Carrier substrate for handling
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The evenly-spaced broken lines depict parts of the carrier substrate for handling that form no part of the claimed design. The dot-dash broken lines depict boundaries of the enlarged portion views shown in
Claims
The ornamental design for a carrier substrate for handling as shown and described.
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Type: Grant
Filed: Apr 15, 2022
Date of Patent: Dec 17, 2024
Assignee: SHIN-ETSU CHEMICAL CO., LTD. (Tokyo)
Inventors: Yoshinori Ogawa (Kamakura), Kazunori Kondo (Takasaki), Nobuaki Tomura (Sendai), Nobuaki Matsumoto (Takasaki), Akira Sakamoto (Takasaki), Taichi Kitagawa (Annaka)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/835,098