Multilayer integrated circuit carrier board

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Description

FIG. 1 is a front, right perspective view of a multilayer integrated circuit carrier board, showing our new design;

FIG. 2 is a rear, left perspective view thereof;

FIG. 3 is a front view thereof;

FIG. 4 is a rear view thereof;

FIG. 5 is a left view thereof;

FIG. 6 is a right view thereof;

FIG. 7 is a top view thereof;

FIG. 8 is a bottom view thereof;

FIG. 9 is an exploded view thereof; and,

FIG. 10 is a perspective view thereof, shown in a used condition with adjacent multilayer IC carrier boards in broken lines.

The broken lines shown on the drawings depict portions of a multilayer integrated circuit carrier board that form no part of the claimed design. The broken lines of the adjacent multilayer IC carrier boards in FIG. 10 form no part of the claimed design.

Claims

The ornamental design for a multilayer integrated circuit carrier board as shown and described.

Referenced Cited
U.S. Patent Documents
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Other references
  • IC Carrier Board,https://www.hontecmultipcb.com/ic-carrier-board.html, 2025. (Year: 2025).
Patent History
Patent number: D1106985
Type: Grant
Filed: May 12, 2023
Date of Patent: Dec 23, 2025
Assignee: MXW Device (Shenzhen) Co., Ltd. (Shenzhen)
Inventors: Steve Yuen (Guangdong), Du Chen (Guangdong)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/892,078