Package for electronic device

- Infineon Technologies AG
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Description

FIG. 1 is a back view of a first embodiment of a package for electronic device of the present invention.

FIG. 2 is right side view thereof, the left side view being a mirror image;

FIG. 3 is a front view thereof.

FIG. 4 is a front-side perspective view thereof.

FIG. 5 is a front-end perspective view thereof.

FIG. 6 is a back-side perspective view thereof.

FIG. 7 is a back-side perspective view thereof.

FIG. 8 is a back view of a second embodiment of a package for electronic device of the present invention.

FIG. 9 is right side view thereof, the left side view being a mirror image;

FIG. 10 is a front view thereof.

FIG. 11 is a front-side perspective view thereof.

FIG. 12 is a front-end perspective view thereof.

FIG. 13 is a back-side perspective view thereof; and,

FIG. 14 is a back-side perspective view thereof.

Those portions of the package for electronic device shown in broken lines are included for illustrative purposes only and form no part of the claimed design.

Claims

The ornamental design for a package for electronic device, as shown and described.

Referenced Cited
U.S. Patent Documents
D513408 January 3, 2006 Suckle
D543155 May 22, 2007 Suckle
D543157 May 22, 2007 Suckle
D556134 November 27, 2007 Lee et al.
Patent History
Patent number: D609191
Type: Grant
Filed: Nov 14, 2008
Date of Patent: Feb 2, 2010
Assignee: Infineon Technologies AG (Neubiberg)
Inventors: Mario Feldvoss (Munich), Erich Griebl (Dorfen), Teck Sim Lee (Melaka), Juergen Schredl (Mering)
Primary Examiner: Nanda Bondade
Attorney: Dicke, Billig & Czaja, PLLC
Application Number: 29/327,873