Wafer boat

- Tokyo Electron Limited
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Description

FIG. 1 is a front view;

FIG. 2 is a partial enlarged perspective view of a bottom along 22 of the frontal view shown in FIG. 1;

FIG. 3 is an enlarged bottom view;

FIG. 4 is a rear view;

FIG. 5 is a left side view the right side being a mirror image thereof;

FIG. 6 is a plan view;

FIG. 7 is a bottom view; and,

FIG. 8 is a partial, enlarged view, along 22 of a front view shown in FIG. 1 of the wafer boat in use.

Salients are formed on a bottom board of a wafer boat to get into reentrants of a heat insulating cylinder for manufacturing a semiconductor wafer, and stabilize it in a setting condition. The portion shown in solid lines is my claimed design. The broken line showing in the figures is for illustrative purposes only and forms no part of the claimed design.

Claims

The ornamental design for a wafer boat, as shown and described.

Referenced Cited
U.S. Patent Documents
D411176 June 22, 1999 Shimazu
6110285 August 29, 2000 Kitazawa et al.
6163015 December 19, 2000 Moore et al.
6287112 September 11, 2001 Van Voorst Vader et al.
6454865 September 24, 2002 Goodman et al.
6536608 March 25, 2003 Buckley
6780251 August 24, 2004 Tometsuka
6811040 November 2, 2004 Payne et al.
6840767 January 11, 2005 Goodman
7207763 April 24, 2007 Lee
D580894 November 18, 2008 Sato
7455734 November 25, 2008 Yamaguchi et al.
20020187023 December 12, 2002 Araki
20070157886 July 12, 2007 Elgar et al.
20080041820 February 21, 2008 Tong et al.
Patent History
Patent number: D600222
Type: Grant
Filed: Sep 26, 2008
Date of Patent: Sep 15, 2009
Assignee: Tokyo Electron Limited (Tokyo)
Inventor: Izumi Sato (Oshu)
Primary Examiner: Selina Sikder
Attorney: Smith, Gambrell & Russell, LLP
Application Number: 29/309,701