TRENCH CAPACITOR PROFILE TO DECREASE SUBSTRATE WARPAGE

Abstract

Various embodiments of the present disclosure are directed towards an integrated circuit (IC) including a pillar structure abutting a trench capacitor. A substrate has sidewalls that define a trench. The trench extends into a front-side surface of the substrate. The trench capacitor includes a plurality of capacitor electrode layers and a plurality of capacitor dielectric layers that respectively line the trench and define a cavity within the substrate. The pillar structure is disposed within the substrate. The pillar structure has a first width and a second width less than the first width. The first width is aligned with the front-side surface of the substrate and the second width is aligned with a first point disposed beneath the front-side surface.

Description

FIG. 1 illustrates a cross-sectional view of some embodiments of an integrated circuit (IC) including a trench capacitor disposed within a trench and laterally adjacent to a cavity within the trench.

FIGS. 7-14 illustrate cross-sectional views of some embodiments of a method of forming an integrated chip (IC) having a trench capacitor disposed within a trench and laterally adjacent to a cavity within the trench.

FIG. 15 illustrates a flowchart of some embodiments of a method for forming an IC having a trench capacitor disposed within a trench and laterally adjacent to a cavity within the trench.

In some embodiments, the pillar structure 101 has a first width w1 that is aligned with the front-side surface 102f of the semiconductor substrate 102, and further has a second width w2 that is disposed vertically at a first point beneath the front-side surface 102f. The first width w1 is greater than the second width w2. In further embodiments, a width of the pillar structure 101 continuously decreases from the front-side surface 102f of the semiconductor substrate 102 to the first point. This, in part, ensures that a cavity 103 will exist in each of the trenches 102t. For example, during fabrication of the trench capacitor 106, the capacitor electrode layers 110a-d and the capacitor dielectric layers 112a-d are deposited (e.g., by one or more ALD processes) such that they will conform to a shape of the pillar structure 101. Because the first width w1 of the pillar structure 101 is greater than the second width w2 of the pillar structure 101, the cavity 103 will be present in each trench 102t after depositing the capacitor electrode layers 110a-d and the capacitor dielectric layers 112a-d.

In some embodiments, the first width w1 of the pillar structure 101 is within a range of about 0.1 to 0.2 micrometers. In further embodiments, if the first width w1 is less than about 0.1 micrometers, then the pillar structure 101 is too thin such that it may collapse due to force applied by layers of the trench capacitor 106. In yet further embodiments, if the first width w1 is greater than about 0.2 micrometers, then a number of trenches 102t that may be formed within the semiconductor substrate 102 is reduced and/or an opening of each trench 102t is too small to facilitate proper deposition of layers of the trench capacitor 106 within the trenches 102t. In various embodiments, the second width w2 of the pillar structure 101 is within a range of about 0.07 to 0.17 micrometers. In further embodiments, if the second width w2 is less than about 0.07 micrometers, then the pillar structure 101 is too thin such that it may collapse due to force applied by layers of the trench capacitor 106. In yet further embodiments, if the second width w2 is greater than about 0.17 micrometers, then a size of the cavity 103 may be reduced. In such embodiments, reduction of the size of the cavity 103 increases a stress applied to the semiconductor substrate 102 as the capacitor electrode layers 110a-d and capacitor dielectric layers 112a-d expand, thereby resulting in warpage and/or cracking of the semiconductor substrate 102. In various embodiments, the first width w1 is greater than the second width w2. In further embodiments, a difference between the first width w1 and the second width w2 (e.g., w1-w2) is greater than about 30 nanometers. In some embodiments, if the difference between the first width w1 and the second width w2 is less than about 30 nanometers, then the size of the cavity 103 may be reduced, thereby resulting in warpage and/or cracking of the semiconductor substrate 102.

The IC 200 includes an interconnect structure 117 overlying a front-side surface 102f of a semiconductor substrate 102. In some embodiments, the semiconductor substrate 102 may, for example, be or comprise a bulk substrate (e.g., bulk silicon), a silicon-on-insulator (SOI) substrate, or another suitable substrate and/or may comprise a first doping type (e.g., p-type). A doped region 104 is disposed within the semiconductor substrate 102 and may comprise the first doping type with a higher doping concentration than the semiconductor substrate 102. The interconnect structure 117 includes an interconnect dielectric structure 122, a plurality of conductive vias 118, and a plurality of conductive wires 120. The interconnect dielectric structure 122 may, for example, include one or more inter-level dielectric (ILD) layers. The one or more ILD layers may, for example, respectively be or comprise an oxide, such as silicon dioxide, a low-k dielectric material, an extreme low-k dielectric material, any combination of the foregoing, or another suitable dielectric material. The plurality of conductive vias and wires 118, 120 are configured to electrically couple semiconductor devices disposed over and/or within the semiconductor substrate 102 to one another. In further embodiments, the conductive vias and wires 118, 120 may, for example, respectively be or comprise tungsten, copper, aluminum, titanium nitride, tantalum nitride, any combination of the foregoing, or the like.

