Chip module and a fabrication method thereof
A chip module and a fabricating method thereof are provided. Firstly, a substrate is provided. Next, a chip is assembled on the substrate and electrically connected with the substrate. Afterward, a plurality of passive units is assembled on the substrate in the style of encircling the chip. Then, a first glue structure is filled between the passive units so that an encircled area is defined by the first glue structure and the passive units. Then, a second glue structure is filled in the encircled area so that the chip is covered by the second glue structure.
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This application claims the benefit of Taiwan application Serial No. 96133942, filed Sep. 11, 2007, the subject matter of which is incorporated herein by reference.
BACKGROUND OF THE INVENTION1. Field of the Invention
The invention relates in general to a chip module and a fabricating method thereof, and more particularly to a chip module with a power amplifier and a fabricating method thereof.
2. Description of the Related Art
How to increase the portability of electronic communication devices is an important trend for the industry of wireless communication, and is also essential to increase product competiveness. The size and weight of electronic communication devices must be reduced in order to increase the portability of electronic communication devices. An electronic communication device s normally has a substrate and the chip is assembled on the substrate by a packaging technology. Thus, the size of the chip package structure directly affects the size of the whole of an electronic product.
Currently, the power amplifier chip 13 usually applys a III/V semiconductor chip such as gallium arsenide (GaAs) chip for providing a high frequency signal. Because the power amplifier chip 13 is usually used in a strict high frequency environment, the flip-chip technology or wireless chip level (WLCSP) package is unsuitable for assembling the chip 13 on the substrate 11. In general, the power amplifier chip is adhered to the substrate 11, and wires are used for electrically connecting the power amplifier chip with the substrate 11. Then, the power amplifier chip is buried in a packaging material. Further, the wires must be buried in a packaging material for avoiding the exposed wires causing an antenna to excite energy.
Thus, the invention provides a chip module and a fabricating method thereof capable of appropriately packaging the power amplifier chip 120 in the chip module and avoiding unnecessary increase in the size of the package structure.
SUMMARY OF THE INVENTIONThe invention is directed to a chip module and a fabricating method thereof. A power amplifier is packaged in the chip module, such that the wires can do without insulation and the size of the package structure will not increase due to the insulation.
According to a first aspect of the present invention, a chip module is provided. The chip module comprises a substrate, a chip, a plurality of passive units, a first glue structure and a second glue structure. The chip is assembled on the substrate and electrically connected with the substrate. A plurality of passive units is assembled on the substrate in the style of encircling the chip. The first glue structure is filled between the passive units so that an encircled area is defined by the first glue structure and the passive units. The second glue structure is filled within the encircled area so that the chip is covered by the second glue structure.
According to a second aspect of the present invention, a method of fabricating chip module is provided. The method comprises the following steps. (a) A substrate is provided. (b) A chip is assembled on the substrate and electrically connected with the substrate. (c) A plurality of passive units is assembled on the substrate in the style of encircling the chip. (d) A first glue structure is filled between the passive units so that an enencircled area is defined by the first glue structure and the passive units. (e) A second glue structure is filled within the encircled area so that the chip is covered by the second glue structure.
The invention will become apparent from the following detailed description of the preferred but non-limiting embodiments. The following description is made with reference to the accompanying drawings.
Next, as indicated in
Afterward, as indicated in
The first glue structure 250 and the second glue structure 260 can be made from different materials, respectively. In a preferred embodiment, the first glue structure 250 is filled between the passive units 240 for defining the encircled area R. For the convenience in the manufacturing process, the first glue structure 250 is preferably made from an easy-forming material with high adhesiveness. On the other side, For making sure that the second glue structure 260 can effectively bury the wires 230, the second glue structure 260 is preferably made from a material with high fluidity. Thus, viscosity of the first glue structure 250 preferably is higher than viscosity of the second glue structure 260.
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The formation of an encircled area is not compulsory in the invention. As indicated in
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While the invention has been described by way of example and in terms of a preferred embodiment, it is to be understood that the invention is not limited thereto. On the contrary, it is intended for covering various modifications and similar arrangements and procedures, and the scope of the appended claims therefore should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements and procedures.
Claims
1. A chip module, comprising:
- a substrate;
- a chip assembled on the substrate and electrically connected with the substrate;
- a plurality of passive units assembled on the substrate in the style of encircling the chip
- a first glue structure filled between the passive units so that an encircled area is defined by the first glue structure and the passive units; and
- a second glue structure filled within the encircled area so that the chip is covered by the second glue structure.
2. The chip module according to claim 1, wherein an adhesive layer disposed between the chip and the substrate.
3. The chip module according to claim 1, further comprising a plurality of wires is electrically connected with the chip and the substrate.
4. The chip module according to claim 3, wherein the wires are buried in the second glue structure.
5. The chip module according to claim 1, wherein the chip is a power amplifier chip.
6. The chip module according to claim 1, wherein the passive units are buried in the first glue structure.
7. The chip module according to claim 1, wherein the constituent of the first glue structure is different from that of the second glue structure.
8. The chip module according to claim 1, wherein viscosity of the first glue structure is higher than viscosity of the second glue structure.
9. A fabricating method of chip module, the method comprising:
- providing a substrate;
- assembling a chip on the substrate and electrically connecting the chip with the substrate;
- assembling a plurality of passive units on the substrate in the style of encircling the chip;
- filling a first glue structure between the passive units so that an encircled area is defined by the first glue structure and the passive units; and
- filling the encircled area with a second glue structure so that the chip is covered by the second glue structure.
10. The fabricating method according to claim 9, wherein the passive units are assembled on the substrate by surface mount technology (SMT).
11. The fabricating method according to claim 9, wherein before the step of assembling the chip on the substrate, the method further comprises:
- disposing an adhesive layer on the substrate, the chip is adhered to the substrate via the adhesive layer.
12. The fabricating method according to claim 9, further comprises:
- disposing a plurality of wires so that the wires electrically connect the chip with the substrate.
13. The fabricating method according to claim 12, wherein the wires are buried in the second glue structure.
14. The fabricating method according to claim 9, wherein the chip is a power amplifier chip.
15. The fabricating method according to claim 9, wherein during the step of filling the first glue structure between the passive units, the passive units are buried in the first glue structure.
16. The fabricating method according to claim 9, wherein the constituent of the first glue structure is different from that of the second glue structure.
17. The fabricating method according to claim 16, wherein viscosity of the first glue structure is higher than viscosity of the second glue structure.
Type: Application
Filed: Sep 5, 2008
Publication Date: Mar 12, 2009
Applicant: Advanced Semiconductor Engineering, Inc. (Kaohsiung)
Inventor: Jian-Cheng Chen (Tainan County)
Application Number: 12/230,829
International Classification: H01L 23/16 (20060101); H01L 21/58 (20060101);