Abstract: According to some embodiments of the present invention, a display device includes: a display panel; and an integrated circuit (IC) assembly coupled to the display panel, the IC assembly comprising: a flexible substrate; a first flexible thermally conductive layer on the flexible substrate; and an IC chip on the flexible substrate and thermally coupled to the first flexible thermally conductive layer.

Abstract: A method is described for making electronic modules includes molding onto a substrate panel a matrix panel defining a plurality of cavities, attaching semiconductor die to the substrate panel in respective cavities of the molded matrix panel, electrically connecting the semiconductor die to the substrate panel, affixing a cover to the molded matrix panel to form an electronic module assembly, mounting the electronic module assembly on a carrier tape, and separating the electronic module assembly into individual electronic modules. An electronic module is described which includes a substrate, a wall member molded onto the substrate, the molded wall member defining a cavity, at least one semiconductor die attached to the substrate in the cavity and electrically connected to the substrate, and a cover affixed to the molded wall member over the cavity.

Abstract: A method for tracking an interposer die of a stacked silicon interconnect technology (SSIT) product includes forming a plurality of dummy components on the interposer die, and modifying one or more of the plurality of dummy components on the interposer die to form a unique identifier for the interposer die. An apparatus for a stacked silicon interconnect technology (SSIT) product includes an interposer die, and a plurality of dummy components at the interposer die. One or more of the plurality of dummy components is modifiable to form a unique identifier for the interposer die.

Abstract: A semiconductor package includes a lead spaced apart from a semiconductor die. The die includes a diaphragm disposed at a first side of the die and is configured to change an electrical parameter responsive to a pressure difference across the diaphragm. The die further includes a second side opposite the first side, a lateral edge extending between the first and second sides and a terminal at the first side. An electrical conductor connects the terminal to the lead. An encapsulant is disposed along the lateral edge of the die so that the terminal and the electrical conductor are spaced apart from the encapsulant. The encapsulant has an elastic modulus of less 10 MPa at room temperature. A molding compound covers and contacts the lead, the electrical conductor, the encapsulant, the terminal and part of the first side of the die so that the diaphragm is uncovered by the molding compound.

Abstract: An embodiment of the disclosed technology provides a method for preventing electrostatic breakdown during the manufacturing process of the array substrate. The method comprises: when forming a conductive pattern of a substrate, connecting conductive lines for forming the conductive pattern with a closed conductive ring on a same layer as the conductive lines in a peripheral region of the substrate, and wherein when electrostatic charges are generated over the metal line, the electrostatic charges are led to the closed conductive ring.

Abstract: A multi-chip package may include a package substrate, a first semiconductor chip, a second semiconductor chip and a supporting member. The first semiconductor chip may be arranged on an upper surface of the package substrate. The first semiconductor chip may be electrically connected with the package substrate. The second semiconductor chip may be arranged on an upper surface of the first semiconductor chip. The second semiconductor chip may be electrically connected with the first semiconductor chip. The second semiconductor chip may have a protrusion overhanging an area beyond a side surface of the first semiconductor chip. The supporting member may be interposed between the protrusion of the second semiconductor chip and the package substrate to prevent a deflection of the protrusion.

Abstract: A semiconductor device includes a lower structure, an insulation layer, metal contacts, a bridge and a metal pad. The lower structure has a metal wiring. An insulation layer is formed on the lower structure. The metal contacts penetrate the insulation layer to be connected to the metal wiring. The bridge is provided in the insulation layer, the bridge connecting the metal contacts to one another. The metal pad is provided on the insulation layer, the metal pad making contact with the metal contacts.

Abstract: The present invention relates to a film for flip chip type semiconductor back surface, which is to be disposed on the back surface of a semiconductor element to be flip chip-connected onto an adherend, the film containing a resin and a thermoconductive filler, in which the content of the thermoconductive filler is at least 50% by volume of the film, and the thermoconductive filler has an average particle size relative to the thickness of the film of at most 30% and has a maximum particle size relative to the thickness of the film of at most 80%.

