Probe pin for integrated circuits testing

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Description

FIG. 1.1 is a perspective view of a probe pin for integrated circuits testing, showing my new design;

FIG. 1.2 is a front view thereof;

FIG. 1.3 is a rear view thereof;

FIG. 1.4 is a left-side view thereof;

FIG. 1.5 is a right-side view thereof;

FIG. 1.6 is a top plan view thereof; and

FIG. 1.7 is a bottom plan thereof.

Claims

The ornamental design for a probe pin for integrated circuits testing as shown and described.

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Patent History
Patent number: D1140868
Type: Grant
Filed: Jul 17, 2024
Date of Patent: Aug 11, 2026
Assignees: HICON CO., LTD. (Seongnam-si), (Seongnam-si), (Seongnam-si)
Inventors: Dong Weon Hwang (Seongnam-si), Jae Baek Hwang (Seongnam-si), Logan Jae Hwang (Beverly Hills, CA)
Primary Examiner: Michael C Stout
Assistant Examiner: Denis Houyoux
Application Number: 35/525,816
Classifications
Current U.S. Class: Element Or Attachment (D13/154)