Wafer boat for use in a semiconductor wafer heat processing apparatus

- Tokyo Electron Limited
Skip to: Description  ·  References Cited  · Patent History  ·  Patent History
Description

FIG. 1 a perspective view of a wafer boat for use in a semiconductor wafer heat processing apparatus.

FIG. 2 a front elevational view thereof.

FIG. 3 a cross-sectional view taken along line III--III in FIG. 2.

FIG. 4 a cross-sectional view taken along line IV--IV in FIG. 2.

FIG. 5 a rear elevational view thereof.

FIG. 6 a right side view thereof.

FIG. 7 a top plan view thereof; and,

FIG. 8 a bottom plan view thereof.

Referenced Cited
U.S. Patent Documents
D291413 August 18, 1987 Uehara et al.
D361752 August 29, 1995 Yamaga
D378823 April 15, 1997 Watanabe et al.
4743156 May 10, 1988 Raffay et al.
4857689 August 15, 1989 Lee
5174045 December 29, 1992 Thompson et al.
5314574 May 24, 1994 Takahashi
5320218 June 14, 1994 Yamashita et al.
Patent History
Patent number: D411176
Type: Grant
Filed: Feb 5, 1998
Date of Patent: Jun 22, 1999
Assignee: Tokyo Electron Limited (Tokyo-To)
Inventor: Tomohisa Shimazu (Shiroyama-Machi)
Primary Examiner: Brian N. Vinson
Law Firm: Ladas & Parry
Application Number: 0/83,421
Classifications
Current U.S. Class: Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)
International Classification: 1303;