Three-dimensional circuit board

Skip to: Description  ·  Claims  ·  References Cited  · Patent History  ·  Patent History
Description

FIG. 1 is a front elevational view of a three-dimensional circuit board showing our new design.

FIG. 2 is a rear elevational view thereof.

FIG. 3 is a top plan view thereof.

FIG. 4 is a bottom plan view thereof.

FIG. 5 is a left side elevational view thereof.

FIG. 6 is a right side elevational view thereof.

FIG. 7 is a front, top, and right side perspective view thereof; and,

FIG. 8 is a rear, top, and right side perspective view thereof.

Claims

The ornamental design for a three-dimensional circuit board, as shown and described.

Referenced Cited
U.S. Patent Documents
3072734 January 1963 Fox
D209297 November 1967 Hulser
3461574 August 1969 Larsen
3510962 May 1970 Sato
3726027 April 1973 Cohen
4474376 October 2, 1984 Gustafson
D279670 July 16, 1985 Lukits
5918881 July 6, 1999 Kirby
D442150 May 15, 2001 Kang
D466093 November 26, 2002 Ebihara
6921314 July 26, 2005 Miller
D552048 October 2, 2007 He
D605613 December 8, 2009 Carter
D611014 March 2, 2010 Huang
D634370 March 15, 2011 Gebhart
D653290 January 31, 2012 Han
D676004 February 12, 2013 Lyubachev
D691101 October 8, 2013 Ishizawa
D721005 January 13, 2015 Bahn
D738833 September 15, 2015 Quintana
D743970 November 24, 2015 Cepress
D774478 December 20, 2016 Li
D794586 August 15, 2017 Takahashi
D799438 October 10, 2017 Takahashi
D804437 December 5, 2017 Kantor
D837171 January 1, 2019 Vasoya
D856948 August 20, 2019 Vasoya
D864133 October 22, 2019 Kellenberger
D887999 June 23, 2020 Chen
D888674 June 30, 2020 Chen
D893439 August 18, 2020 Vasoya
D909319 February 2, 2021 Nordeen
D937230 November 30, 2021 Fleece
D943676 February 15, 2022 Kalman
D956707 July 5, 2022 Yamauchi
D995456 August 15, 2023 Fleece
D995457 August 15, 2023 Fleece
D1009815 January 2, 2024 McBride
D1010591 January 9, 2024 McBride
D1012872 January 30, 2024 McBride
D1013059 January 30, 2024 Zeng
D1030688 June 11, 2024 Pundole
D1051866 November 19, 2024 Fleece
D1052544 November 26, 2024 Fleece
D1059313 January 28, 2025 Mao
D1067206 March 18, 2025 McBride
D1075952 May 2025 Zeng
Foreign Patent Documents
202430500466.2 April 2025 CN
202430500471.3 April 2025 CN
202430500473.2 April 2025 CN
202430500477.0 April 2025 CN
2024004241 October 2024 JP
2024004242 October 2024 JP
2024004243 October 2024 JP
2024004244 October 2024 JP
2024004245 October 2024 JP
2024004246 November 2024 JP
2024004248 November 2024 JP
2024004249 November 2024 JP
3020240035021 June 2025 JP
301307869 June 2025 KR
301307869.0000 June 2025 KR
301307870 June 2025 KR
301307870.0000 June 2025 KR
301307871 June 2025 KR
301307871.0000 June 2025 KR
3020240035022 June 2025 KR
2402004371 July 2025 TH
Other references
  • Dodecahedron Pcb Design,https://blog.abluestar.com/dodecahedron-pcb-design/,Mar. 29, 2024. (Year: 2024).
Patent History
Patent number: D1125097
Type: Grant
Filed: Aug 30, 2024
Date of Patent: May 5, 2026
Assignees: TAIYO HOLDINGS CO., LTD. (Hiki-gun), DAIEI ELECTRONICS CO., LTD. (Tokyo), (Tokyo)
Inventors: Naoki Yoneda (Saitama), Naoya Sugita (Saitama), Hideo Yamamoto (Saitama), Kazuhide Kitagou (Tokyo), Yukihiro Sonobe (Tokyo)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/960,576