Abstract: This disclosure provides an electric actuator and a rotation control mechanism. The electric actuator includes: a motor; a speed reduction mechanism; an output part; and a rotation detection device. The output part extends in an axial direction and is disposed on one side in the axial direction with respect to a motor shaft of the motor. The rotation detection device has: a magnet that is fixed to the output part and extends in a circumferential direction of the output part; and a rotation sensor that faces the magnet in the axial direction or in a radial direction. The magnet has multiple magnetic poles disposed in the circumferential direction. At least one magnetic pole of the magnet is disposed at a predetermined angular position with respect to an angle reference position of the output part in a rotation direction.

Abstract: A semiconductor device includes a semiconductor chip mounted over a wiring substrate. A signal wiring for input for transmitting input signals to the semiconductor chip and a signal wiring for output for transmitting output signals from the semiconductor chip are placed in different wiring layers in the wiring substrate and overlap with each other. In the direction of thickness of the wiring substrate, each of the signal wirings is sandwiched between conductor planes supplied with reference potential. In the front surface of the semiconductor chip, a signal electrode for input and a signal electrode for output are disposed in different rows. In cases where the signal wiring for output is located in a layer higher than the signal wiring for input in the wiring substrate, the signal electrode for output is placed in a row closer to the outer edge of the front surface than the signal electrode for input.

Abstract: A change in a detection voltage due to the temperature is suppressed. A detector circuit includes: a first rectification element having an anode to which an input signal is inputted; a second rectification element having a cathode connected with a cathode of the first rectification element and having an anode connected to an output terminal; and a current mirror circuit for supplying a current to the first rectification element, and for supplying a current-mirror current of the current to the second rectification element.

Abstract: An electric actuator is provided. The electric actuator includes a motor, a deceleration mechanism, case, an output part, a first rotation sensor and a holding member that holds the first rotation sensor in the case. The case includes a first recess that is recessed from an inner surface of the case to one side in a first direction and a support surface that faces the other side in the first direction. The first rotation sensor includes a sensor main body which includes a sensor chip and is accommodated in the first recess and a projection that protrudes in a second direction orthogonal to the first direction from the sensor main body. The projection is supported on the support surface from one side in the first direction. The sensor main body is disposed on the other side in the first direction away from the bottom surface of the first recess.

Abstract: There is provided an electric actuator including a motor, a first case having a first opening, a second case having a second opening that opens to the other side in the axial direction, a rotation sensor, and a plurality of bus bars which are electrically connected to a plurality of sensor terminals that extend from the rotation sensor and are held in the second case. The first and second cases are fixed to each other while the first opening and the second opening face each other in the axial direction, and parts connecting the plurality of bus bars and the plurality of sensor terminals are disposed at positions shifted from each other in a circumferential direction and radially outward from the rotation sensor. Among the plurality of connecting parts, at least one pair of adjacent connecting parts are disposed at positions different from each other in the radial direction.

Abstract: A work determination system includes: a biological signal obtaining unit obtaining a biological signal of a worker from a sensor attached to the worker during work; a feature extraction computation unit computing a feature extraction of the obtained biological signal of the worker; a work determination unit determining a work of the worker on the basis of a comparison result between the computed feature extraction of the biological signal of the worker and learning data generated in advance; and a learning unit generating the learning data, wherein the learning unit generates a musculoskeletal model corresponding to each worker, generates a quasi biological signal by reproducing a work of a determination target with the musculoskeletal model, computes a feature extraction of the quasi biological signal, and generates the learning data by associating, with each worker, the work of the determination target and a feature extraction distribution of the quasi biological signal.

Abstract: To increase the number of selectable chips without adding a signal line to a general purpose memory controller. A semiconductor storage device includes a memory controller, a plurality of memory chips, a selection unit which is connected to the memory controller and is connected with the plurality of memory chips to be able to select any one of the plurality of memory chips, and a switch unit which is connected to the memory controller and the selection unit. The memory controller and the selection unit are connected by a signal line for transmitting a first signal outputted from the memory controller and configured to select the memory chips. The memory controller and the switch unit are connected by a signal line for transmitting a second signal outputted from the memory controller and configured to select the memory chips.

Abstract: An electric actuator includes a first wiring member with a first connection portion exposed to one side in an axial-direction of a first case and a second wiring member with a second connection portion exposed to another side in the axial-direction of a second case, the first and second connection portions each having two opposing portions that respectively oppose in first and second directions with first and second gaps therebetween, the first gap having a narrow portion and a wide portion (larger in the first direction) connected thereto on the other side in the axial-direction, the second gap having a narrow portion and a wide portion (larger in the second direction) connected thereto on the one side in the axial-direction, and the first and second gaps overlapping at least partially when the first and second case are fixed, and the first and second connection portions are electrically connected.

Abstract: A semiconductor memory device includes, in addition to a first switching circuit with which a data system signal line between a plurality of semiconductor memory portions and a memory controller is branched, a second switching circuit with which a non-data system signal line between the plurality of semiconductor memory portions and the memory controller is branched, and the first and second switching circuits share a switching signal line.

Abstract: An electric actuator includes a motor, a speed reduction mechanism, a case, an output portion, a first board, a rotation detection device that detects rotation of the output portion, a connector portion, a first wiring member electrically connected to electrical wiring via the connector portion, and a second wiring member electrically connected to the rotation detection device. The case includes a first case and a second case. The first board is accommodated in the first case. The rotation detection device is accommodated in the second case. The first wiring member includes a first connecting portion held in the first case. The second wiring member includes a second connecting portion held in the second case. The first connecting portion is exposed on one side in the axial direction of the first case. The second connecting portion is exposed on the other side in the axial direction of the second case.

