Heat sink for memory modules
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Description
The broken lines in the drawings depict portions of the heat sink for memory modules that form no part of the claimed design.
Claims
The ornamental design for a heat sink for memory modules as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
Other references
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- Klevv Urbane Memory. Found online Sep. 2, 2025 at youtube.com. Reference dated Jan. 20, 2025. Retrieved from https://www.youtube.com/watch?v=pD9PGE9lq98 (Year: 2025).
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Patent History
Patent number: D1126931
Type: Grant
Filed: May 29, 2024
Date of Patent: May 19, 2026
Assignee: ESSENCORE Limited (Wanchai)
Inventor: Young Suk Chung (Yongin-si)
Primary Examiner: Amanda Christensen
Application Number: 29/944,667
Type: Grant
Filed: May 29, 2024
Date of Patent: May 19, 2026
Assignee: ESSENCORE Limited (Wanchai)
Inventor: Young Suk Chung (Yongin-si)
Primary Examiner: Amanda Christensen
Application Number: 29/944,667
Classifications
Current U.S. Class:
Heat Sink (D13/179)