Abstract: A pre-compensation method for delays caused by optical fiber chromatic dispersion, a multi-sub-carrier signal generator applying the method, and a transmitter applying the signal generator are applicable to an optical orthogonal frequency-division multiplexing (OFDM) system. The pre-compensation method includes receiving a plurality of pre-compensation values, in which the pre-compensation values correspond to sub-carriers; and transmitting the sub-carriers after delaying the sub-carriers by time of the corresponding pre-compensation values. The delay time between the sub-carriers is estimated at a receiver end and a pre-compensation value of the transmitter is set according to the delay time. The transmitter delays the pre-compensation values respectively when transmitting the respective sub-carriers. Therefore, the respective sub-carriers are able to reach a receiver at nearly the same time, thereby achieving a purpose of pre-compensating for the delays caused by optical fiber chromatic dispersion.

Abstract: A method for receiving an optical orthogonal frequency-division multiplexing (OFDM) signal and a receiver thereof are applicable to an optical OFDM system. The receiving method includes the following steps. An optical signal is converted into a digital signal. A symbol boundary of the digital signal is estimated. A guard interval of the digital signal is removed according to the symbol boundary, so as to generate an electrical signal. The electrical signal is converted into a plurality of frequency domain sub-carriers in a fast Fourier transform (FFT) manner. A timing offset is estimated with pilot carriers and frequency domain sub-carriers corresponding to the same symbol period. The estimated symbol boundary is compensated with the timing offset. Each frequency domain sub-carrier includes a plurality of pilot carrier signals. Through the receiving method, the timing offset arisen from chromatic dispersion of an optical fiber is effectively estimated and adopted for compensation.

Abstract: A method for fabricating a portion of an integrated circuit on a semiconductor substrate. The method includes cleaning the surface of the substrate, and forming a thin insulate over the substrate. The method also includes depositing a high dielectric constant (high-k) material over the thin insulate, and then performing a hydrogen-based anneal on the high-k material. The method further includes performing an oxygen-based anneal on the high-k material, wherein the hydrogen-based and oxygen-based anneals occur sequentially.

Abstract: A heat sink is slideably attached to a housing of an electronic control, retained by complemental snap-in elements and has a projection extending through a wall of the housing into abutting thermal engagement with an internal heat sink which is in intimate contact with the electronics of the control.