Semiconductor module

- ROHM CO., LTD.
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Description

FIG. 1 is a rear, bottom, and left side perspective view of a semiconductor module showing my new design;

FIG. 2 is a front, top, and right side perspective view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a left side view thereof;

FIG. 6 is a cross-sectional view taken along line 6-6 in FIG. 4 thereof; and,

FIG. 7 is a cross-sectional view taken along line 7-7 in FIG. 4 thereof.

The broken lines illustrate portions of the semiconductor module that form no part of the claimed design. The dash-dotted lines denote the boundary of the claim and form no part of the claimed design.

Claims

The ornamental design for a semiconductor module, as shown and described.

Referenced Cited
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Patent History
Patent number: D1015284
Type: Grant
Filed: Sep 16, 2021
Date of Patent: Feb 20, 2024
Assignee: ROHM CO., LTD. (Kyoto)
Inventor: Yoshihisa Tsukamoto (Kyoto)
Primary Examiner: Shawn T Gingrich
Assistant Examiner: Caleb M Baker
Application Number: 29/808,052