Abstract: Some examples described herein provide for a heterogeneous integration module (HIM) that includes a thermal management apparatus. In an example, an apparatus (e.g., a HIM) includes a wiring substrate, a first component, a second component, and a thermal management apparatus. The first component and the second component are communicatively coupled together via the wiring substrate. The thermal management apparatus is in thermal communication with the first component and the second component. The thermal management apparatus has a first thermal energy flow path for dissipating thermal energy generated by the first component and has a second thermal energy flow path for dissipating thermal energy generated by the second component. The first thermal energy flow path has a lower thermal resistivity than the second thermal energy flow path.

Abstract: Disclosed is a pressure balancing clamp for a press-pack insulated gate bipolar transistor (IGBT) module. The pressure balancing clamp for a press-pack IGBT module includes a bracket, where the bracket is provided with two longitudinally arranged pressure equalizing plates in a sliding way; the pressure equalizing plates are connected through pressure sensors; the upper and lower ends inside the bracket are respectively connected with the pressure equalizing plates through hydraulic devices and a displacement compensation device; opposite surfaces of the two pressure equalizing plates are respectively provided with heat dissipation and confluence devices. The pressure sensors are in one-to-one correspondence with the hydraulic devices and are electrically connected. The hydraulic devices adjust the pressure according to the readings of the pressure sensors in corresponding directions, so that the pressure of the press-pack IGBT module is balanced.

Abstract: Provided is a data signal transmission connector configured to electrically connect a first electronic component and a second electronic component includes a first base frame and a second base frame having a structure which are mirror-symmetrical, the first base frame and the second base frame being disposed to face each other and to be spaced apart from each other.

Abstract: An inertial measurement apparatus includes a first gyro sensor that has a detection axis set in the direction of a first axis, is driven at a first drive frequency, and detects angular velocity around the first axis, a second gyro sensor that has a detection axis set in the direction of a second axis, is driven at a second drive frequency, and detects angular velocity around the second axis, a third gyro sensor that has a detection axis set in the direction of a third axis, is driven at a third drive frequency, and detects angular velocity around the third axis, and a substrate on which the first, second, and third gyro sensors are provided. The natural vibration frequency of the substrate is set at a frequency that does not coincide with any of fd1, fd2, and fd3, where fd1, fd2, and fd3 represent the first, second, and third drive frequencies.

Abstract: A sensor device includes an angular velocity sensor element, an acceleration sensor element, an intermediate member, and an elastic body. Both the angular velocity sensor element and the acceleration sensor element are mounted on the intermediate member. The elastic body is connected to the intermediate member and a fixing part located apart from the intermediate member. The intermediate member is configured to vibrate by receiving a vibration applied to the fixing part.

Abstract: A disclosed socket may include (1) a base that is arched to match a degree of warpage experienced by an electrical component and (2) an array of contact pins arranged across the base. A first side of the contact pins may be electrically coupled to a circuit board, and a second side of the contact pins may protrude from the base opposite the circuit board to establish contact with the electrical component despite the degree of warpage experienced by the electrical component. Various other apparatuses, systems, and methods are also disclosed.

Abstract: We disclose herein a semiconductor device sub-assembly comprising: a plurality of semiconductor units laterally spaced to one another; a semiconductor unit locator comprising a plurality of holes, wherein each semiconductor unit is located in each hole of the semiconductor unit locator; a plurality of pressure means for applying pressure to each semiconductor unit, and a conductive malleable layer located between the plurality of pressure means and the semiconductor unit locator.

Abstract: In a processor fastening structure, when a compression spring (23) is compressed by shortening a distance between the other end of a screw (24) and a heat sink base (22), the compression spring (23) provides elastic force for both the screw (24) and the heat sink base (22). In addition, because the screw (24) passes through the compression spring (23) to connect to a fastening assembly (21), the elastic force of the compression spring (23) is converted into pressure from the heat sink base (22) to a CPU.

