Semiconductor module
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The broken lines illustrate portions of the semiconductor module that form no part of the claimed design. The dash-dotted lines denote the boundary of the claim and form no part of the claimed design. The oblique line shading shown in the drawings indicates transparent parts.
Claims
The ornamental design for a semiconductor module, as shown and described.
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- Office Action issued for Japanese Patent Application No. 2020-001382, Dispatch Date: Oct. 2, 2020, 2 pages.
Type: Grant
Filed: Jul 21, 2020
Date of Patent: Dec 13, 2022
Assignee: ROHM CO., LTD. (Kyoto)
Inventor: Hideo Hara (Kyoto)
Primary Examiner: Shawn T Gingrich
Application Number: 29/743,417