Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
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Description
The broken lines are shown for illustrative purposes only and form no part of the claimed design.
Claims
The ornamental design for a heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers, as shown and described.
Referenced Cited
U.S. Patent Documents
Patent History
Patent number: D616393
Type: Grant
Filed: Sep 2, 2009
Date of Patent: May 25, 2010
Assignee: Tokyo Electron Limited (Minato-Ku)
Inventor: Izumi Sato (Oshu)
Primary Examiner: Selina Sikder
Attorney: Burr & Brown
Application Number: 29/342,853
Type: Grant
Filed: Sep 2, 2009
Date of Patent: May 25, 2010
Assignee: Tokyo Electron Limited (Minato-Ku)
Inventor: Izumi Sato (Oshu)
Primary Examiner: Selina Sikder
Attorney: Burr & Brown
Application Number: 29/342,853
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)