Heat sink for memory modules

- ESSENCORE Limited
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Description

FIG. 1 is a bottom view of the heat sink for memory modules;

FIG. 2 is a front view thereof;

FIG. 3 is a left side view thereof;

FIG. 4 is a front perspective view thereof;

FIG. 5 is a rear view thereof;

FIG. 6 is a right side view thereof; and,

FIG. 7 is a top view thereof.

The broken lines in the drawings depict portions of the heat sink for memory modules that form no part of the claimed design.

Claims

The ornamental design for a heat sink for memory modules as shown and described.

Referenced Cited
U.S. Patent Documents
7957134 June 7, 2011 Farnsworth
D657756 April 17, 2012 Mueller
D717251 November 11, 2014 Mueller
D761744 July 19, 2016 Mueller
D924186 July 6, 2021 Feng
D962880 September 6, 2022 Chung
D1035597 July 16, 2024 Lu
D1066274 March 11, 2025 Lu
20070070607 March 29, 2007 Goodwin
20090034183 February 5, 2009 Chen
Foreign Patent Documents
202430312242.9 January 2025 CN
110301271 September 2021 TW
Other references
  • Klevv Urbane Memory. Found online Sep. 2, 2025 at youtube.com. Reference dated Jan. 20, 2025. Retrieved from https://www.youtube.com/watch?v=pD9PGE9lq98 (Year: 2025).
  • Klevv Urbane V Ram. Found online Sep. 2, 2025 at amazon.com. Reference dated Jan. 13, 2025. Retrieved from https://www.amazon.com/dp/B0DSVSS2ML?th=1 (Year: 2025).
Patent History
Patent number: D1126931
Type: Grant
Filed: May 29, 2024
Date of Patent: May 19, 2026
Assignee: ESSENCORE Limited (Wanchai)
Inventor: Young Suk Chung (Yongin-si)
Primary Examiner: Amanda Christensen
Application Number: 29/944,667
Classifications
Current U.S. Class: Heat Sink (D13/179)