Abstract: A sense amplifier, a memory and a method for controlling the sense amplifier are provided. The sense amplifier includes: an amplification module configured to read data in a storage unit on a first or second bit line; a control module electrically connected to the amplification module. When data in the storage unit on the first bit line is read, in a first amplification phase of the sense amplifier, the control module configures the amplification module to include a first current mirror structure and connects a mirror terminal of the first current mirror structure to the second bit line; when data in the storage unit on the second bit line is read, in the first amplification phase of the sense amplifier, the control module configures the amplification module to include a second current mirror structure and connects a mirror terminal of the second current mirror structure to the first bit line.

Abstract: Embodiments of the present application provide a semiconductor structure that comprises a semiconductor substrate having a first surface and a second surface opposite to the first surface, a solder pad located at the first surface, a heat transfer layer located at the first surface and being in contact with the solder pad, and a groove located in the semiconductor substrate and being connected to the heat transfer layer.

Abstract: A memory includes: a control chip; and a plurality of storage chips, in which the plurality of storage chips are electrically connected with the control chip via a common communication channel, the plurality of storage chips include a first storage chip set and a second storage chip set, the storage chips in the first storage chip set are configured to perform information interaction with the control chip by adopting a first clock signal, the storage chips in the second storage chip set are configured to perform information interaction with the control chip by adopting a second clock signal, and phase of the first clock signal is different from phase of the second clock signal.

Abstract: The present disclosure provides an electrostatic protection device and an electrostatic protection circuit. The electrostatic protection device includes: a discharge transistor, located on a substrate for discharging electrostatic charges; and a first pad, located on a first metal layer and electrically connected to a drain region of the discharge transistor; wherein a projection of the first pad on the substrate partially overlaps a projection of the drain region on the substrate.

Abstract: A sense amplifier, a memory and a method for controlling the sense amplifier are provided. The sense amplifier includes: an amplification module, arranged to read data in a memory cell; and a control module, electrically connected to the amplification module. In a first offset compensation stage of the sense amplifier, the control module is arranged to configure the amplification module to include a first inverter and a second inverter, and each of the first inverter and the second inverter is an inverter an input terminal and an output terminal connected to each other; and in a second offset compensation stage of the sense amplifier, the control module is arranged to configure the amplification module to include a current mirror structure.

Abstract: Embodiments of the disclosure, there is provided a method, a system for adjusting the memory, and a semiconductor device. The method for adjusting the memory includes: acquiring a mapping relationship between a temperature of a transistor, an equivalent width-length ratio of a sense amplifier transistor in a sense amplifier and an actual time at which the data is written into the memory; acquiring a current temperature of the transistor; and adjusting the equivalent width-length ratio, based on the current temperature and the mapping relationship, so that the actual time at which the data is written into the memory corresponding to the adjusted equivalent width-length ratio is within a preset writing time.

Abstract: A sense amplifier includes an amplification module and a control module electrically connected to the amplification module. Herein, in a case of reading a data in a memory cell on a first bit line, at an offset compensation stage of the sense amplifier, the control module is arranged to configure the amplification module to include a first diode structure, a first current mirror structure, and a first inverter with an input terminal and an output terminal connected to each other. In a case of reading a data in a memory cell on a second bit line, at the offset compensation stage of the sense amplifier, the control module is arranged to configure the amplification module to include a second diode structure, a second current mirror structure, and a second inverter with an input terminal and an output terminal connected to each other.

Abstract: The sense amplifier includes: an amplification module configured to amplify a voltage transmitted by a bit line or a reference bit line, when the sense amplifier is at an amplification stage; a first switch module configured to control the amplification module to be disconnected from the reference bit line, when the sense amplifier performs a read operation for the bit line and is at the amplification stage. In the disclosure, the power consumption of the sense amplifier may be reduced.

Abstract: A sense amplifier includes: an amplification circuit, configured to read data of a memory cell on a first bit line or a second bit line; and a first offset voltage storage cell and a second offset voltage storage cell, respectively and electrically connected to the amplification circuit, wherein in a case where the data in the memory cell on the first bit line is read, in an offset elimination stage of the sense amplifier, the sense amplifier is configured to store an offset voltage of the sense amplifier in the first offset voltage storage cell; and in a case where the data in the memory cell on the second bit line is read, in the offset elimination stage of the sense amplifier, the sense amplifier is configured to store the offset voltage of the sense amplifier in the second offset voltage storage cell.

Abstract: The disclosure provides a Sense Amplifier (SA), a memory and a method for controlling the SA, and relates to the technical field of semiconductor memories. The SA includes: an amplifier module; an offset voltage storage unit electrically connected to the amplifier module and configured to store an offset voltage of the amplifier module in an offset elimination stage of the SA; and a load compensation unit electrically connected to the amplifier module and configured to compensate a difference between loads of the amplifier module in an amplification stage of the SA. The disclosure may improve an accuracy of reading data of the SA.

Abstract: An injection mould and an injection moulding method are provided. The injection mould includes: a base plate, configured to place a package chip to be injection-moulded, the package chip including a substrate and at least one chip fixed on a surface of the substrate by a flip chip process, the substrate having a through hole, a glue injection channel being formed in the base plate and configured to inject a moulding compound, and the glue injection channel being connected with the through hole on the substrate. The above-mentioned injection mould can improve the reliability of the package chip after injection moulding.

