defect.

Abstract: A decoding device (1) has: a reliability calculating unit (5) which calculates reliability information having a non-linear relationship with a noise distribution of a PR communication path (3) in at least part of or all of the reliability information based on characteristics of the PR communication path (3) and a predetermined modulation rule from an encoded signal that is obtained from the PR communication path (3); a reliability correcting unit (17) which corrects the reliability information calculated by a reliability calculating unit (5); and an error correction decoding unit (18) which performs error correction decoding on the reliability information corrected by the reliability correcting unit (17).

Abstract: In order to enable an evaluation of systematic defects, a method of evaluating systematic defects was configured so as to sample a circuit pattern of a specific layer of a semiconductor device, evaluate the state of superimposition between the sampled circuit pattern and circuit patterns of layers other than the specific layer, using design data, classify the state of superimposition, calculate the ratio thereof as a reference ratio, evaluate the state of superimposition between a pattern in design data corresponding to a defect of the specific layer detected by another inspection apparatus and patterns at positions corresponding to the defects in layers other than the specific layer, classify the evaluated state of superimposition, calculate the ratio of the classification as inspection-result ratio, compare the calculated reference ratio and the calculated inspection-result ratio, and evaluate systematic defects by the comparison between the calculated reference ratio and the calculated inspection-result ra

Abstract: There is provided a technique to correctly select and measure a pattern to be measured even when contours of the pattern are close to each other in a sample including a plurality of patterns on a substantially same plane. A pattern measuring apparatus that scans a sample with charged particles, forms a detected image by detecting secondary charged particles or backscattered charged particles generated from the sample, and measures a pattern imaged on the detected image includes: an image acquiring section acquiring a plurality of detected images taken at a substantially same location on the sample under different imaging conditions; a contour extracting section extracting a plurality of pattern contours from the plurality of detected images; a contour reconstructing section reconstructing a contour to be measured by combining the plurality of pattern contours; and a contour measuring section making a measurement using the reconstructed contour to be measured.

Abstract: A defect is efficiently and effectively classified by accurately determining the state of overlap between a design layout pattern and the defect. This leads to simple identification of a systematic defect. A defective image obtained through defect inspection or review of a semiconductor device is automatically pattern-matched with design layout data. A defect is superimposed on a design layout pattern for at least one layer of a target layer, a layer immediately above the target layer, and a layer immediately below the target layer. The state of overlap of the defect is determined as within the pattern, over the pattern, or outside the pattern, and the defect is automatically classified.

Abstract: An end mill body wiih a corner cutting edge forming a convex arc shape of which the rotation locus becomes convex toward the tip outer peripheral side is formed at a side ridge portion of the corner cutting edge rake face, a gash is formed on the inner peripheral side of the corner cutting edge rake face, and an end cutting edge connected to the corner cutting edge and extending toward the inner peripheral side is formed at a tip-side side ridge portion of the end cutting edge rake face. An intersection line between the corner cutting edge rake face and the end cutting edge rake face is located closer to the radial inner peripheral side with respect to the axis than the center of the convex arc that the corner cutting edge forms in the rotation locus.

Abstract: In order to enable an evaluation of systematic defects, a method of evaluating systematic defects was configured so as to sample a circuit pattern of a specific layer of a semiconductor device, evaluate the state of superimposition between the sampled circuit pattern and circuit patterns of layers other than the specific layer, using design data, classify the state of superimposition, calculate the ratio thereof as a reference ratio, evaluate the state of superimposition between a pattern in design data corresponding to a defect of the specific layer detected by another inspection apparatus and patterns at positions corresponding to the defects in layers other than the specific layer, classify the evaluated state of superimposition, calculate the ratio of the classification as inspection-result ratio, compare the calculated reference ratio and the calculated inspection-result ratio, and evaluate systematic defects by the comparison between the calculated reference ratio and the calculated inspection-result ra

Abstract: The present invention relates to a combustion control device incorporated in an apparatus such as water heater and provides the combustion control device having an improved configuration with a main controller and a sub controller, capable of employing a microcomputer with lower capability as the sub controller, and ensuring higher safety than ever before. Signals indicating a combustion state of a combustion apparatus are inputted into the main controller 35 and the sub controller 36 in parallel. Upon fulfillment of a predetermined condition of stopping, the main and sub controllers 35 and 36 each output a stop signal to cut off a current to be supplied to a device driving circuit 42. The conditions of stopping in outputting of the stop signal by the main and sub controllers are such that the sub controller 36 is less apt to execute the cutoff than the main controller 35.

Abstract: A technique for calculating the angle from an auxiliary dot sequence indicating the track of a pattern and for performing pattern measurement is provided, thereby enabling achievement of high-accuracy pattern measurement with reduced influence of the roughness of pattern edges.

Abstract: A method for classifying defects, including: calculating feature quantifies of defect image which is obtained by imaging a defect on a sample; classifying the defect image into a classified category by using information on the calculated feature quantities; displaying the classified defect image in a region on a display screen which is defined to the classified category; adding information on the classified category to the displayed defect image; transferring the displayed defect image which is added the information on the classified category to one of the other categories and displaying the transferred defect image in a region on the display screen which is defined to the one of the other categories; and changing information on the category.