Electrical contact for use in a plating apparatus

- Ebara Corporation
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Description

FIG. 1 is a front view of an electrical contact for use in a plating apparatus showing our new design;

FIG. 2 is a right side elevation view thereof; the left side being a mirror image thereto,

FIG. 3 is a rear elevation view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a rear perspective view thereof; and,

FIG. 7 is a perspective view thereof, observed from below.

Claims

The ornamental design for an electrical contact for use in a plating apparatus, as shown and described.

Referenced Cited
U.S. Patent Documents
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3670298 June 1972 Klumpp, Jr.
5043528 August 27, 1991 Mohr
6534706 March 18, 2003 Rapp et al.
6830667 December 14, 2004 Yamamoto
7170013 January 30, 2007 Lewis
D555595 November 20, 2007 Yahagi et al.
D556692 December 4, 2007 Yahagi et al.
D569802 May 27, 2008 Long et al.
D578075 October 7, 2008 Yang
D624027 September 21, 2010 Huang et al.
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Foreign Patent Documents
2005-029863 February 2005 JP
Patent History
Patent number: D651178
Type: Grant
Filed: Feb 26, 2010
Date of Patent: Dec 27, 2011
Assignee: Ebara Corporation (Tokyo)
Inventors: Jumpei Fujikata (Tokyo), Yuji Araki (Tokyo)
Primary Examiner: Thomas Johannes
Attorney: Sughrue Mion, PLLC
Application Number: 29/356,550
Classifications
Current U.S. Class: Ring Or Spade Lug (D13/148)