Abstract: A method of producing a resin-sealed package is provided with: providing an electronic component which has a plurality of terminals on one face, a first support member and a second support member; temporarily fixing said electronic component to a surface of said first support member by a first adhesive agent layer, to face said terminals with said first support member; fixing said second support member having a second adhesive agent layer to said electronic component while interposing said electronic component between said first support member and said second support member to face said second adhesive agent layer with a back face side of said electronic component; resin sealing said electronic component between said first support member and said second support member; peeling said first support member and said first adhesive agent layer from said electronic component and a sealing resin; and stacking an insulating resin layer and a wiring layer which is electrically connected to said terminals of said electr

Abstract: A method of manufacture of an integrated circuit packaging system includes: providing a substrate; attaching a flip chip to the substrate; attaching a heat slug to the substrate and the flip chip; and forming a moldable underfill having a top underfill surface on the substrate, the flip chip, and the heat slug, the moldable underfill having a characteristic of being liquid at room temperature and the top underfill surface over the flip chip.

Abstract: An object of the present invention is to provide a photoelectric conversion device, wherein improvement of charge transfer properties when charge is output from a charge storage region and suppression of dark current generation during charge storage are compatible with each other. This object is achieved by forming a depletion voltage of a charge storage region in the range from zero to one half of a power source voltage (V), forming a gate voltage of a transfer MOS transistor during a charge transfer period in the range from one half of the power source voltage to the power source voltage (V) and forming a gate voltage of the transfer MOS transistor during a charge storage period in the range from minus one half of the power source voltage to zero (V).

Abstract: Embodiments of a microelectronic package are generally described herein. A microelectronic package may include a die having a first side and a second side, opposite the first side, a flange coupled to the first side of the die, and a lead frame proximately positioned relative to the die and coupled to the second side of the die. Other embodiments may be described and claimed.

Abstract: A semiconductor package, containing two or more stacked IC devices attached to a substrate. Each of the IC devices has a plurality of electrical contact regions which are connected to the substrate by means of electrical connections.

Abstract: A hermetically sealed integrated circuit package that includes a cavity housing a semiconductor die, whereby the cavity is pressurized during assembly and when formed. The invention prevents the stress on a package created when the package is subject to high temperatures at atmospheric pressure and then cooled from reducing the performance of the die at high voltages. By packaging a die at a high pressure, such as up to 50 PSIG, in an atmosphere with an inert gas, and providing a large pressure in the completed package, the dies are significantly less likely to arc at higher voltages, allowing the realization of single die packages operable up to at least 1200 volts. Moreover, the present invention is configured to employ brazed elements compatible with Silicon Carbide dies which can be processed at higher temperatures.

Abstract: A hermetically sealed integrated circuit package that includes a cavity housing a semiconductor die, whereby the cavity is pressurized during assembly and when formed. The invention prevents the stress on a package created when the package is subject to high temperatures at atmospheric pressure and then cooled from reducing the performance of the die at high voltages. By packaging a die at a high pressure, such as up to 50 PSIG, in an atmosphere with an inert gas, and providing a large pressure in the completed package, the dies are significantly less likely to arc at higher voltages, allowing the realization of single die packages operable up to at least 1200 volts. Moreover, the present invention is configured to employ brazed elements compatible with Silicon Carbide dies which can be processed at higher temperatures.

Abstract: A surface preparation method for improved adhesion in an electronic package system. The method of improving adhesion in the electronic package system includes depositing a passivation layer on a bonding surface and roughening at least a portion of the passivation layer. A coating material is deposited on the passivation layer. The bonding surface can be part of a semiconductor or package substrate. The roughening process can be performed by a chemical or mechanical process. In another embodiment, an electronic package system includes a bonding surface of a semiconductor or package substrate. A passivation layer is deposited on the bonding surface and a portion of the passivation layer is roughened for improved adhesion. A coating material is deposited on the roughened portion of the passivation layer.

Abstract: A semiconductor device mounting structure includes a semiconductor device whose electrodes are aligned on its one main face; a circuit board having board electrodes electrically connected to the electrodes of the semiconductor device by solder bumps; and curable resin applied between at least the side face of the semiconductor device and the circuit board. Multiple types of thermally expandable particles with different expansion temperatures are mixed in this curable resin. This structure offers the semiconductor device mounting structure that is highly resistant to impact and suited for mass production, its manufacturing method, and a removal method of the semiconductor device. In addition, this structure facilitates repair and reworking, leaving almost no adhesive residue on the circuit board after repair. Stress applied to the circuit board during repair can also be minimized.

Abstract: An integrated circuit and corresponding method of manufacture. The integrated circuit has a die comprising: an outer strengthening ring around a periphery of the die, the outer ring having one or more gaps; and an inner strengthening ring within the outer ring and around interior circuitry of the die, the inner ring having one or more gaps offset from the gaps of the outer ring. One or more conducting members are electrically isolated from said rings and electrically connected to the interior circuitry, each member passing through a gap of the inner ring and through a gap of the outer ring.

