Groove formed around a semiconductor device on a circuit board

- Nitto Denko Corporation
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Description

FIG. 1 is a plan view of the groove formed around a semiconductor device on a circuit board showing our new design;

FIG. 2 shows an enlarged view of a claimed portion as identified by the area boxed by the dash-dot-dash line in FIG. 1; and,

FIG. 3 shows an enlarged sectional view along the line 3—3 in FIG. 2.

The broken lines represent unclaimed subject matter.

Claims

The ornamental design for a groove formed around a semiconductor device on a circuit board, as shown and described.

Referenced Cited
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Patent History
Patent number: D585394
Type: Grant
Filed: Apr 7, 2008
Date of Patent: Jan 27, 2009
Assignee: Nitto Denko Corporation (Osaka)
Inventors: Tetsuya Ohsawa (Osaka), Emiko Tani (Osaka)
Primary Examiner: Selina Sikder
Attorney: Osha • Liang LLP
Application Number: 29/306,335