Wafer transfer apparatus

- Tokyo Electron Limited
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Description

FIG. 1 is a top view of the wafer transfer apparatus of the present design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a back elevational view thereof;

FIG. 4 is a bottom view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a left side view thereof;

FIG. 7 is a reference figure showing a perspective view seen from a back-left hand side of the apparatus;

FIG. 8 is a reference figure showing a top view seen from a back-left hand side of the apparatus;

FIG. 9 is a reference figure showing a perspective view seen from a front-right hand side of the apparatus;

FIG. 10 is a reference figure showing a perspective view seen from a back-right hand side of the apparatus;

FIG. 11 is a reference figure showing a right side view seen from a back side of the apparatus;

FIG. 12 is a reference figure showing a perspective view seen from the back-left hand side of the apparatus;

FIG. 13 is a reference figure showing a perspective view seen from a front-right hand side of the apparatus;

FIG. 14 is a reference figure showing a perspective view seen from the front-left hand side of the apparatus;

FIG. 15 is a reference figure showing a perspective view seen from a back-left hand side of the apparatus; and,

FIG. 16 is a reference figure showing a perspective view seen from a back-right hand side of the apparatus.

The broken line showing of wafers in some of the figures is included for the purpose of illustrating environment and forms no part of the claimed design.

Claims

We claim the ornamental design for a wafer transfer apparatus, as shown and described.

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Patent History
Patent number: D562524
Type: Grant
Filed: Jan 5, 2005
Date of Patent: Feb 19, 2008
Assignee: Tokyo Electron Limited (Tokyo)
Inventors: Tsutomu Hiroki (Yamanashi), Wataru Machiyama (Yamanashi), Takehiro Shindo (Yamanashi)
Primary Examiner: Cynthia E. Ramirez
Attorney: Smith, Gambrell & Russell, LLP
Application Number: 29/220,627