Abstract: There are provided a semiconductor package comprising: a semiconductor substrate including an integrated circuit unit, and a crack-propagation preventing unit at least partially formed around a peripheral of the integrated circuit unit of the semiconductor substrate and filled with a heterogeneous material different from a material of the semiconductor substrate, and a method of fabricating the semiconductor package, comprising: at least partially forming a trench around the peripheral of the integrated circuit unit of the semiconductor substrate, and filling the trench with a heterogeneous material different from that of the semiconductor substrate. In accordance with the present invention, the structural and mechanical strength and durability of the semiconductor package, specifically, the wafer level semiconductor package, are improved and the reliability of the product is significantly improved.

Abstract: The present invention relates to a semiconductor device including a semiconductor chip encapsulated by an encapsulation resin and a manufacturing method thereof, and an object of the invention is to provide the semiconductor chip and its manufacturing method in which the reduction in size may be attempted. It includes a semiconductor chip 15, an external connection terminal pad 18 electrically connected to the semiconductor chip 15, and an encapsulation resin 16 encapsulating the semiconductor chip 15, wherein a wiring pattern 12 on which the external connection terminal pad 18 is formed is provided between the semiconductor chip 15 and the external connection terminal pad 18, and the semiconductor chip 15 is flip-chip bonded to the wiring pattern 12.

Abstract: A high reliability power module which includes a plurality of hermetically sealed packages each having electrical terminals formed from an alloy of tungsten copper and brazed onto a surface of a ceramic substrate.

Abstract: A semiconductor package including a substrate, a die attached to the substrate and a heat spreader. The heat spreader has a heat dissipating portion with an upper surface, a lower surface and a perimeter. The lower surface overlies and is spaced apart from the die to provide a clearance therebetween. Supports are spaced about the perimeter of the heat dissipating portion and depend downwardly therefrom. Each support is located on the substrate to establish an opening between adjacent supports.

Abstract: A stack of semiconductor dies is disclosed. A first stack level includes a first semiconductor die and at least one first support that are attached to a substrate surface. A second level includes a second semiconductor die and at least one second support that are attached to the active surface of the first semiconductor die and to a coplanar surface of the first support(s). A third level includes a third semiconductor die attached to the active surface of the second semiconductor die and to a coplanar surface of the second support(s). The second and third semiconductor dies do not overlap bond pads of the first and second semiconductor dies, respectively. An adhesive film overlies the entire inactive surface of the second and third semiconductor dies, and attaches the second and third semiconductor dies to the immediately underlying active surface and support(s).

Abstract: A method of manufacture of an integrated circuit package stacking system including: forming a base frame includes: providing a support panel, and forming a coupling pad, a mounting pad, a base frame trace, a discrete component pad, or a combination thereof on the support panel; fabricating a package substrate; coupling an integrated circuit die to the package substrate; mounting the base frame over the integrated circuit die and the package substrate; and removing the support panel from the base frame.

Abstract: A semiconductor device with plastic housing composition includes an internal wiring that is electrically insulated from the plastic housing composition by an insulation layer. The plastic housing composition has a high thermal conductivity and a low coefficient of expansion, the coefficient of expansion being adapted to the semiconductor chip of the semiconductor device. This is achieved by forming the plastic housing composition with electrically semiconducting and/or electrically conducting filler particles. In particular, this plastic housing composition is advantageously used for semiconductor devices with flip-chip contacts and/or for semiconductor devices which are constructed according to the “universal packaging concept”.

Abstract: A semiconductor package (20) includes an organic substrate (24) and a semiconductor die subassembly (22). A method (50) for making the semiconductor package (20) entails providing (52) the organic substrate (24) having an opening (26) and electrical contacts (36). The subassembly (22) is formed by producing (64) a semiconductor die (28) and bonding it to a platform layer (30). An elastomeric adhesive (38) is utilized (92) to secure the subassembly (22) in the opening (26). Electrical interconnects (32) are provided (106) between the semiconductor die (28) and the electrical contacts (36) of the organic substrate (24). The organic substrate (24), semiconductor die (28), elastomeric adhesive (38), and electrical interconnects (32) are encapsulated (114) in a packaging material (46). The elastomeric adhesive (38) provides mechanical anchoring of the subassembly (22) to the substrate (24) and provides mechanical stress isolation of the semiconductor die (28) within the semiconductor package (20).

