Socketed integrated circuit package

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Description

FIG. 1 is a perspective view of the integrated circuit package;

FIG. 2 is a side elevation view of the integrated circuit package;

FIG. 3 is an end elevation view of the integrated circuit package from its end nearer the lockout key;

FIG. 4 is an end elevation view of the integrated circuit package from its end opposite that from the lockout key;

FIG. 5 is a top plan view of the integrated circuit package; and,

FIG. 6 is a bottom plan view of the integrated circuit package.

Referenced Cited
U.S. Patent Documents
D82797 December 1930 Cole
D317592 June 18, 1991 Yoshizawa
3762039 October 1973 Douglass et al.
3891898 June 1975 Damon
4422703 December 27, 1983 Christensen et al.
4868349 September 19, 1989 Chia
5119269 June 2, 1992 Nakayama
Patent History
Patent number: D358806
Type: Grant
Filed: Sep 24, 1993
Date of Patent: May 30, 1995
Assignee: SGS-Thomson Microelectronics, Inc. (Carrollton, TX)
Inventors: Harry M. Siegel (Hurst, TX), Michael J. Hundt (Double Oak, TX), Krishnan Kelappan (Carrollton, TX)
Primary Examiner: Joel Sincavage
Attorneys: Rodney M. Anderson, Lisa K. Jorgenson, Richard K. Robinson
Application Number: 0/13,438