Bracket for heat sink of CPU
Description
The broken lines in the drawings illustrate portions of the bracket for heat sink of CPU that form no part of the claimed design.
Claims
The ornamental design for a bracket for heat sink of CPU, as shown and described.
Referenced Cited
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Patent History
Patent number: D1034490
Type: Grant
Filed: May 9, 2022
Date of Patent: Jul 9, 2024
Inventor: Hongmin Li (Anhui)
Primary Examiner: April Rivas
Application Number: 29/864,080
Type: Grant
Filed: May 9, 2022
Date of Patent: Jul 9, 2024
Inventor: Hongmin Li (Anhui)
Primary Examiner: April Rivas
Application Number: 29/864,080
Classifications
Current U.S. Class:
Heat Sink (D13/179)