Abstract: The invention relates to a liquid resin composition for underfill comprising (A) an epoxy resin, (B) an amine-based curing agent, and (C) an inorganic filler, a viscosity at a temperature of 25° C. being 1 to 150 Pa·s, and a time required for the viscosity to become 1 Pa·s at a temperature of 100° C. being 40 to 180 minutes.

Abstract: A semiconductor device includes: a semiconductor chip mounted on a mounting substrate; a first resin filling a gap between the chip and the substrate; a frame-shaped stiffener surrounding the chip; a first adhesive for bonding the stiffener to the substrate; a lid for covering the stiffener and an area surrounded by the stiffener; and a second resin filling a space between the stiffener and the chip. A thermal expansion coefficient of the second resin is smaller than that of the first resin. The first resin includes an underfill part filling a gap between the chip and the substrate and a fillet part extended from the chip region.

Abstract: A method of manufacturing an integrated circuit (IC) device is disclosed. A wafer including multiple dies is processed to form solder bumps at the bond pad locations. A conductive substrate is patterned for routing traces and connection pads and partially etched. Routers are formed to electrically route a connection pad to the interior of its corresponding routing terminals. The etched connection pads corresponds to the plurality of bond pad locations of the IC chip. The bumped IC chip is aligned and attached to the conductive substrate through the connection pads and solder bumps. The attached IC chip and the first side of the conductive substrate are then encapsulated. Un-processed conductive material is then removed from a second side of the substrate, opposite the first side, to expose the routers and routing terminals.

Abstract: Embodiments of the invention provide a method for fabricating a system in package. In one embodiment, the method comprises preparing a printed circuit board (PCB) strip comprising a plurality of individual PCBs, stacking a plurality of first semiconductor chips and forming an encapsulant on a first surface of a first individual PCB of the plurality of individual PCBs to form a first semiconductor chip stack structure comprising a first semiconductor chip stack, and performing a first test adapted to test one of the first semiconductor chips in the first semiconductor chip stack. The method further comprises flip chip bonding a second semiconductor chip to a second surface of the first individual PCB if the first semiconductor chip stack structure meets a test standard based on a result of the first test, and dividing the first semiconductor chip stack structure to form a system in package.

Abstract: A method for fabricating a plurality of wafer level chip scale packages is revealed. A bumped wafer is laminated with a mold plate with a protection film placed thereon to partially embed the bumps of the wafer into the protection film and to form an underfill gap between the wafer and the protection film. By a first sawing step, the wafer fixed by the protection film is singulated into a plurality of chips having sides between the active surface and the back surface and also a filling gap is formed between the sides. Then, an encapsulant is formed on the protection film where the encapsulant fills the underfill gap through the filling gap to completely encapsulate the chips and the non-embedded portions of the bumps. By separating the encapsulant from the protection film and a second sawing step, the mold plate and the protection film are removed, and the encapsulant is singulated into a plurality of individual wafer level chip scale packages.

Abstract: A semiconductor device includes: a mounted body in which a wiring pattern is formed on a first main surface; a semiconductor chip mounted on the surface of the mounted body on which the wiring pattern is formed; an underfill material which is filled between the mounted body and the semiconductor chip and forms a fillet on an outer peripheral part of the semiconductor chip; and an injection section which is disposed on the mounted body and on an outside of a side section, on which the fillet is formed to be longest, of four side sections defining a chip mount area on which the semiconductor chip is mounted, and guides the underfill material to between the mounted body and the semiconductor chip.

Abstract: The present disclosure provides a very thin semiconductor package including a leadframe with a die-attach pad and a plurality of lead terminals, a die attached to the die-attach pad and electrically connected to the lead terminals via bonding wires, a position member disposed upon the die and/or die-attach pad, and a molding material encapsulating the leadframe, the die, and the position member together to form the semiconductor package. The method for manufacturing a very thin semiconductor package includes disposing a first position member on one side of the die-attach pad of a leadframe, attaching a die onto the opposite side of the die-attach pad, optionally disposing a second position member on top of the die, electrically connecting the die to the lead terminals of the leadframe, and encapsulating the leadframe, the die, and the position member(s) together to form the very thin semiconductor package.