Abstract: In an embodiment, a device includes: a package component including: integrated circuit dies; an encapsulant around the integrated circuit dies; a redistribution structure over the encapsulant and the integrated circuit dies, the redistribution structure being electrically coupled to the integrated circuit dies; sockets over the redistribution structure, the sockets being electrically coupled to the redistribution structure; and a support ring over the redistribution structure and surrounding the sockets, the support ring being disposed along outermost edges of the redistribution structure, the support ring at least partially laterally overlapping the redistribution structure.

Abstract: A power amplifier arrangement for a motor vehicle includes a printed circuit board disposed between a housing on a first side of the printed circuit board and a heat sink on a second side of the printed circuit board. A power amplifier is mounted on the second side of the printed circuit board. A bracket is supported by the housing. A clamping spring is supported by the bracket such that the clamping spring is in biased engagement with the first side of the printed circuit board, and such that the power amplifier is pressed into engagement with the heat sink.

Abstract: A housing 10 is provided with a groove V1a into which an electrode 3b of a laser oscillation element 30a and an electrode 3a of a laser oscillation element 30b are inserted. Inside the groove V1a, there exists a conductive layer 12 configured to electrically connect the electrode 3b of the laser oscillation element 30a and the electrode 3a of the laser oscillation element 30b.

Abstract: A method for manufacturing a printed circuit board (PCB) with high component density includes at least two reinforcing plates, at least two connecting plates, a first circuit board unit, and a second circuit board unit. The reinforcing plate includes a supporting portion, a first connecting portion, and a second connecting portion. The first connecting portion and the second connecting portion connect to ends of the supporting portion. The connecting plates are bendable circuit boards. Each connecting plate is attached to the supporting portion, the first connecting portion, and the second connecting portion of a reinforcing plate. The first circuit board unit is fixed and electrically connected to a connecting plate away from first connecting portion. The second circuit board unit is fixed and electrically connected to a connecting plate away from the second connecting portion.

Abstract: A power semiconductor arrangement includes a carrier and packages. Each package: encloses a power semiconductor die having first and second load terminals and configured to conduct a die load current between the load terminals; has a package body with a top side, a footprint side and sidewalls extending from the footprint side to the top side; a lead frame structure configured to electrically and mechanically couple the package to the carrier with the package footprint side facing the carrier, the lead frame structure including at least one first outside terminal electrically connected with the first load terminal of the die; a top layer arranged at the package top side and electrically connected with the second load terminal of the die. A top heatsink is attached to each package top layer, electrically contacted to each package top layer, and configured to conduct at least a sum of the die load currents.

Abstract: An example thermal interface device to attach to and cool a memory module. The device includes two sides sections that cover and contact the side faces of the memory module when installed. The device includes an outer layer that is a thermally conductive and resilient material, and an inner layer that is a thermally conductive and malleable metal. The inner layer may be nested within the outer layer, and the inner layer contacts the memory circuits of the memory module when installed. The outer layer includes spring fingers extending outward so as to contact and be compressed by a heat transfer device, such as a heat pipe, that is positioned on a side of the memory module. A thermally conductive path is thereby provided between the memory module and the heat transfer device via the thermal interface device.

Abstract: An apparatus includes a base, one or more first fins, one or more second fins and one or more thermoelectric generation units. The base may be thermally couplable to an electrical module that generates heat while operational. The first fins may be thermally connected to the base. The second fins may be thermally isolated from the base. The thermoelectric generation units may be (i) disposed between the first fins and the second fins and (ii) configured to convert a heat difference between the first fins and the second fins into an electrical signal at a port thereby cooling the electrical module.

Abstract: A substrate includes a circuit board, a heat generator mounted over a mounting surface of the circuit board, a heat sink in contact with the heat generator, a retainer attached to the mounting surface so as to retain the heat generator and reinforce the circuit board, and a fastener configured to fix the heat sink to the retainer so as to bring the heat sink into contact with the heat generator.

