Substrate-handling robot end effector

- Applied Materials, Inc.
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Description

FIG. 1 is a top perspective view of a substrate-handling robot end effector in accordance with a first embodiment of the present design.

FIG. 2 is a bottom perspective view of the first embodiment of the present design.

FIG. 3 is a top view of the first embodiment of the present design.

FIG. 4 is a bottom view of the first embodiment of the present design.

FIG. 5 is a first side view of the first embodiment of the present design.

FIG. 6 is a second side view of the first embodiment of the present design.

FIG. 7 is a front view of the first embodiment of the present design.

FIG. 8 is a rear view of the first embodiment of the present design.

FIG. 9 is a top perspective view of a substrate-handling robot end effector in accordance with a second embodiment of the present design.

FIG. 10 is a bottom perspective view of the second embodiment of the present design.

FIG. 11 is a top view of the second embodiment of the present design.

FIG. 12 is a bottom view of the second embodiment of the present design.

FIG. 13 is a first side view of the second embodiment of the present design.

FIG. 14 is a second side view of the second embodiment of the present design.

FIG. 15 is a front view of the second embodiment of the present design; and,

FIG. 16 is a rear view of the second embodiment of the present design.

The broken lines shown in the figures are directed to unclaimed portions of the end effector and/or unclaimed components attached to the end effector that are for illustrative purposes only and form no part of the claimed design.

Claims

The ornamental design for a substrate-handling robot end effector, as shown and described.

Referenced Cited
U.S. Patent Documents
6322116 November 27, 2001 Stevens
RE44567 November 5, 2013 Yoshino
D941787 January 25, 2022 Malik
D997892 September 5, 2023 Aizawa
D1077046 May 27, 2025 Van Brakel
20030085582 May 8, 2003 Woodruff
20150086316 March 26, 2015 Greenberg
20150217456 August 6, 2015 Tsuji
20170173799 June 22, 2017 LoPiccolo
20220063113 March 3, 2022 Pavlik
20220143813 May 12, 2022 Kuribayashi
20230191624 June 22, 2023 Wu
20230191627 June 22, 2023 Bosboom
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20240227210 July 11, 2024 Embertson
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Foreign Patent Documents
309180525 March 2025 CN
Other references
  • End effector—Wafer Handling Systems—Coreflow, posted date N/A, [retrieved Jul. 9, 2025]. Retrieved from internet, https://www.coreflow.com/en/solutions/semiconductor-industry/end-effector (2025) (Year: 2025).
Patent History
Patent number: D1107089
Type: Grant
Filed: Dec 8, 2023
Date of Patent: Dec 23, 2025
Assignee: Applied Materials, Inc. (Santa Clara, CA)
Inventors: Helder Lee (San Jose, CA), Karuppasamy Muthukamatchi (Karnataka)
Primary Examiner: Eric L Goodman
Assistant Examiner: Vincent T Andrews
Application Number: 29/920,206