The pillar structure 101 has a first width w1 that is horizontally aligned with the front-side surface 102f of the semiconductor substrate 102, and further has a second width w2 that is disposed at a first point 202 vertically offset from the front-side surface 102f. In some embodiments, the first width w1 is greater than the second width w2. Further, the width of the pillar structure 101 may continuously decrease from the front-side surface 102f of the semiconductor substrate 102 to the first point 202. In further embodiments, a first height h1 of the pillar structure 101 is defined from the front-side surface 102f of the semiconductor substrate 102 to the first point 202. In yet further embodiments, the first height h1 is, for example, greater than 0.05 micrometers or within a range of about 0.05 to 4 micrometers. In further embodiments, if, for example, the first height h1 is less than 0.05 micrometers, then a size of the cavity 103 may be reduced which may increase an amount of stress induced on the semiconductor substrate 102. In yet further embodiments, the width of the pillar structure 101 continuously decreases across the first height h1 in a direction away from the front-side surface 102f of the semiconductor substrate 102. In some embodiments, the first width w1 of the pillar structure 101 is within a range of about 0.1 to 0.2 micrometers. In various embodiments, the second width w2 of the pillar structure 101 is within a range of about 0.07 to 0.17 micrometers. In some embodiments, a first length L1 of the trench 102t is within a range of about 0.3 to 0.4 micrometers. The first length L1 is aligned with the front-side surface 102f of the semiconductor substrate 102 and may define an opening of the trench 102t. In some embodiments, if the first length L1 is less than about 0.3 micrometers, then an opening of the trench 102t is too small such that layers of the trench capacitor 106 may not properly be deposited within the trench 102t. In further embodiments, if the first length L1 is greater than about 0.4 micrometers, then a number of trenches 102t that may be formed within the semiconductor substrate 102 is reduced and/or the first width w1 is reduced such that the pillar structure 101 is too thin and may collapse due to force applied by layers of the trench capacitor 106. In some embodiments, a trench pitch of the trench 102t is equal to the sum of the first width w1 of the pillar structure 101 and the first length L1 of the trench 102t (e.g., w1+L1). In some embodiments, the trench pitch is within a range of about 0.4 to 0.6 micrometers. In further embodiments, if the trench pitch is less than about 0.4 micrometers, then the opening of the trench 102t may be too small such that the layers of the trench capacitor may not properly fill the trench 102t. In yet further embodiments, if the trench pitch is greater than about 0.6 micrometers, then a capacitance density of the trench capacitor 106 may be reduced.

A second height h2 of the pillar structure 101 is defined from the front-side surface 102f of the semiconductor substrate 102 to a second point 204. The second point 204 is disposed vertically beneath the first point 202 in a direction away from the front-side surface 102f. In some embodiments, the second height h2 is, for example, about 6 micrometers, or within a range of about 0.595 to 7.65 micrometers. In some embodiments, a width of the pillar structure 101 continuously increases from the first point 202 to the second point 204. A third height h3 of the pillar structure 101 is defined from the front-side surface 102f of the semiconductor substrate 102 to a third point 206. The third point 206 may be aligned with a lower surface 102ls of the semiconductor substrate 102. In some embodiments, the lower surface 102ls of the semiconductor substrate 102 defines a bottom surface of the trench 102t and/or is aligned with a bottom surface of the trench segments 106ts. In some embodiments, the third height h3 may be about 7 micrometers, about 8.5 micrometers, or within a range of about 6.5 to 8.5 micrometers. A second length L2 of the trench 102t is aligned with the second point 204. In some embodiments, the second length L2 is within a range of about 0.21 to 0.36 micrometers. In further embodiments, the second length L2 is within a range of about 70 to 90 percent of the first length L1 (e.g., within a range of about 0.7*L1 to 0.9*L1). A third length L3 of the trench 102t is aligned with the third point 206 and/or is aligned with the lower surface 102ls of the semiconductor substrate 102. In some embodiments, the third length L3 is within a range of about 0.3 to 0.4 micrometers or within a range of about 0.24 to 0.4 micrometers. In further embodiments, the third length L3 is within a range of about 80 to 100 percent of the first length L1 (e.g., within a range of about 0.8*L1 to L1). Thus, in some embodiments, the third length L3 is substantially equal to the first length L1. In some embodiments, if the third length L3 is less than about 0.8*L1, then a size of the cavity 103 is reduced which may increase an amount of stress induced on the semiconductor substrate 102. In further embodiments, if the third length L3 is greater than the first length L1, then the layers of the trench capacitor 106 may not be properly disposed along a corner of the trench 102t. This, in part, may result in delamination between the capacitor dielectric layers 112a-d and/or the capacitor electrode layers 110a-d.