Abstract: A heat sink assembly for an alternator. The heat sink assembly includes a clip for clipping the heat sink assembly onto a diode rectifier heat sink of the alternator. Thermally conductive material is on an inner surface of the clip. A heat sink is on an outer surface of the clip opposite to the thermally conductive material, and includes fins. Thermal energy from a hotspot of the alternator to which the heat sink assembly is clipped is conducted to the heat sink by way of the thermally conductive material and is radiated from the fins to cool the hotspot.

Abstract: A semiconductor device includes a semiconductor module having a semiconductor element, a radiator plate which is connected to the semiconductor element and which has at least one radiator plate through hole formed therein, and resin covering the semiconductor element and the radiator plate with a lower surface of the radiator plate exposed, a cooler, first insulating grease provided between the lower surface of the radiator plate and the cooler to thermally connect the radiator plate and the cooler, and second insulating grease provided in the at least one radiator plate through hole to be connected to the first insulating grease.

Abstract: Disclosed herein is an electric compressor including: a main housing (4) having therein a suction chamber into which low-temperature refrigerant is drawn; an inverter housing (1) including an internal seating surface (1a) formed adjacent to the suction chamber, with at least one inverter element (2) fixed at a surface thereof to the internal seating surface (1a) while making contact with the internal seating surface (1a), the at least one inverter element (2) conducting heat to the main housing (4); and at least one heat dissipation cover (6) disposed toward the main housing (4) while facing another surface of the inverter element (2) and enclosing the inverter element (2), the at least one heat dissipation cover (6) having therein a receiving space (64) in which the inverter element (2) is received.

Abstract: Provided is a semiconductor device enabling highly accurate adjustment of a mounting height at a time when the semiconductor device is mounted on an assembly board, and an electronic apparatus. A linear lead is extracted from a bottom surface of a cylindrical resin sealing body covering a semiconductor chip, and a plurality of helical leads are arranged so as to wind around the linear lead, to thereby form a multi-helical structure. The plurality of helical leads forming the multi-helical structure has the same pitch.

Abstract: A package assembly includes a device package having a package perimeter footprint. A package riser is coupled with the device package. The package riser includes a riser body having a riser perimeter footprint corresponding to the package perimeter footprint. The riser body includes a package face coupled with the device package and an opposed platform face. A riser flange is proximate to the package face. The riser flange extends from the riser body. A package clamp is coupled with the device package and the package riser. The package clamp includes a clamp face coupled with the device package, and one or more clamp legs clamped to the riser flange. The device package is clamped between the clamp face and the package face.

Abstract: A submodule comprising: a substrate, a power semiconductor component, a connection device, a terminal device and an insulating body. The substrate has conductor tracks electrically insulated from one another, and the component is electrically conductively connected to a track. The connection device is a film composite with a first surface facing the component and the substrate and an opposed second surface. The insulating body has: a first partial body, connected to an edge of the substrate, a first cutout for a terminal, a second partial body, embodied as a pressure body and a second cutout, with a pressure element projecting therefrom. The second partial body is movable relative to the first partial body in the direction of the substrate to press with the pressure element onto a section of the second surface. The section is within the area of the component in projection along the direction of the normal thereto.

Abstract: A power tool and a printed circuit board assembly (“PCBA”) for the power tool. The PCBA includes, for example, a printed circuit board (“PCB”), a heat sink, a spacer between the PCB and the heat sink, and a gap pad. The PCB and the heat sink are fastened to one another via fasteners so the spacer absorbs excess forces torsional forces from torques applied to the fasteners. The gap pad is placed within an opening or recess of the spacer to contact one or more FETs on the PCB. In some embodiments, the PCBA includes a second heat sink or rigid member on the opposite side of the PCB than the spacer to further distribute excess torsional forces from torques applied to the fasteners.

