Heat dissipation module

- Acer Incorporated
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Description

FIG. 1 is a perspective view of a heat dissipation module showing our new design;

FIG. 2 is another perspective view thereof;

FIG. 3 is a front view thereof;

FIG. 4 is a rear view thereof;

FIG. 5 is a left side view thereof;

FIG. 6 is a right side view thereof;

FIG. 7 is a top view thereof,

FIG. 8 is a bottom view thereof; and,

FIG. 9 is an enlarged view of the portion, labeled ‘9’ of FIG. 1.

The evenly-dashed broken lines illustrate portions of the heat dissipation module that form no part of the claimed design. The dot-dashed broken lines depict the limits of the enlarged views and form no part for the claimed design.

Claims

The ornamental design for a heat dissipation module as shown and described.

Referenced Cited
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Other references
  • Europe—15048317, published Jan. 29, 2024, retrieved Oct. 6, 2025 (DesignVision) (Year: 2024).
  • Asus GeForce, published date unavailable, retrieved Oct. 6, 2025, https://www.dateks.lv/en/cenas/videokartes/1216117-asus-geforce-rtx-5060-ti-16gb-gddr7-dual-oc-dlss-4- (Year: 2025).
Patent History
Patent number: D1130337
Type: Grant
Filed: Aug 21, 2024
Date of Patent: Jun 16, 2026
Assignee: Acer Incorporated (New Taipei City)
Inventors: Wei-Yu Lai (New Taipei City), Yi-Heng Lee (New Taipei City)
Primary Examiner: Justin M Jonaitis
Assistant Examiner: Bria'L Simmons-Holloway
Application Number: 29/958,606
Classifications