Bracket for heat sink of CPU

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Description

FIG. 1 is a top, front and right perspective view of a bracket for heat sink of CPU showing my new design;

FIG. 2 is a bottom, rear and left perspective view thereof;

FIG. 3 is a front elevation view thereof;

FIG. 4 is a rear elevation view thereof;

FIG. 5 is an enlarged left side elevation view thereof;

FIG. 6 is an enlarged right side elevation view thereof;

FIG. 7 is a top plan view thereof; and,

FIG. 8 is a bottom plan view thereof.

The broken lines in the drawings illustrate portions of the bracket for heat sink of CPU that form no part of the claimed design.

Claims

The ornamental design for a bracket for heat sink of CPU, as shown and described.

Referenced Cited
U.S. Patent Documents
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Patent History
Patent number: D1034490
Type: Grant
Filed: May 9, 2022
Date of Patent: Jul 9, 2024
Inventor: Hongmin Li (Anhui)
Primary Examiner: April Rivas
Application Number: 29/864,080
Classifications
Current U.S. Class: Heat Sink (D13/179)