Semiconductor element
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Description
FIG. 1 is a perspective view of a semiconductor element showing our new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a left side elevational view thereof;
FIG. 4 is a front elevational view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a right side elevational view thereof; and,
FIG. 7 is a rear elevational view thereof.
Referenced Cited
U.S. Patent Documents
Other references
D317592 | June 18, 1991 | Yoshizawa |
D358806 | May 30, 1995 | Siegel et al. |
D375941 | November 26, 1996 | Kerklaan |
D376133 | December 3, 1996 | Kerklaan |
D379350 | May 20, 1997 | Kerklaan |
D386475 | November 18, 1997 | Hiramatsu |
D401912 | December 1, 1998 | Majumdar et al. |
- Publication; "DR-350", Kyocera; Sep. 1997; CF-2MB and CF-4MB. Publication; "PowerShot"; Digital Camera; Cannon; Mar. 1997. Publication; "Picona", NEC; Mar. 1997; PC-FH045 and PC-FH155.
Patent History
Patent number: D432505
Type: Grant
Filed: Dec 15, 1999
Date of Patent: Oct 24, 2000
Assignee: Sony Corporation
Inventors: Haruo Oba (Tokyo), Yoshio Kondo (Tokyo)
Primary Examiner: Brian N. Vinson
Law Firm: Rader, Fishman & Grauer
Application Number: 0/115,446
Type: Grant
Filed: Dec 15, 1999
Date of Patent: Oct 24, 2000
Assignee: Sony Corporation
Inventors: Haruo Oba (Tokyo), Yoshio Kondo (Tokyo)
Primary Examiner: Brian N. Vinson
Law Firm: Rader, Fishman & Grauer
Application Number: 0/115,446
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)
International Classification: 1303;
International Classification: 1303;