Abstract: A heat sink mounting configuration is provided that is configured to prevent the heat sink from damaging ball grid arrays (BGA) of an application specific integrated circuit (ASIC) mounted on a printed circuit board (PCB) when the line card is subjected to vibrations and shocks. The heat sink mounting configuration may include a set of screws configured to be at least partially disposed within the apertures of the heat sink to secure the heat sink to the PCB. The mounting configuration includes a resilient member and a spacer disposed around the screws proximate to the apertures. The resilient members are configured to bias the heat sink against the ASIC to maintain the heat sink in contact with the ASIC. The spacers are configured to prevent the heat sink from impacting the ASIC with forces large enough to damage the BGA when the line card is subjected to vibrations and shocks.

Abstract: A cooling apparatus includes first and second wedges, a solid thermal interface material (TIM) and a flexible force-exerting element. The first wedge has a first flat surface and a first diagonal surface. The first flat surface is configured to dissipate heat from an electronic device. The second wedge has a second flat surface and a second diagonal surface. The second diagonal surface faces the first diagonal surface, and the second flat surface is coupled to a heat sink and configured to dissipate heat thereto. The TIM is disposed between the first and second diagonal surfaces, and is configured to transfer heat between the first and second wedges. The force-exerting element is configured to move the first wedge or the second wedge, so as to slide the first diagonal surface or the second diagonal surface on the TIM and push the second flat surface against the heat sink.

Abstract: An enhanced electrical yield is achieved with an integrated thermoelectric generator (iTEG) of out-of-plane heat flux configuration on a substrate wafer having hill-top junction metal contacts and valley-bottom junction metal contacts joining juxtaposed ends of segments, alternately p-doped and n-doped, of defined thin film lines of segments of a polycrystalline semiconductor, extending over inclined opposite flanks of hills of a material of lower thermal conductivity than the thermal conductivity of the thermoelectrically active polycrystalline semiconductor, by keeping void the valleys spaces (V) among the hills and delimited at the top by a planar electrically non conductive cover with metal bond pads defined over the coupling surface, adapted to bond with respective hill-top junction metal contacts. The junction metal contacts have a cross sectional profile of low aspect ratio, with two arms or wings overlapping the juxtaposed end portions of the segments.

Abstract: Dices of integrated Z-device structures on a substrate wafer of a 3D integrated thermo-electric generator (iTEG) may be stacked in a tri-dimensional heterogeneous integration mode, without or with interposer wafer dices, in coherent thermal coupling among them. Through silicon vias (TSVs) holes through the thickness of the semiconductor crystal of substrate of the dices of integrated Z-device structures in geometrical projection correspondence with valley bottom metal junction contacts, and through silicon vias (TSVs) holes through the thickness of the semiconductor crystal of interposer dices, in geometrical projection correspondence with the hill-top metal junction contacts of the coupled Z-device structures, have a copper or other good heat conductor filler, form low thermal resistance heat conduction paths through the stacked Z-device structures. Thermoelectrically generated current is gathered from every integrated Z-device of a multi-tier iTEG operating in an out-of-plane heat flux configuration.

Abstract: A heat transferring device comprises two massive thermally conductive bodies arranged vertically on top of one another and spaced apart by a variable distance. One or more spreading elements are positioned between the thermally conductive bodies and respectively comprise two horizontally movable wedges with wedge tips pointing in opposite directions and a spring pressing apart the wedges. The thermally conductive bodies have corresponding sliding surfaces extending parallel to the wedge surfaces. Motion of the wedges in the horizontal direction is converted into vertical motion of the thermally conductive bodies to thereby automatically adapt the height of the entire device to a respective installation situation.

Abstract: Embodiments of the present disclosure are directed towards a socket loading element and associated techniques and configurations. In one embodiment, an apparatus may include a loading element configured to transfer a compressive load from a heat spreader to a socket assembly, wherein the loading element is configured to form a perimeter around a die when the loading element is coupled with an interposer disposed between the die and the socket assembly and wherein the loading element includes an opening configured to accommodate the die. Other embodiments may be described and/or claimed.