A third angle 902 is defined between a sidewall of the pillar structure 101 and a substantially horizontal line 904. In some embodiments, the substantially horizontal line 904 is horizontally aligned with the second point 204 and is parallel with the front-side surface 102f of the semiconductor substrate 102. In some embodiments, the third angle 902 is within a range of about 90 to 93 degrees. The third height h3 of the pillar structure 101 is defined from the front-side surface 102f of the semiconductor substrate 102 to the third point 206. The third point 206 may be aligned with the lower surface 102ls of the semiconductor substrate 102. In some embodiments, the third height h3 may be about 7 micrometers, about 8.5 micrometers, or within a range of about 6.5 to 8.5 micrometers. In yet further embodiments, after performing the one or more dry etches of FIG. 9, a removal process (e.g., a wet etch) may be performed to remove the sidewall protection layer 802. In further embodiments, the sidewall protection layer 802 may remain in place during the patterning process of FIG. 9, such that the sidewall protection layer 802 may prevent damage to sidewalls of the semiconductor substrate 102 that define an upper portion of the trench 102t and/or the pillar structure 101 (e.g., the region between the front-side surface 102f and the second point 204). This in turn may ensure the dimensions (e.g., w1, w2, L1, h1, h2, and/or L2) defined by the patterning process of FIG. 7 are not substantially changed during the patterning process of FIG. 9. In further embodiments, the patterning processes of FIGS. 7 and 9 are performed such that the trenches 102t respectively have a high aspect ratio (e.g., an aspect ratio greater than about 20:1).

As illustrated in cross-sectional view 1100 of FIG. 11, the capacitor electrode layers 110a-d and/or capacitor dielectric layers 112a-d are patterned, thereby defining a trench capacitor 106. In some embodiments, a process for patterning each capacitor electrode layer 110a-d and/or capacitor dielectric layer 112a-d includes: forming a masking layer (not shown) over the target capacitor electrode layer and/or capacitor dielectric layer; exposing unmasked regions of the target capacitor electrode layer and/or capacitor dielectric layer to one or more etchants, thereby reducing a width of the target layer(s); and performing a removal process (e.g., a wet etch process) to remove the masking layer. For example, a first patterning process according to a first masking layer (not shown) may be performed on a first capacitor electrode layer 110a, a second patterning process according to a second masking layer (not shown) may be performed on a second capacitor electrode layer 110b and a first capacitor dielectric layer 112a, and additional patterning processes may be performed for the remaining capacitor layers. Further, an etch stop layer 116 is formed over an upper surface of the trench capacitor 106. In some embodiments, the etch stop layer 116 may be deposited by CVD, PVD, ALD, or another suitable growth or deposition process. In some embodiments, the etch stop layer 116 may, for example, be or comprise silicon nitride, silicon carbide, or another suitable dielectric material.

FIG. 15 illustrates a method 1500 of forming an integrated circuit (IC) including a trench capacitor disposed within a trench and laterally adjacent to a cavity within the trench according to the present disclosure. Although the method 1500 is illustrated and/or described as a series of acts or events, it will be appreciated that the method is not limited to the illustrated ordering or acts. Thus, in some embodiments, the acts may be carried out in different orders than illustrated, and/or may be carried out concurrently. Further, in some embodiments, the illustrated acts or events may be subdivided into multiple acts or events, which may be carried out at separate times or concurrently with other acts or sub-acts. In some embodiments, some illustrated acts or events may be omitted, and other un-illustrated acts or events may be included.

Claims

1. An integrated circuit (IC) comprising:

a substrate comprising sidewalls that define a trench, wherein the trench extends into a front-side surface of the substrate;

a trench capacitor comprising a plurality of capacitor electrode layers and a plurality of capacitor dielectric layers that respectively line the trench and define a cavity within the substrate; and

a pillar structure disposed within the substrate and abutting the trench, wherein the pillar structure has a first width and a second width less than the first width, wherein the first width is aligned with the front-side surface of the substrate and the second width is aligned with a first point disposed beneath the front-side surface.

2. The IC of claim 1, wherein the width of the pillar structure continuously increases from the first point to a second point, wherein the second point is disposed beneath the first point.

