Heat dissipation module
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Description
The evenly-dashed broken lines illustrate portions of the heat dissipation module that form no part of the claimed design. The dot-dashed broken lines depict the limits of the enlarged views and form no part for the claimed design.
Claims
The ornamental design for a heat dissipation module as shown and described.
Referenced Cited
U.S. Patent Documents
Other references
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Patent History
Patent number: D1130337
Type: Grant
Filed: Aug 21, 2024
Date of Patent: Jun 16, 2026
Assignee: Acer Incorporated (New Taipei City)
Inventors: Wei-Yu Lai (New Taipei City), Yi-Heng Lee (New Taipei City)
Primary Examiner: Justin M Jonaitis
Assistant Examiner: Bria'L Simmons-Holloway
Application Number: 29/958,606
Type: Grant
Filed: Aug 21, 2024
Date of Patent: Jun 16, 2026
Assignee: Acer Incorporated (New Taipei City)
Inventors: Wei-Yu Lai (New Taipei City), Yi-Heng Lee (New Taipei City)
Primary Examiner: Justin M Jonaitis
Assistant Examiner: Bria'L Simmons-Holloway
Application Number: 29/958,606
Classifications