Abstract: There is provided a breather structure of an actuator in which the breather structure is provided in a housing of the actuator, the breather structure including: a recessed groove positioned on an outer surface of the housing; a breathing hole which is positioned on a bottom surface of the recessed groove and passes through the housing in a first direction; a filter fixed to an inside of the housing so that the filter closes an opening of the breathing hole; a lid body which partially covers a region of the recessed groove including the breathing hole from an outside of the housing when viewed from the first direction; a breather opening portion positioned at a portion of the recessed groove exposed from the lid body; and a protrusion portion which protrudes from the bottom surface of the recessed groove to a side of the lid body.

Abstract: There is provided an electric actuator in which a speed reduction mechanism and an output portion are disposed adjacent to each other in a radial direction in an opening portion of a housing main body, a cover member has a speed reduction mechanism cover which faces and surrounds the speed reduction mechanism, an output portion cover which faces and surrounds the output portion, and a constricted portion which connects the speed reduction mechanism cover and the output portion cover, the cover member is fixed to the housing main body by a plurality of caulking portions provided on a side wall portion, and, between two adjacent caulking portions interposing the constricted portion therebetween, one of the two caulking portions of the speed reduction mechanism cover is fixed toward a central axis of the speed reduction mechanism, and the other is fixed toward a central axis of the output portion.

Abstract: An insert member includes a bending portion, a first portion, and a second portion. The bending portion is interposed between the first portion and the second portion. A device for integrally molding the insert member and resin includes a holding portion configured to securely hold the first portion, a surface configured to contact a bottom surface of the second portion, and a gate configured to inject resin from a position nearer to the first portion than to the second portion, into a cavity. The cavity has a shape which causes a flow speed of the resin in a space above the second portion to be higher than a flow speed of the resin in a space at a side of the second portion.

Abstract: There is provided an electric actuator including: a motor that has a motor shaft, a speed reduction mechanism, an output portion that has an output shaft portion, a rotation detection device, and a first bearing. The output shaft portion extends in an axial direction and is disposed on one side in the axial direction of the motor shaft. The output portion has a first recessed portion recessed from the other side to the one side in the axial direction. An end portion of the motor shaft on the one side in the axial direction is accommodated in the first recessed portion. The first bearing is fixed to an inside surface of the first recessed portion in a radial direction. At least a portion of the rotation detection device is disposed at a position overlapping the first recessed portion in the radial direction.

Abstract: In a memory controller, command, address and data are allocated to transmit the command, the address and the data to each of the plurality of memory devices through the same bus signal line and an identification signal to identify the command, the address and the data on the bus signal line is allocated to a memory common signal line in common among the plurality of memory devices to transmit the identification signal. When the memory controller indicates the data through the identification signal so as to make a first memory device transfer the data through the bus signal line, the memory controller makes the data transfer by the first memory device suspended, indicates the command through the identification signal so as to issue the command to a second memory device, and indicates the address through the identification signal so as to issue the address to the second memory device.

Abstract: Provided is a semiconductor inspection circuit which is capable of inspecting connection states of power supply, ground, and signal bumps in a semiconductor package or a printed circuit board equipped with a semiconductor LSI mounted in a product operation state. As a means to solve the problem, a circuit capable of switching a path is provided at an input portion of a driver/receiver, a mechanism capable of transferring an output of a path switching circuit near a receiver circuit to a voltage waveform circuit with an internal variable terminal is provided, and a breakage state of a bump can be observed in the product operation state by observing a DC level at a terminal having a certain DC resistance when a signal bump connection state is observed and receiving a step wave and observing a response waveform thereof when an IO power supply bump connection state is observed.

Abstract: A memory module having different types of memory mounted together on a double-sided substrate has a first edge and opposite second edge and includes a plurality of memory controllers, a plurality of flash memories, and a plurality of second memories having a higher signal transmission rate than the flash memories. A socket terminal for connecting the double-sided substrate to a motherboard is formed on the front surface and the back surface of the double-sided substrate on the first edge side; the memory controllers are disposed on the second edge side; the second memories are disposed on the second edge side at positions opposite the positions at which the memory controllers are disposed; and the flash memories are disposed on at least the back surface thereof at positions that are closer to the first edge than are the positions at which the memory controllers and the second memories are disposed.

Abstract: Provided is a semiconductor inspection circuit which is capable of inspecting connection states of power supply, ground, and signal bumps in a semiconductor package or a printed circuit board equipped with a semiconductor LSI mounted in a product operation state. As a means to solve the problem, a circuit capable of switching a path is provided at an input portion of a driver/receiver, a mechanism capable of transferring an output of a path switching circuit near a receiver circuit to a voltage waveform circuit with an internal variable terminal is provided, and a breakage state of a bump can be observed in the product operation state by observing a DC level at a terminal having a certain DC resistance when a signal bump connection state is observed and receiving a step wave and observing a response waveform thereof when an IO power supply bump connection state is observed.

Abstract: A semiconductor memory device includes, in addition to a first switching circuit with which a data system signal line between a plurality of semiconductor memory portions and a memory controller is branched, a second switching circuit with which a non-data system signal line between the plurality of semiconductor memory portions and the memory controller is branched, and the first and second switching circuits share a switching signal line.

Abstract: Provided is a circuit substrate for a semiconductor package used for mounting a plurality of semiconductor devices. The circuit substrate including: a first circuit substrate unit; and a second circuit substrate unit that is formed on the first circuit substrate unit, wherein Young's modulus of a first dielectric material composing the dielectric layer of the first circuit substrate unit is higher than Young's modulus of a second dielectric material composing the dielectric layer of the second circuit substrate unit, and a coefficient of thermal expansion of the first dielectric material composing the dielectric layer of the first circuit substrate unit is smaller than a coefficient of thermal expansion of the second dielectric material composing the dielectric layer of the second circuit substrate unit.