Wafer boat for use in a semiconductor wafer heat processing apparatus
Latest Tokyo Electron Ltd. Patents:
- Fluid supply device and fluid supply method
- Flow rate range variable type flow rate control apparatus
- Flow rate range variable type flow rate control apparatus
- Device and method for supplying gas while dividing to chamber from gas supplying facility equipped with flow controller
- Flow rate range variable type flow rate control apparatus
Description
FIG. 1 a perspective view of a wafer boat for use in a semiconductor wafer heat processing apparatus;
FIG. 2 a front elevational view thereof;
FIG. 3 a top plan view thereof;
FIG. 4 a bottom plan view thereof;
FIG. 5 a cross sectional view taken along line V-V in FIG. 2;
FIG. 6 a right side view thereof, the left side view being a mirror image of the right view;
FIG. 7 a rear elevational view thereof; and,
FIG. 8 a cross sectional view taken along line VIII-VIII in FIG. 2.
Referenced Cited
U.S. Patent Documents
Patent History
Patent number: D404015
Type: Grant
Filed: Jul 24, 1997
Date of Patent: Jan 12, 1999
Assignee: Tokyo Electron Ltd. (Tokyo-To)
Inventor: Manabu Honma (Kanagawa)
Primary Examiner: Brian N. Vinson
Law Firm: Ladas & Parry
Application Number: 0/74,281
Type: Grant
Filed: Jul 24, 1997
Date of Patent: Jan 12, 1999
Assignee: Tokyo Electron Ltd. (Tokyo-To)
Inventor: Manabu Honma (Kanagawa)
Primary Examiner: Brian N. Vinson
Law Firm: Ladas & Parry
Application Number: 0/74,281
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)
International Classification: 1303;
International Classification: 1303;