Abstract: A system includes a retainer assembly to align each of a group of cooling devices with a corresponding electrical component of a group of electrical components that are mounted to a circuit board, where the retainer assembly includes a group of apertures, such that each of the cooling devices protrudes through a corresponding aperture when the retainer assembly is installed on the circuit board, and where the retainer assembly includes a group of retaining springs, each of which is associated with a corresponding aperture, that applies a respective force, of a group of forces, to a corresponding one of the cooling devices when the retainer assembly is installed on the circuit board. The system also includes a set of fasteners to mount the retainer assembly to the circuit board, such that the cooling devices dissipate heat that is generated by the electrical components.

Abstract: A fiber optic laser for use in high stress environments is provided. The fiber optic laser comprises a hollow spool structure housing a fiber in a spiral groove in an interior surface of said hollow spool structure, wherein the fiber is mechanically supported along an entirety of its length within the hollow spool structure. Fluid channels are formed within the hollow spool structure, wherein a quantity of coolant is movable through the fluid channels to provide high-precision thermal management of the fiber.

Abstract: Embodiments of three dimensional (3D) System-in-Package (SiPs) and methods for producing 3D SiPs having improved heat dissipation capabilities are provided. In one embodiment, the 3D SiP includes a heat-dissipating structure having a first principal surface and a second principal surface opposite the first principal surface. The backside of a first microelectronic device is disposed adjacent and thermally coupled to the first principal surface of the heat-dissipating structure, while the backside of a second microelectronic device is disposed adjacent and thermally coupled to the second principal surface of the heat-dissipating structure. During operation of the 3D SiP, heat generated by the microelectronic devices is conductively transferred to and dissipated through the heat-dissipating structure.

Abstract: Embodiments of the present disclosure are directed to interconnects that include liquid metal, and associated techniques and configurations. The individual interconnects may electrically couple a contact of a printed circuit board (PCB) to a contact of a device under test (DUT). The interconnect may be disposed in or on the PCB. In various embodiments, the interconnect may include a carrier that defines a well (e.g., an opening in the carrier), and the liquid metal may be disposed in the well. In some embodiments, the contact of the DUT, or a contact of an intermediary device, may extend into the well and directly contact the liquid metal. In other embodiments, a flex circuit may be disposed over the well to seal the well. The flex circuit may include a conductive pad to electrically couple the liquid metal to the contact of the DUT. Other embodiments may be described and claimed.

Abstract: A semiconductor-device mounting structure includes a first semiconductor device and a plate-shaped second semiconductor device connected to the first semiconductor device. The first semiconductor device includes a flexible board, an electronic component, and a sealing resin. The flexible board includes a bendable flexible portion and a hard portion. The flexible portion is bent at a boundary with the hard portion, along a shape of the electronic component such that the flexible board covers the electronic component. The flexible board and the electronic component are sealed with the sealing resin. The first semiconductor device is provided vertical to the second semiconductor device such that the hard portion is provided parallel to the second semiconductor device.

Abstract: It is impossible in a cooling device using a phase-change system, seeking high heat transport performance, to obtain sufficient cooling performance due to the increase in thermal resistance with a heating element to be cooled, therefore, a connecting structure of a cooling device according to an exemplary aspect of the present invention includes a connecting board with an opening; a pressing plate of thin plate elastically deformable; first fixing means for fixing the pressing plate to the connecting board with the pressing plate disposed covering heat receiving means composing the cooling device; and second fixing means for fixing the connecting board to a substrate with the heat receiving means abutting against a heating element mounted on the substrate and disposed in the opening.