Abstract: The present invention provides a semiconductor manufacturing method. A substrate having a plurality of first trenches can be provided. The substrate can include a first pattern formed between two adjacent first trenches. A first dielectric layer can be deposited onto the substrate. The first dielectric layer can cover at least one side wall of the first pattern. A second dielectric layer can be deposited onto the substrate. The second dielectric layer can fill the first trenches. The first pattern can be severed to form a second pattern on the substrate. The second dielectric layer can be removed from the first trenches.

Abstract: A memory and a formation method thereof are provided. The formation method includes: providing a substrate; forming a first mask layer on a surface of the substrate, in the first mask layer there being formed a plurality of strip-shaped patterns arranged in parallel; forming a second mask layer on the first mask layer, in the second mask layer there being formed a plurality of first patterns and a plurality of second patterns, the plurality of first patterns being arranged in an array and being overlapped with the strip-shaped patterns, the plurality of second patterns covering ends of a part of the strip-shaped patterns; and etching layer by layer into the substrate by using the first mask layer and the second mask layer as masks to transfer the strip-shaped patterns, the first patterns and the second patterns into the substrate.

Abstract: A memory formation method includes: providing a substrate; forming a first mask layer on the substrate, in the first mask layer there being formed a plurality of parallel-arranged strip-shaped patterns positioned above the array area, and an end of each of the strip-shaped patterns being connected to the first mask layer on the peripheral area of the substrate; forming a second mask layer on the first mask layer, in the second mask layer there being formed a plurality of first patterns; and etching layer by layer by using the second mask layer and the first mask layer as masks to transfer the strip-shaped patterns and the first patterns into the substrate to form the discrete active areas arranged in an array.

Abstract: A semiconductor structure and a method for forming same, the forming method including: providing a base, where the base includes a substrate and a fin protruding from the substrate, an isolation layer is formed on the substrate exposed by the fin, and the isolation layer covers a part of side walls of the fin; forming a dummy gate structure across the fin, including a dummy gate layer, where the dummy gate structure covers a part of the top and a part of the side walls of the fin; forming an interlayer dielectric layer on the substrate exposed by the dummy gate structure, where the interlayer dielectric layer exposes the top of the dummy gate structure; removing the dummy gate layer and forming an opening in the interlayer dielectric layer; removing partial thickness of the isolation layer exposed by the opening and forming a groove in the isolation layer; and forming a gate structure in the groove and the opening, where the gate structure crosses the fin and covers a part of the top and a part of the side wa

Abstract: An injection mould and an injection moulding method are provided. The injection mould includes a base plate used to place a packaged chip to be injection moulded including a substrate and at least one of the chips fixed on the front substrate by a flip chip process. The substrate has a gas hole. Two or more gas ducts that extend in at least two intersected directions and connect with one another are formed in the base plate. Two ends of each one of gas ducts are open, and at least one of the gas ducts is buried into the base plate. Each one of gas ducts is provided with a gas outlet. When the packaged chip is placed on the base plate, the gas outlet connects with the gas hole of the substrate.

Abstract: A package structure and a method for forming the same are provided. The package structure includes: a substrate, in which the substrate has a first surface and a second surface being opposite to the first surface, and has an opening penetrating through the first surface to the second surface of the substrate, the opening is in a long strip shape with a size at both two ends larger than a size at middle; a chip, in which the chip is fixed on the first surface of the substrate through solder bumps in a flipped over mode, and electrically connects with the substrate through the solder bumps, and the opening is located in a projection of the chip on the substrate; and a moulding compound wrapping the chip and filling the opening and a gap between the chip and the first surface of the substrate.

Abstract: Embodiments provide a method for packaging a semiconductor, a semiconductor package structure, and a package. The method includes: providing a substrate wafer having a first surface and a second surface arranged opposite to each other, the first surface having a plurality of grooves, a plurality of electrically conductive pillars being provided at a bottom of the groove, and the electrically conductive pillar penetrating through the bottom of the groove to the second surface; providing a plurality of semiconductor die stacks; placing the semiconductor die stack in the groove; and covering a cover plate wafer on the first surface of the substrate wafer to seal up the groove so as to form a semiconductor package structure, a gap between the substrate wafer, the semiconductor die stack and the cover plate wafer being not filled with a filler.

Abstract: Embodiments provide a method for packaging a semiconductor, a semiconductor package structure, and a package. The packaging method includes: providing a substrate wafer having a first surface and a second surface arranged opposite to each other, the first surface having a plurality of grooves, a plurality of electrically conductive pillars being provided at a bottom of the groove, and the electrically conductive pillar penetrating through the bottom of the groove to the second surface; providing a plurality of semiconductor die stacks; placing the semiconductor die stack in the groove; and filling an insulating dielectric in a gap between a sidewall of the groove and the semiconductor die stack to form an insulating dielectric layer covering an upper surface of the semiconductor die stack to seal up the semiconductor die stack so as to form the semiconductor package structure.

Abstract: Embodiments provide a method for packaging a semiconductor, a semiconductor package structure, and a package. The packaging method includes: providing a substrate wafer having a first surface and a second surface arranged opposite to each other, the first surface having a plurality of grooves, a plurality of electrically conductive pillars being provided at a bottom of the groove, and the electrically conductive pillar penetrating through the bottom of the groove to the second surface; providing a plurality of semiconductor die stacks; placing the semiconductor die stack in the groove, an upper surface of the semiconductor die stack being lower than or flush with an upper edge of the groove, and a bottom of the semiconductor die stack being electrically connected to the electrically conductive pillar; and providing an insulating material on the semiconductor die stack to form a semiconductor package structure.