Semiconductor chip package

- Siliconix Incorporated
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Description

FIG. 1 is a perspective view from the left side and above the semiconductor chip package;

FIG. 2 is a perspective view from the left side and below the semiconductor chip package;

FIG. 3 is an elevational view from the left side of the semiconductor chip package;

FIG. 4 is an elevational view from the right side of the semiconductor chip package;

FIG. 5 is an elevational view from the back side of the semiconductor chip package;

FIG. 6 is an elevational view from the front side of the semiconductor chip package;

FIG. 7 is a top view of the semiconductor chip package; and,

FIG. 8 is a bottom view of the semiconductor chip package.

Claims

The ornamental design for a semiconductor chip package, as shown and described.

Referenced Cited
U.S. Patent Documents
D345731 April 5, 1994 Owens et al.
5434357 July 18, 1995 Belcher et al.
5596231 January 21, 1997 Combs
5635670 June 3, 1997 Kubota et al.
D396847 August 11, 1998 Nakayama et al.
5798570 August 25, 1998 Watanabe et al.
5844307 December 1, 1998 Suzuki et al.
5959846 September 28, 1999 Noguchi et al.
6040625 March 21, 2000 Ip
D444132 June 26, 2001 Iwanishi et al.
Patent History
Patent number: D466873
Type: Grant
Filed: Oct 31, 2001
Date of Patent: Dec 10, 2002
Assignee: Siliconix Incorporated (Santa Clara, CA)
Inventors: Yehja Mohammed Kasem (Santa Clara, CA), Frank Kuo (Kaoshiung), Eddy Tjhia (Sunnyvale, CA)
Primary Examiner: Ted Shooman
Assistant Examiner: Selina Sikder
Attorney, Agent or Law Firm: Skjerven Morrill LLP
Application Number: 29/151,024
Classifications
Current U.S. Class: Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)
International Classification: 1303;