Heat sink for memory modules

- ESSENCORE Limited
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Description

FIG. 1 is a top, front perspective view of the heat sink for memory modules;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top view thereof; and,

FIG. 7 is a bottom view thereof.

Claims

The ornamental design for a heat sink for memory modules, as shown and described.

Referenced Cited
U.S. Patent Documents
6377460 April 23, 2002 Pohl
D531965 November 14, 2006 Stathakis
7215551 May 8, 2007 Wang
7312996 December 25, 2007 Chang
7457122 November 25, 2008 Lai
D597966 August 11, 2009 Shih
7715197 May 11, 2010 Tian
7738252 June 15, 2010 Schuette
D626521 November 2, 2010 Chen
8411443 April 2, 2013 Chen
D689829 September 17, 2013 Chen
D793400 August 1, 2017 Lin
10667431 May 26, 2020 Lunsman
20030011993 January 16, 2003 Summers
20030026076 February 6, 2003 Wei
20060268523 November 30, 2006 Lin
20090034183 February 5, 2009 Chen
20090122481 May 14, 2009 Chang
20090190304 July 30, 2009 Meyer, IV
20090294099 December 3, 2009 Chen
20110088870 April 21, 2011 Lee
20130186595 July 25, 2013 Hsieh
20140202675 July 24, 2014 Chen
Other references
  • TechPowerUp, News Posts; Klevv Announces Two New DDR4 Memory Lines: Cras XR RGB and Bolt XR; Sep. 17, 2020; 2 pgs.;https://www.techpowerup.com/news-tags/Klevv.
  • Klevv Urbane, DDR3 Gaming Memory; Essence Limited, 2015; 1 pg.;https://www.klevv.com/ken/products_details/memory/Klevv_Urbane.
Patent History
Patent number: D962880
Type: Grant
Filed: Aug 6, 2020
Date of Patent: Sep 6, 2022
Assignee: ESSENCORE Limited (Hong Kong)
Inventor: Young Suk Chung (Yongin-si)
Primary Examiner: Selina Sikder
Application Number: 29/745,479
Classifications
Current U.S. Class: Heat Sink (D13/179)