3. The IC of claim 2, wherein the width of the pillar structure continuously decreases from the second point to a third point, wherein the third point is disposed beneath the second point, and wherein the third point is aligned with a lower surface of the substrate that defines a bottom of the trench.

4. (canceled)

5. (canceled)

6. The IC of claim 1, wherein the plurality of capacitor dielectric layers comprises an uppermost capacitor dielectric layer that continuously lines the trench and seals the cavity within the trench.

7. The IC of claim 1, further comprising:

an insulator layer that continuously extends from the front-side surface of the substrate to the sidewalls of the substrate that define the trench, wherein the insulator layer is disposed between the trench capacitor and the substrate, wherein a thickness of the insulator layer is greater than a thickness of the capacitor electrode layers and the capacitor dielectric layers, respectively.

8. The IC of claim 7, wherein the insulator layer continuously extends along sidewalls and an upper surface of the pillar structure.

9. The IC of claim 7, wherein the insulator layer comprises a first dielectric material and the capacitor dielectric layers comprise a second dielectric material different than the first dielectric material.

10. A semiconductor structure comprising:

a substrate;

a trench capacitor comprising a plurality of capacitor electrode layers and a plurality of capacitor dielectric layers overlying a front-side surface of the substrate, wherein the capacitor electrode layers and the capacitor dielectric layers define a first trench segment and a second trench segment protruding into the substrate and further define a first cavity and a second cavity recessed into the substrate respectively at the first and second trench segments; and

a pillar structure disposed laterally between the first trench segment and the second trench segment, wherein a width of the pillar structure continuously decreases in a first direction from the front-side surface towards a bottom surface of the first and second trench segments.

11. The semiconductor structure of claim 10, wherein the pillar structure comprises a first slanted sidewall segment, a second slanted sidewall segment, and a third slanted sidewall segment, wherein the second slanted sidewall segment is disposed vertically between the first and third slanted sidewall segments, wherein the first and third slanted sidewall segments are angled in a same direction that is opposite a direction of an angle of the second slanted sidewall segment.

12. The semiconductor structure of claim 10, wherein widths of the first and second cavities continuously increase in the first direction.

13. The semiconductor structure of claim 10, wherein the pillar structure continuously decreases in the first direction along a first vertical distance, wherein a first width of the pillar structure is greater than the first vertical distance, and wherein the first width is aligned with the front-side surface of the substrate.

14. The semiconductor structure of claim 10, further comprising:

an insulator layer disposed between the substrate and the first and second trench segments, wherein the insulator layer continuously extends along sidewalls and an upper surface of the pillar structure, wherein a thickness of the insulator layer continuously increases in the first direction.

15. The semiconductor structure of claim 14, wherein the insulator layer comprises silicon dioxide and the capacitor dielectric layers respectively comprise a high-k dielectric material.

16. The semiconductor structure of claim 14, wherein a first thickness of the insulator layer disposed along an upper surface of the pillar structure is less than a second thickness of the insulator layer disposed along a sidewall of the pillar structure.

17. (canceled)

18. A method for forming a trench capacitor, the method comprising:

performing a first patterning process on a front-side surface of a substrate to define an upper portion of a trench and an upper portion of a pillar structure, wherein the first patterning process is performed such that a width of the pillar structure decreases from the front-side surface to a first point below the front-side surface;

performing a second patterning process on the substrate to expand the trench and increase a height of the pillar structure; and

forming a plurality of capacitor dielectric layers and a plurality of capacitor electrode layers within the trench such that a cavity is defined between sidewalls of an uppermost capacitor dielectric layer, wherein the cavity is disposed within the trench, and wherein the uppermost capacitor dielectric layer seals the cavity.

19. The method of claim 18, further comprising:

forming a sidewall protection layer along sidewalls of the substrate that define the trench, wherein the sidewall protection layer is formed after the first patterning process and before the second patterning process.

20. The method of claim 18, wherein the second patterning process is performed such that the width of the pillar structure continuously decreases from a second point to a lower surface of the substrate, wherein the second point is disposed vertically beneath the first point and the lower surface of the substrate defines a bottom surface of the trench.

21. The IC of claim 6, wherein the uppermost capacitor dielectric layer comprises inner sidewalls that define the cavity.

22. The IC of claim 1, wherein a width of the cavity continuously decreases from the first point in a direction towards a bottom surface of the trench capacitor.

23. The semiconductor structure of claim 10, wherein the plurality of capacitor dielectric layers comprises an uppermost capacitor dielectric layer that abuts the first cavity and the second cavity, wherein the uppermost capacitor dielectric layer seals the first cavity and the second cavity.