Abstract: A light emitting drive substrate, a manufacturing method of the light emitting drive substrate, a light emitting substrate and a display device. The light emitting drive substrate includes a first light-emitting subregion, a second light-emitting subregion, a periphery area, a first power supply wire and a second power supply wire. A resistance between the first end and the second end of the first power supply wire is equal to a resistance between the first end and the second end of the second power supply wire, and a wire length between the first end and the second end of the first power supply wire is not equal to a wire length between the first end and the second end of the second power supply wire.

Abstract: Disclosed herein is a photoelectric sensor, display panel and their manufacturing method. The photoelectric sensor may comprise a photodeformable unit and a piezoelectric unit in contact with the photodeformable unit.

Abstract: An array substrate is provided. The array substrate includes a display area having a first array of subpixels; and a partially transparent area having a second array of subpixels. The partially transparent area includes a plurality of light emitting regions spaced apart from each other by a substantially transparent non-light emitting region. The second array of subpixels is limited in the plurality of light emitting regions. The array substrate further includes a plurality of photosensors and a plurality of first thin film transistors in the substantially transparent non-light emitting region. A respective one of the plurality of photosensors includes a first polarity semiconductor layer, a second polarity semiconductor layer, and an intrinsic semiconductor layer connecting the first polarity semiconductor layer and the second polarity semiconductor layer.

Abstract: A display backplane includes a base, a plurality of driving electrodes disposed above the base, and a connection structure disposed on at least one of the plurality of driving electrodes. An orthographic projection of the connection structure on the base is within an orthographic projection of a corresponding driving electrode on the base; and the connection structure includes at least one conductive portion disposed at a first included angle with the corresponding driving electrode.

Abstract: An array substrate is provided. The array substrate includes a base substrate; a first bonding pad layer including a plurality of first bonding pads on a first side of the base substrate; a second bonding pad layer including a plurality of second bonding pads on a second side of the base substrate, wherein the second side is opposite to the first side; and a plurality of signal lines on a side of the second bonding pad layer away from the base substrate. A respective one of the plurality of second bonding pads extends through the base substrate to electrically connect to a respective one of the plurality of first bonding pads. The respective one of the plurality of first bonding pads includes a protruding portion protruding away from the first side of the base substrate along a direction from the second side to the first side.

Abstract: The present disclosure discloses a mass transfer method and system for micro light emitting diodes, wherein the mass transfer method includes: providing a component substrate on which a plurality of micro light emitting diodes are formed; picking up the micro light emitting diodes on the component substrate at least once by a plurality of bonding structures on a first medium load substrate, and transferring micro light emitting diodes picked up every time to a second medium load substrate; and transferring the micro light emitting diodes on the second medium load substrate into corresponding sub-pixels on a target substrate at one time, wherein one of the micro light emitting diodes on the second medium load substrate corresponds to one of the sub-pixels on the target substrate.

Abstract: Provided is a display backplate includes including an array substrate and a plurality of pairs of connection structures on the array substrate, wherein the array substrate includes a plurality of thin-film transistors and a common electrode signal line, wherein at least one of the plurality of thin-film transistors is connected to one of a pair of connection structures and the common electrode signal line is connected to the other of the pair of connection structures; and an area of a first section of the connection structure is negatively correlated with a distance between the first section and a surface of the array substrate, and the first section is parallel to the surface of the array substrate.

Abstract: In embodiments of the present disclosure, there is provided a display substrate assembly including: a base substrate; a light shielding layer on the base substrate; and an active layer of a thin film transistor, above the base substrate. An orthographic projection of the active layer on the base substrate in a thickness direction of the base substrate is within an orthographic projection of the light shielding layer on the base substrate in the thickness direction of the base substrate, and the light shielding layer includes an ion-doped amorphous silicon layer. In embodiments of the present disclosure, there is also provided a method of manufacturing a display substrate assembly and a display apparatus including the display substrate assembly.

Abstract: The present disclosure provides a driving substrate, a method for preparing the same, and a flexible display device. The driving substrate includes: a base substrate; a first driving function layer arranged on a first surface of the base substrate, the first driving function layer including a plurality of driving thin film transistors and a plurality of signal wirings, and at least one of the plurality of signal wirings being of a single-layer structure and having a thickness greater than a threshold; a pad layer arranged on a surface of the first driving function layer away from the base substrate, the pad layer including a plurality of first pads and a plurality of second pads, and each first pad being connected to a first electrode of the corresponding driving thin film transistor and each second pad being connected to a common electrode line in the plurality of signal wirings.

Abstract: The present disclosure provides a driving substrate, a method for preparing the same, and a display device. The driving substrate includes: a base substrate; a stress buffer layer located on the base substrate; a plurality of first wirings located on a surface of the stress buffer layer away from the base substrate; a first insulating layer located on a surface of the first wiring away from the base substrate; a plurality of second wiring structures located on a surface of the first insulating layer away from the base substrate; a second insulating layer located on a surface of the second wiring structure away from the base substrate; an electronic element located on a surface of the second insulating layer away from the base substrate.

Abstract: A conductive pattern and a method for manufacturing the same, a thin film transistor, a display substrate and a display device are provided. The method includes: step A, forming a metal layer on a base substrate; step B, forming a first conductive buffer layer on the metal layer; step C, patterning the metal layer and the first conductive buffer layer to form a conductive sub-pattern; and performing steps A to C repeatedly for N times to form N conductive sub-patterns that are stacked on the base substrate. The conductive pattern comprises the N conductive sub-patterns, and N is a positive integer greater than 1.

