Abstract: A storage system includes: a memory, configured to write or read a plurality of pieces of data during a read-write operation, the plurality of pieces of data being divided into M bytes, and each byte having N pieces of data; and an encoding circuit, configured to in the encoding stage, generate X first check codes based on the two or more pieces of data in each byte, generate Y second check codes based on all data of two or more bytes of the M bytes in the encoding stage, and generate a third check code based on the plurality of pieces of data, the X first check codes and the Y second check codes. The first check codes, the second check codes and the third check code are used to determine an error state of the plurality of pieces of data.

Abstract: Embodiments of the present disclosure provide a test method and apparatus for a control chip, an electronic device, relating to the field of semiconductor device test technology. The method includes: reading first test vectors stored in a first target memory chip; sending the first test vectors to the control chip; receiving first output information returned by the control chip in response to the first test vectors; and acquiring a first test result of the control chip based on the first output information and the first test vectors corresponding to the first output information. By means of the technical solutions provided in the embodiments of the present disclosure, a memory chip can be used for storing test vectors for a control chip, so that a storage space for test vectors can be enlarged, and the test efficiency can be increased.

Abstract: An error correction system is disclosed. The error correction system is applied to a storage system. The error correction system generates X first operation codes, Y second operation codes and a third operation code based on the storage system. The error correction system includes an error state determining circuit and M decoding circuits. The error state determining circuit is configured to identify a current error state. When a plurality of pieces of data have a 1-bit error, the M decoding circuits are configured to execute decoding processing on the X first operation codes and the Y second operation codes, to obtain whether there is erroneous data in the bytes corresponding to the decoding circuits and locate a bit to which the erroneous data belongs.

Abstract: A read-write circuit of a one-time programmable memory, including: an antifuse array including: n*n antifuse units, between a first node and a second node, the control terminals of switching elements in the antifuse units coupled to AND signals of different word line signals and bit line signals: the first switching device and the first capacitor connected in parallel between the second node and the second voltage source; the reference array including reference resistance and reference switching elements connected in series between the the first and third nodes, the reference switching element's control end coupled to OR signals of the n*n AND signals; the second switching device and the second capacitor connected in parallel between the third node and second voltage source; a comparison circuit's first input terminal coupled to the second node and second input terminal coupled to the third node. The circuit has simpler connections, smaller area, and higher reliability.

Abstract: Embodiments of the present disclosure provide a test method and apparatus for a control chip, and an electronic device, which relate to the field of semiconductor device test technologies. The control chip includes a built-in self-test BIST circuit. The method is performed by the BIST circuit. The method includes: reading first test vectors stored in a first target memory chip; sending the first test vectors to the control chip; receiving first output information returned by the control chip in response to the first test vectors; and acquiring a first test result of the control chip based on the first output information and the first test vectors corresponding to the first output information. By means of the technical solutions provided in the embodiments of the present disclosure, so that a storage space for test vectors can be enlarged, and the test efficiency can be increased.

Abstract: The present disclosure provides a sense amplifier, a memory, and a method for controlling a sense amplifier, relating to the technical field of semiconductor memories. The sense amplifier comprises: an amplification module; and a control module, electrically connected to the amplification module; wherein, in an offset compensation stage of the sense amplifier, the control module is used to configure the amplification module to comprise a diode structure, a current mirror structure, and an inverter with an input and an output connected together; and in a first amplification stage of the sense amplifier, the control module is used to configure the amplification module as an inverter. The present disclosure can realize the offset compensation of the sense amplifier, thereby improving the performance of semiconductor memories.

Abstract: Embodiments of the present application provide a semiconductor structure and a semiconductor structure manufacturing method. The semiconductor structure includes: a wordline; and a first bitline and a second bitline located on two sides of the wordline and a first memory structure and a second memory structure located on the two sides of the wordline. The first bitline and the second bitline are connected to the first memory structure and the second memory structure respectively through a transistor. An extension direction of the first bitline is perpendicular to an extension direction of the wordline.

Abstract: A semiconductor structure and a method for manufacturing the semiconductor structure are provided. The semiconductor structure includes a semiconductor base, a bit line and a word line. The semiconductor base includes a substrate and an isolation structure. The isolation structure is arranged above the substrate and configured to isolate a plurality of active regions from each other. The bit line is arranged in the substrate and connected to the plurality of active regions. The word line is arranged in the isolation structure, intersects with the plurality of active regions and surrounds the plurality of active regions. The substrate is a Silicon-On-Insulator (SOI) substrate.

Abstract: A semiconductor structure includes a semiconductor base, a bit line and a word line. The semiconductor base includes a substrate and an isolation structure arranged above the substrate and configured to isolate a plurality of active regions from each other. The bit line is arranged in the substrate and connected to the plurality of active regions. The word line intersects with the plurality of active regions and surrounds the plurality of active regions.

Abstract: Embodiments of this application provide a method and system for adjusting a memory, and a semiconductor device. The method for adjusting a memory includes: acquiring a mapping relationship among a temperature of a transistor, a substrate bias voltage of a sense amplification transistor in a sense amplifier, and an actual data writing time of the memory; acquiring a current temperature of the transistor; and adjusting the substrate bias voltage on the basis of the current temperature and the mapping relationship, such that an actual data writing time corresponding to an adjusted substrate bias voltage is within a preset writing time.

