Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers

- Tokyo Electron Limited
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Description

FIG. 1 is front perspective view of a heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers illustrating my new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a right side view thereof;

FIG. 5 is a left side view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof;

FIG. 8 is a cross-sectional view thereof taken through line 8—8 of FIG. 6;

FIG. 9 is a cross-sectional view thereof taken through line 9—9 of FIG. 6; and,

FIG. 10 is a front perspective view of a heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers in use.

The broken lines are shown for illustrative purposes only and form no part of the claimed design.

Claims

The ornamental design for a heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers, as shown and described.

Referenced Cited
U.S. Patent Documents
5421595 June 6, 1995 Cripe et al.
D404372 January 19, 1999 Ishii
6056123 May 2, 2000 Niemirowski et al.
6062853 May 16, 2000 Shimazu et al.
6110285 August 29, 2000 Kitazawa et al.
7033168 April 25, 2006 Gupta et al.
7484958 February 3, 2009 Kobayashi
D600220 September 15, 2009 Sato
20020113027 August 22, 2002 Minami et al.
Patent History
Patent number: D616392
Type: Grant
Filed: Sep 2, 2009
Date of Patent: May 25, 2010
Assignee: Tokyo Electron Limited (Minato-Ku)
Inventor: Izumi Sato (Oshu)
Primary Examiner: Selina Sikder
Attorney: Burr & Brown
Application Number: 29/342,852