Wafer-boat for heat-processing of semiconductor wafers

Description

FIG. 1 is a perspective view of the wafer-boat for heat-processing of semiconductor wafers;

FIG. 2 is a front view thereof;

FIG. 3 is a back view thereof;

FIG. 4 is a top view thereof;

FIG. 5 is a bottom view thereof;

FIG. 6 is a left side view thereof. A right side view thereof is a mirror image thereto;

FIG. 7 is a reference drawing showing sectional views thereof;

FIG. 8 is a sectional view taken along line 8—8 in FIG. 7;

FIG. 9 is a sectional view taken along line 9—9 in FIG. 7;

FIG. 10 is a sectional view taken along line 10—10 in FIG. 7; and,

FIG. 11 is an enlarged sectional view taken along line 11—11 in FIG. 7.

Claims

The ornamental design for a wafer-boat for heat-processing of semiconductor wafers, as shown and described.