Abstract: A method for forming a semiconductor structure and the semiconductor structure are provided. The method for forming the semiconductor structure includes: providing a substrate, wherein a separate bit line structure is formed on the substrate; forming a first sacrificial layer on the side wall of the bit line structure; forming a first dielectric layer filling gap between the bit line structures; patterning the first dielectric layer and the first sacrificial layer to form a through hole, wherein the through hole and the remaining first dielectric layer and first sacrificial layer are alternately arranged; forming a second sacrificial layer on the side wall of the through hole, and filling the through hole to form a contact plug; forming a contact structure on the contact plug; and removing the first sacrificial layer to form a first air gap, and removing the second sacrificial layer to form a second air gap.

Abstract: A forming method for a semiconductor structure and the semiconductor structure are provided. The forming method of the semiconductor structure includes: providing a substrate, wherein separate bit line structures are formed on the substrate; forming a first sacrificial layer on a sidewall of a bit line structure; forming first dielectric layer filling gaps between adjacent bit line structures; patterning a first dielectric layer to form vias, wherein the vias expose active regions of the substrate, and the vias and remaining parts of the first dielectric layers are alternately arranged in an extension direction of the bit line structures; forming a second sacrificial layer on sidewalls of a via, and filling the via to form a contact plugs; forming a contact structure on the contact plug; and removing the first sacrificial layer to form first air gap, and removing the second sacrificial layer to form a second air gap.

Abstract: Embodiments of the present disclosure propose a semiconductor packaging method and a semiconductor structure. The semiconductor packaging method includes: providing a substrate; forming a metal pad on the substrate, where there is a gap between a sidewall of the metal pad and the substrate; and connecting multiple metal pads on substrates to each other.

Abstract: The present disclosure in the field of memory technology proposes a programmable storage cell, a programmable storage array and a reading and writing method for the programmable storage array. The programmable storage cell includes: a first anti-fuse element connected between a first power terminal and an output terminal, a second anti-fuse element connected between the second power terminal and the output terminal, and a third switch unit connected to the output terminal, a third power terminal and a position signal terminal, where the third switch unit responds to the signal from the position signal terminal so as to connect the third power terminal and the output terminal. The programmable storage cell has a simple structure and a high reading speed.

Abstract: An embodiment of the present application provides a manufacturing method of a semiconductor structure, including: providing a base; forming a first mask layer with a first mask pattern on the base, and etching the base with the first mask layer as a mask to form an active region; forming a plurality of discrete bitlines on the active region; sequentially stacking a first spacer layer and a second spacer layer on a side wall of the bitline; forming a sacrificial layer between the adjacent second spacer layers; forming a second mask layer with a second mask pattern on the sacrificial layer, the first mask pattern being complementary to the second mask pattern; etching the sacrificial layer with the second mask layer and the bitline as masks to form multiple contact hole structures; and etching the first spacer layer to form a gap between the second spacer layer and the bitline.

Abstract: The present disclosure provides a sense amplifier, a memory, and a method for controlling a sense amplifier, relating to the technical field of semiconductor memories. The sense amplifier comprises: an amplification module, configured to read data in a storage unit on a bit line or a storage unit on a reference bit line; and a first switch module, configured to control the amplification module to be disconnected from the reference bit line when the sense amplifier reads a first state for the bit line and the sense amplifier is in an amplification stage, and control the amplification module to be connected to the reference bit line when the sense amplifier reads a second state for the bit line and the sense amplifier is in the amplification stage. The present disclosure can reduce the power consumption of the sense amplifier.

Abstract: A semiconductor structure and a manufacturing method thereof are provided. A semiconductor structure includes a semiconductor body, bit lines and word lines. The semiconductor body includes a substrate and an isolation structure positioned above the substrate and configured to isolate a plurality of active regions, part of each of the active regions being formed from the substrate. The bit lines are positioned in the substrate and are connected to the active regions. The word lines intersect with the active regions and surround the active regions. The substrate is Silicon On Insulator (SOI) substrate.

Abstract: A contact window structure, a metal plug and a forming method thereof, a method of forming the contact window structure and a semiconductor structure are provided. In the method of forming the contact window, an annular pad is formed on a surface of a target layer. A central via, from which partial surface of the target layer is exposed, is formed in the middle part of the annular pad. A dielectric layer covering a substrate, the target layer and the annular pad is formed. The dielectric layer is etched to form an etch hole connected to the central via in the dielectric layer. The annular pad is removed along the etch hole and the central via to enlarge a size of the central via, so as to form the contact window structure by the etch hole and the central via with the enlarged size.

Abstract: Provided is a manufacturing method of a semiconductor structure, including: providing a substrate; forming a first mask layer having a first mask pattern on the substrate, and etching the substrate by using the first mask layer as a mask to form active regions; forming several discrete bitlines on the active regions; forming a sacrificial layer between adjacent bitlines; forming a second mask layer having a second mask pattern on the sacrificial layer, the first mask pattern and the second mask pattern being complementary to each other; and etching the sacrificial layer by using the second mask layer and the bitlines as masks to form a plurality of contact structures. The embodiment of the present disclosure is beneficial to reducing the manufacturing cost of the semiconductor structure.

Abstract: A semiconductor structure and a semiconductor structure manufacturing method is provided. The semiconductor structure includes: a wordline; and a first bitline and a second bitline located on two sides of the wordline and a first storage structure and a second storage structure located on the two sides of the wordline, the first bitline and the second bitline being connected to the first storage structure and the second storage structure respectively through a transistor. An extension direction of the first bitline and an extension direction of the wordline are at an acute or obtuse angle. In this way, the first storage structure and the second storage structure are provided on both sides of the wordline, which can increase storage capacity.