Abstract: A power semiconductor module comprising a substrate, a circuit formed thereon and having a plurality of conductor tracks that are electrically insulated from one another and power semiconductor components arranged on the conductor tracks. The latter are connected in a circuit-conforming manner by a connection device, which has an alternating layer sequence of at least two electrically conductive layers with at least one electrically insulating layer between them. In this case, the substrate has a first sealing area, which uninterruptedly encloses the circuit. Furthermore, this sealing area is connected to an assigned second sealing area on a layer of the connection device by a connection layer. According to the invention, this power semiconductor module is produced by applying pressure to the substrate, to the power semiconductor components and to the connection device.

Abstract: The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a microelectronic component assembly includes a microelectronic component, a substrate, and at least one bond wire. The substrate has a reduced-thickness base adjacent terminals of the microelectronic component and a body having a contact surface spaced farther from the microelectronic component than a bond pad surface of the base. The bond wire couples the microelectronic component to a bond pad carried by the bond pad surface and has a maximum height outwardly from the microelectronic component that is no greater than the height of the contact surface from the microelectronic component.

Abstract: An apparatus includes a first substrate having a set of semiconductor devices formed within it. The apparatus also includes a second substrate. A third substrate has a data conductor coupled between first and second connections to the second substrate. The data conductor is coupled to the set of semiconductor devices at respective connection points.

Abstract: In accordance with one or more embodiments, a flange package comprises a flange and an interposer having two or more fingers disposed in an interposer trench. The flange has a mold lock formed about a periphery of the interposer trench. A dielectric ring comprising a dielectric material is formed in the interposer trench, and in and around the periphery of the mold lock. A semiconductor die is disposed within the dielectric ring having gate pads and source pads formed on a first side, and having drain pads disposed on a second side of the die. The gate pads are coupled to the interposer and the source pads are coupled to the flange. A gate lead is coupled to the interposer and a drain lead is coupled to the drain pads. Other embodiments are disclosed.

Abstract: A semiconductor device package includes a semiconductor chip having a top surface on which a conductive pad is disposed, a bottom surface opposite to the top surface, and a side surface connecting the top and bottom surfaces to each other; a first insulating layer covering the top surface of the semiconductor chip and laterally extending to the outside of the semiconductor chip; a fillet member covering a boundary where the side surface of the semiconductor chip and the first insulating layer meet each other; and a molding layer covering the bottom surface of the semiconductor chip, the fillet member, and the first insulating layer.

Abstract: A method of packaging a semiconductor includes providing a support structure. An adhesive layer is formed overlying the support structure and is in contact with the support structure. A plurality of semiconductor die is placed on the adhesive layer. The semiconductor die are laterally separated from each other and have electrical contacts that are in contact with the adhesive layer. A layer of encapsulating material is formed overlying and between the plurality of semiconductor die and has a distribution of filler material. A concentration of the filler material is increased in all areas laterally adjacent each of the plurality of semiconductor die.

Abstract: Provided is a semiconductor device including a semiconductor chip, a film (first film) which is provided so as to cover an active region with a peripheral portion of the semiconductor chip being uncovered, and is made of a dielectric material having a low dielectric constant, and a package molding resin (sealing resin) provided so as to cover the semiconductor chip and the film. As a result, deterioration in contact property with the sealing resin is suppressed and a high frequency characteristic can be enhanced.

Abstract: A semiconductor package (20) includes an organic substrate (24) and a semiconductor die subassembly (22). A method (50) for making the semiconductor package (20) entails providing (52) the organic substrate (24) having an opening (26) and electrical contacts (36). The subassembly (22) is formed by producing (64) a semiconductor die (28) and bonding it to a platform layer (30). An elastomeric adhesive (38) is utilized (92) to secure the subassembly (22) in the opening (26). Electrical interconnects (32) are provided (106) between the semiconductor die (28) and the electrical contacts (36) of the organic substrate (24). The organic substrate (24), semiconductor die (28), elastomeric adhesive (38), and electrical interconnects (32) are encapsulated (114) in a packaging material (46). The elastomeric adhesive (38) provides mechanical anchoring of the subassembly (22) to the substrate (24) and provides mechanical stress isolation of the semiconductor die (28) within the semiconductor package (20).

Abstract: A semiconductor device including a semiconductor chip having a plurality of electrodes on one surface thereof in a thickness direction, a resin layer overlapping the one chip surface to provide a rectangular mounting surface, a plurality of metal posts in the resin layer, where the metal posts are electrically connected to the electrodes, and solder terminals respectively connected to the metal posts. The resin layer has a groove formed therein at the mounting surface so as to surround an area on which the metal posts are provided. The semiconductor device is mounted on the mounting substrate with an underfill material filled in a space between the mounting surface and the mounting substrate.