Abstract: It is impossible in a cooling device using a phase-change system, seeking high heat transport performance, to obtain sufficient cooling performance due to the increase in thermal resistance with a heating element to be cooled, therefore, a connecting structure of a cooling device according to an exemplary aspect of the present invention includes a connecting board with an opening; a pressing plate of thin plate elastically deformable; first fixing means for fixing the pressing plate to the connecting board with the pressing plate disposed covering heat receiving means composing the cooling device; and second fixing means for fixing the connecting board to a substrate with the heat receiving means abutting against a heating element mounted on the substrate and disposed in the opening.

Abstract: A conduction-cooled card assembly is disclosed that includes a conduction-cooling frame, a printed wiring board mounted on the frame, and a wedgelock fastener. The conduction-cooling frame has a thermal management interface adapted to transfer heat from the frame to a chassis, and the wedgelock fastener is adapted to press the thermal management interface of the conduction-cooling frame against a rail of the chassis.

Abstract: An electric power converter that can easily be assembled is provided. An electric power converter includes a semiconductor stacking unit, a frame and a spring unit. The semiconductor stacking unit has a configuration in which the semiconductor modules and coolers are stacked. The spring unit is inserted between one end of the semiconductor stacking unit in a stacking direction, and a support provided on the frame, and fixes the semiconductor stacking unit while applying pressure thereto. The spring unit is provided with a first plate, a second plate, and a coil spring sandwiched between the first and second plates. A recess is provided in the first plate so as to have a gap between the first plate and the end surface of the semiconductor stacking unit. A penetrating passage through which the entire spring unit passes along a bottom of the recess is provided in the spring unit.

Abstract: A semiconductor device includes a semiconductor element in a frame body. The semiconductor element includes a first electrode electrically connected to an electrode block provided on a first side of the semiconductor element. A connection element, which in some embodiments may be a portion of the electrode block, connects the electrode block to the frame body. The semiconductor element is sealed within an enclosure formed at least in part by the frame body, the connection element, and the electrode block. The connection element includes a fragile portion which has a resistance to increases in pressure or temperature that is less than other portions of the connection element. That is, in general, the fragile portion will fail before other portions of the connection element when pressure or temperature increases, which may occur when, for example, the semiconductor element breaks down.

Abstract: A method includes providing a carrier having a first cavity, providing a dielectric foil with a metal layer attached to the dielectric foil, placing a first semiconductor chip in the first cavity of the carrier, and applying the dielectric foil to the carrier.

Abstract: A power semiconductor module includes: a circuit body having a power semiconductor element and a conductor member connected to the power semiconductor element; a case in which the circuit body is housed; and a connecting member which connects the circuit body and the case. The case includes: a first heat dissipating member and a second heat dissipating member which are disposed in opposed relation to each other while interposing the circuit body in between; a side wall which joins the first heat dissipating member and the second heat dissipating member; and an intermediate member which is formed on the periphery of the first heat dissipating member and connected to the side wall, the intermediate member including a curvature that is projected toward a housing space of the case.

Abstract: A switching device having a substrate, a power semiconductor component, a connecting device, load connection devices and a pressure device. Substrate has electrically insulated conductor tracks. A power semiconductor component is arranged on a conductor track. Connecting device is formed as a film composite having an electrically conductive film and an electrically insulating film, and has first and second main surfaces. Switching device is connected in an internally circuit-conforming manner by connecting device. The pressure device has a pressure body with a first recess, a pressure element being arranged so that it projects out of the recess, wherein the pressure element presses onto a section of the second main surface of film composite and, in this case, the section is arranged within the surface of the power semiconductor component in projection along the normal direction of the power semiconductor component.

Abstract: A flip chip microelectronic package having a heat spreader is provided. In one embodiment, the microelectronic package comprises a die having a first surface and a second surface, the first surface being coupled to a substrate; a thermal interface material disposed in thermal conductive contact with the second surface of the die; and a heat spreader adapted for dissipating heat from the die, the heat spreader disposed in thermal conductive contact with the thermal interface material. The heat spreader includes a lid having an inner chamber therein defined by a first wall and a second wall, the second wall securely joined to the first wall to seal the chamber, the lid being mounted to the substrate and a wick layer positioned in the chamber.