Abstract: Disclosed are a flexible substrate, a preparation method thereof, and a display device, to improve the encapsulation effect and the product yield. The flexible substrate includes: a base substrate, where the base substrate has a plurality of sub-pixel areas arranged in an array, connection areas each for connecting adjacent sub-pixel areas; and hollow areas among the sub-pixel areas and the connection area; in each sub-pixel area, there are a pixel circuit, an isolation structure surrounding the pixel circuit, and a light-emitting functional layer covering the pixel circuit and the isolation structure; the isolation structure has a hollow pattern at a junction of the sub-pixel area and the connection area; the connection area has a signal line therein, and the signal line is electrically connected with the pixel circuit through the hollow pattern; and the isolation structure has an undercut that interrupts the light-emitting functional layer.

Abstract: The present disclosure provides a display backplane and a method for manufacturing the same, a display panel, and a display device. The display backplane includes: a substrate; a first thin film transistor located on one side of the substrate; and a second thin film transistor located on the one side of the substrate, wherein: the first thin film transistor comprises a first active layer, the second thin film transistor comprises a second active layer, wherein the first active layer and the second active layer are located in a same layer, and a material of the first active layer is different from that of the second active layer.

Abstract: A color filter (CF) substrate, a manufacturing method thereof, a display panel, a display device and an operation method thereof are provided. The CF substrate includes: a base substrate, a CF pixel array and image sensors. The CF pixel array is provided on the base substrate and includes CF pixel units in an array. The image sensors are provided on the CF pixel array, correspond to the CF pixel units, and are configured to receive light travelling through the CF pixel units for imaging.

Abstract: A display panel, a manufacturing method thereof, and a display device. The manufacturing method comprises: sequentially forming a sacrificial layer and a flexible substrate on a surface of a side of a rigid base plate; forming a connection-via pair in the flexible substrate; forming a conductive layer on the flexible substrate, and forming connection portions; forming a leveling layer; forming driving circuits corresponding one-to-one to the connection-via pairs on the flexible substrate, and forming a driving chip on a side of the driving circuits facing away from the flexible substrate, the driving chip being electrically connected to the driving circuits; separating the sacrificial layer from the flexible substrate; and forming a micro LED device on a surface of the flexible substrate facing away from the driving circuits, the micro LED device being electrically connected to the connection portions.

Abstract: Embodiments of the present disclosure provide an array substrate, a display device, a method for manufacturing an array substrate, a method for manufacturing a display device, and a spliced display device. The array substrate includes: a base substrate in which a through hole is provided; a filling portion disposed in the through hole, including a recessed structure and made from a flexible material; an electrically conductive pattern disposed on the filling portion and at least partially located in the recessed structure; and a film layer disposed on a side of the electrically conductive pattern facing away from the base substrate.

Abstract: A circuit backplane of a display panel, a method for manufacturing the same, and a display panel are provided. The circuit backplane includes a substrate and a plurality of circuit regions on the substrate. Each of the plurality of circuit regions includes a cathode soldered electrode, an anode soldered electrode, and a flow blocking island that are on the substrate. The flow blocking island is between the cathode soldered electrode and the anode soldered electrode, and in a thickness direction of the circuit backplane, a height of the flow blocking island is greater than each of a height of the cathode soldered electrode and a height of the anode soldered electrode.

Abstract: The present disclosure provides a display substrate and a manufacturing method thereof, and a display device. In the display substrate of the present disclosure, a first transistor comprises a first gate electrode, a first electrode, a second electrode, and a first active layer; and a second transistor comprises a second gate electrode, a third electrode, a fourth electrode, and a second active layers, wherein the first active layer comprises a silicon material, the second active layer comprises an oxide semiconductor material, and wherein the third electrode and the first gate electrode are disposed in the same layer, and the fourth electrode and the first electrode, the second electrodes are disposed in the same layer.

Abstract: A display substrate, a method for fabricating the same, and a display device are provided. The display substrate includes: a substrate 100 that includes a first via filled with a first conductive section 4011; a drive thin film transistor that is placed on a first side of the substrate and includes a first terminal 2051; and a light emitting diode chip 300 that is placed on a second side of the substrate distal to the drive thin film transistor; wherein the light emitting diode chip 300 includes a first lead 301 and a second lead 302; the first lead 301 is in electrical contact with the first terminal 2051 through the first conductive section 4011; and the second lead 302 is in electrical contact with a second electrode 402 that is placed on the second side of the substrate.

Abstract: Disclosed are a flexible substrate, a preparation method thereof, and a display device, to improve the encapsulation effect and the product yield. The flexible substrate includes: a base substrate, where the base substrate has a plurality of sub-pixel areas arranged in an array, connection areas each for connecting adjacent sub-pixel areas; and hollow areas among the sub-pixel areas and the connection area; in each sub-pixel area, there are a pixel circuit, an isolation structure surrounding the pixel circuit, and a light-emitting functional layer covering the pixel circuit and the isolation structure; the isolation structure has a hollow pattern at a junction of the sub-pixel area and the connection area; the connection area has a signal line therein, and the signal line is electrically connected with the pixel circuit through the hollow pattern; and the isolation structure has an undercut that interrupts the light-emitting functional layer.