Abstract: A semiconductor device is disclosed. One embodiment provides an arrangement of a plurality of semiconductor chips arranged side by side in a spaced apart relationship. A first material fills at least partly the spacings between adjacent semiconductor chips. A second material is arranged over the semiconductor chips and the first material. A coefficient of thermal expansion of the first material is selected to adapt the lateral thermal expansion of the arrangement in a plane intersecting the first material and the semiconductor chips to the lateral thermal expansion of the arrangement in a plane intersecting the second material.

Abstract: A process of fabricating wafer-level underfilled microelectronic packages using over-bump application of a self-fluxing resin to a wafer, b-staging of the resin, dicing of the coated wafer, and joining the diced chips to substrates producing wafer-level underfilled microelectronic flip-chip packages. Moreover, provided are microelectronic packages, which are produced in accordance with the inventive process.

Abstract: Embodiments of the invention provide a method for fabricating a system in package. In one embodiment, the method comprises preparing a printed circuit board (PCB) strip comprising a plurality of individual PCBs, stacking a plurality of first semiconductor chips and forming an encapsulant on a first surface of a first individual PCB of the plurality of individual PCBs to form a first semiconductor chip stack structure comprising a first semiconductor chip stack, and performing a first test adapted to test one of the first semiconductor chips in the first semiconductor chip stack. The method further comprises flip chip bonding a second semiconductor chip to a second surface of the first individual PCB if the first semiconductor chip stack structure meets a test standard based on a result of the first test, and dividing the first semiconductor chip stack structure to form a system in package.

Abstract: A semiconductor device includes a substrate, a semiconductor chip, a conductive member and an external electrode. A penetrating hole is formed in the substrate, the penetrating hole having an internal wall surface, the internal wall surface having a protrusion formed of a material constituting the substrate. The semiconductor chip has an electrode. The conductive member is formed over a particular region including the penetrating hole on one side of the substrate, and is electrically connected to the electrode of the semiconductor chip. The external electrode is provided through the penetrating hole, electrically connected to the conductive member, and projects from the other side of the substrate.

Abstract: A chip module and a fabricating method thereof are provided. Firstly, a substrate is provided. Next, a chip is assembled on the substrate and electrically connected with the substrate. Afterward, a plurality of passive units is assembled on the substrate in the style of encircling the chip. Then, a first glue structure is filled between the passive units so that an encircled area is defined by the first glue structure and the passive units. Then, a second glue structure is filled in the encircled area so that the chip is covered by the second glue structure.

Abstract: There is provided a semiconductor package including: a substrate having a plurality of electrode pads on a surface thereof; a semiconductor chip mounted on the substrate, the semiconductor chip electrically connecting with the plurality of electrode pads; and a stiffener arranged on the substrate so as to surround the semiconductor chip. The stiffener includes: an insulating material layer; and a rigid plate mounted substantially parallel to a surface of the substrate in the insulating material layer, the rigid plate having formed therein a plurality of through holes, at least a part of the through holes being filled with the insulating material.

Abstract: An assembly for producing partially packaged semiconductor devices is provided. In one embodiment, the assembly includes a magnetic plate; a flexible substrate disposed adjacent the magnetic plate and having two surfaces; a nonstick coating disposed on one surface of the flexible substrate thereby exposing a nonstick surface; and a tape layer having two surfaces. The tape layer is adhesively attached to the nonstick surface to expose a surface of the tape layer. A frame is disposed on the exposed surface of the tape layer, and a plurality of integrated circuit (IC) die is positioned within the frame and supported by the tape layer. A panel is formed within the frame that at least partially surrounds the plurality of IC die and that contacts the tape layer.

Abstract: A semiconductor device includes at least one semiconductor structure having a plurality of external connection portions on an upper surface, and an insulating member which is made of a resin containing reinforcing materials and arranged on a side of the semiconductor structure. An insulating film is formed on the upper surface of the semiconductor structure, except the external connection portions, and on an upper surface of the insulating member. A plurality of upper wirings each of which has a connection pad portion are located on an upper side of the insulating film and electrically connected to a corresponding one of the external connection portions of the semiconductor structure. The connection pad portion of at least one of the upper wirings is arranged above an upper surface of the insulating member.