Abstract: A module is electrically connectable to a computer system. The module includes an edge connector with a plurality of electrical contacts electrically connectable to the computer system, at least one layer of thermally conductive material thermally coupled to the edge connector, and first and second printed circuit boards each having a plurality of integrated circuit components that are electrically coupled to the edge connector and thermally coupled to the at least one layer of thermally conductive material. The at least one layer of thermally conductive material are disposed between the first and second printed circuit boards.

Abstract: In a semiconductor device, a semiconductor module is pressed against a cooler by a spring member. The spring member is compressed by a beam member that is connected with a strut fixed to the cooler. The cooler has a pressed part in which the semiconductor module is pressed, and a strut fixing part to which the strut is fixed. The strut fixing part has higher rigidity than the pressed part.

Abstract: A semiconductor module includes a case including a receiving space that is formed by a frame portion and a pair of wall portions disposed to face each other with the frame portion therebetween. The wall portion includes a heat-dissipation portions and a support wall that supports the heat-dissipation portions at the frame portion, and the wall portion includes a heat-dissipation portion and a support wall that supports the heat-dissipation portion at the frame portion. The heat-dissipation portions provided at the wall portion are separately provided by being disposed to face a plurality of semiconductor device blocks respectively. A plurality of separate heat-dissipation portions is surrounded by the support wall, the support wall is deformed to recessed from the frame portion through the separate heat-dissipation portions inside the case such that a plurality of insulating sheets is closely joined to a plurality of lead frames and the plurality of heat-dissipation portions.

Abstract: A housing (1) for at least one electronic card (2), designed for the aeronautics field, of the type having a standardized width and including two lateral guides designed to work together with slides provided on the inner surfaces of an electronics bay, includes two half-shells, upper (4) and lower (5), pressed together at the lateral guides; the lower half-shell includes at least one bearing area (10) forming the housing for electronic cards; elements (19) for pressing each electronic card (2) in each corresponding housing and for pressing at least one heat sink (16) against the upper surface of at least one electronic card; the function of the body (5) is to take into account the mechanical stresses linked to the electronic cards hosted within the housing, and the function of the cover (4) is to ensure adequate thermal conductivity to allow heat produced by an electronic card in operation to be dissipated.

Abstract: A heat dissipation device is used in a circuit board, where the circuit board includes a chip and at least one positioning hole disposed around the chip, and each of the positioning holes has a bare metal area on its periphery. The heat dissipation device includes a heat dissipation element, a conductive element and at least one fixing part. The heat dissipation element is disposed on the chip; the conductive element is connected electrically to the bare metal area of the circuit board and the heat dissipation element respectively; the fixing part passes through the fixing holes and is connected to the positioning hole, so as to fix the heat dissipation element to the circuit board. A circuit board is also provided, which includes a substrate, a chip, a positioning hole and the heat dissipation device.

Abstract: A heat transfer member is disposed between a semiconductor element and an electrode plate. The heat transfer member comprises a metal portion extending between a first face at the semiconductor element side and a second face at the plate electrode side, and a ceramic portion surrounding the metal portion. An area of the first face is less than an area of the second face in the metal portion.

Abstract: A fastener includes a main body, a washer, and a spring. The main body includes a pole, two spaced latches extending from a top end of the pole, and two spaced legs extending down from a bottom end of the pole opposite to the latches. An annular blocking portion protrudes out from a circumference of the pole adjacent to the legs. A tapered first projection protrudes from an outer side of a distal end of each latch opposite to the other latch. A tapered second projection protrudes from an outer side of a distal end of each leg opposite to the other leg. The washer and the spring are fitted around the pole, and the spring is sandwiched between the washer and the blocking piece.