Carrier substrate for handling

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Description

FIG. 1 is a perspective view of a first embodiment of a carrier substrate for handling, showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left-side elevational view thereof, the right-side elevational view being a mirror image thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is an enlarged view taken from encircled portion labeled, “FIG. 7,” in FIG. 1;

FIG. 8 is an enlarged view taken from encircled portion labeled, “FIG. 8,” in FIG. 1;

FIG. 9 is an enlarged view taken from encircled portion labeled, “FIG. 9,” in FIG. 2; and

FIG. 10 is an enlarged view taken from encircled portion labeled, “FIG. 10,” in FIG. 4.

FIG. 11 is a perspective view of a second embodiment of a carrier substrate for handling, showing our new design;

FIG. 12 is a front elevational view thereof;

FIG. 13 is a rear elevational view thereof;

FIG. 14 is a left-side elevational view thereof, the right-side elevational view being a mirror image thereof;

FIG. 15 is a top plan view thereof;

FIG. 16 is a bottom plan view thereof;

FIG. 17 is an enlarged view taken from encircled portion labeled, “FIG. 17,” in FIG. 11; and,

FIG. 18 is an enlarged view taken from encircled portion labeled, “FIG. 18,” in FIG. 14.

The evenly-spaced broken lines depict parts of the carrier substrate for handling that form no part of the claimed design. The dot-dash broken lines depict boundaries of the enlarged portion views shown in FIGS. 1, 2, 4, 7-11, 14, 17, and 18, and form no part of the claimed design.

Claims

The ornamental design for a carrier substrate for handling as shown and described.

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Patent History
Patent number: D1054388
Type: Grant
Filed: Apr 15, 2022
Date of Patent: Dec 17, 2024
Assignee: SHIN-ETSU CHEMICAL CO., LTD. (Tokyo)
Inventors: Yoshinori Ogawa (Kamakura), Kazunori Kondo (Takasaki), Nobuaki Tomura (Sendai), Nobuaki Matsumoto (Takasaki), Akira Sakamoto (Takasaki), Taichi Kitagawa (Annaka)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/835,098