Semiconductor device

Description

FIG. 1 is a front, top and right side perspective view of a semiconductor device, showing our new design;

FIG. 2 is a front, bottom and right side perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a right side elevational view thereof;

FIG. 8 is a left side elevational view thereof;

FIG. 9 is a cross-sectional view thereof, taken along line 9—9 of FIG. 5, with the internal system omitted;

FIG. 10 is a cross-sectional view thereof, taken along line 10—10 of FIG. 5, with the internal system omitted;

FIG. 11 is a front, top and right side perspective view of a second embodiment of the semiconductor device, showing our new design;

FIG. 12 is a front, bottom and right side perspective view thereof;

FIG. 13 is a front elevational view thereof;

FIG. 14 is a rear elevational view thereof;

FIG. 15 is a top plan view thereof;

FIG. 16 is a bottom plan view thereof;

FIG. 17 is a right side elevational view thereof;

FIG. 18 is a left side elevational view thereof;

FIG. 19 is a cross-sectional view thereof, taken along line 19—19 of FIG. 15, with the internal system omitted; and,

FIG. 20 is a cross-sectional view thereof, taken along line 20—20 of FIG. 15, with the internal system omitted.

Claims

The ornamental design for a semiconductor device, as shown and described.